KR101992987B1 - Fluid spray apparatus using pulse signal - Google Patents

Abstract

A fluid ejection apparatus using a pulse signal according to an embodiment of the present invention includes a nozzle unit for ejecting fluid onto a substrate, at least one fluid supply unit for supplying fluid to the nozzle unit, And the fluid may be discontinuously ejected from the nozzle portion corresponding to the opening and closing of the valve.

Description

[0001] FLUID SPRAY APPARATUS USING PULSE SIGNAL [0002]

The present invention relates to a fluid ejection apparatus using a pulse signal.

In order to manufacture a semiconductor device, a multilayer thin film is formed on a semiconductor substrate or a display substrate, and etching and cleaning processes are generally adopted for thin film formation. In the etching and cleaning processes, a thin film such as a nitride film deposited on the back surface of the substrate and particles act as a foreign substance in a subsequent process. Such unnecessary foreign matters such as thin films on the back surface of the substrate are removed using a substrate cleaning apparatus.

In particular, the cleaning process removes small particles, contaminants and unnecessary film remaining on the surface of the semiconductor substrate when performing these unit processes. In recent years, as the pattern formed on the semiconductor substrate has become finer, the importance of the cleaning process has increased.

Such a cleaning process includes a chemical solution treatment process for etching or removing contaminants on a semiconductor substrate by a chemical reaction, a rinsing process for cleaning a semiconductor wafer treated with a chemical solution by a chemical solution treatment process with pure water (DIW) And a drying step of drying the processed semiconductor wafer.

Generally, in the chemical solution treatment process, a nozzle for supplying a chemical liquid is disposed on an upper portion of a semiconductor substrate, and a nozzle cleans the semiconductor substrate by spraying a chemical solution on an upper surface of the semiconductor substrate. Such a chemical solution treatment process can cause environmental pollution in accordance with the used chemical solution, and a process for preventing environmental pollution is required, so that the cleaning cost is often high.

On the other hand, a technique for cleaning a semiconductor substrate without using such a chemical solution has been developed. For example, a technique has been developed in which a fluid containing pure water and steam is injected into a semiconductor substrate to clean the washing surface.

A fluid cleaning apparatus uses a nozzle to spray a fluid, particularly steam, onto a substrate to clean the substrate. At this time, the nozzle is a structure that linearly or rotates and moves over the substrate to eject the fluid. At this time, the fluid is continuously supplied to the nozzle portion and sprayed onto the substrate while the substrate cleaning is proceeding, and the supply of the fluid is terminated when the substrate cleaning is completed.

If the fluid is continuously supplied while the substrate cleaning is proceeding, more fluid can be further supplied without first removing the fluid supplied between the patterns. Time is required for the fluid to be discharged out of the substrate, especially between the patterns, after the fluid is sprayed onto the substrate. However, if the fluid is continuously sprayed onto the substrate without the previously supplied fluid being discharged between the patterns, contaminants existing between the patterns are not removed. Further, the fluid already existing between the patterns is not exhausted but acts as a protective film, so that the further supplied fluid can not exhaust the force to the substrate but is exhausted as it is. Therefore, the particles present on the substrate can not be properly removed and remain.

SUMMARY OF THE INVENTION An object of the present invention is to provide a fluid ejection device using a pulse signal capable of increasing the force of fluid and improving the cleaning power by controlling the supply time of the fluid by using the pulse signal.

According to an aspect of the present invention, there is provided a fluid ejection apparatus using a pulse signal according to an embodiment of the present invention. The fluid ejection apparatus includes a nozzle unit that ejects fluid onto a substrate, at least one fluid supply unit that supplies the fluid to the nozzle unit, And at least one valve positioned on a supply path of the fluid injected from the supply unit through the nozzle unit, wherein the fluid may be discontinuously ejected from the nozzle unit corresponding to opening and closing of the valve.

The controller may further include a controller for controlling opening and closing of the valve, wherein the controller includes: a pulse signal generator for generating a pulse signal; and a controller for controlling the opening and closing of the valve according to the pulse signal generated by the pulse signal generator And a driving signal generator for generating a driving signal for controlling the driving signal.

The control unit may further include a control unit for controlling opening and closing of the valve, wherein the control unit includes a pulse signal generating unit for generating a pulse signal, and the valve is connected to the pulse signal generated by the pulse signal generating unit Can then be opened or closed.

In an embodiment, the valve can be controlled to be opened and closed alternately by the control portion.

In an embodiment, the opening time and the closing time can be adjusted by the control unit.

In an embodiment, the valve comprises a first valve selectively containing the heated liquid or gas supplied from the heating fluid supply, the compressed air being supplied from the compressed dry air supply, A second valve, and a third valve selectively containing pure water supplied from the pure water supply portion, wherein at least one of the first, second and third valves can be controlled to be opened and closed.

In an embodiment, the fluid may comprise at least one of heated liquid, gas, pure water and compressed dry air.

In an embodiment, the fluid includes steam, and the substrate may be cleaned by the steam sprayed through the nozzle portion.

In an embodiment, the apparatus may further include a suction unit for sucking at least one of a part of the fluid jetted onto the substrate and a contaminant removed from the substrate.

In an embodiment, the valve may be provided at least one position between the fluid supply unit and the nozzle unit, the front end of the nozzle unit, and the nozzle unit.

The controller may further include a force sensing unit for sensing a force of the fluid ejected from the nozzle unit. The controller may feedback control the valve using the force of the fluid sensed by the force sensing unit have.

In an embodiment, the impact sensing unit may include an optical sensor.

The effect of the fluid ejecting apparatus using the pulse signal of the pulse signal according to the present invention will be described as follows.

According to at least one of the embodiments of the present invention, the pulse signal is used to control the valve so as to prevent the fluid from being continuously injected, thereby increasing the force of the injected fluid and improving the cleaning power.

Also, according to at least one of the embodiments of the present invention, the injection time of the fluid can be adjusted by using the pulse signal.

1 is a view illustrating a substrate cleaning system using a fluid ejecting apparatus using a pulse signal according to a preferred embodiment of the present invention.
2 is a view illustrating a process of continuously opening and closing a valve according to a pulse signal in a fluid injection device according to a preferred embodiment of the present invention.
3 is a view illustrating a substrate cleaning system using a fluid injection device using a pulse signal according to another preferred embodiment of the present invention.
4 is a view illustrating a substrate cleaning system using a fluid ejecting apparatus using a pulse signal according to another preferred embodiment of the present invention.
5 is a view illustrating a substrate cleaning system using a fluid injection device using a pulse signal according to another embodiment of the present invention.
6 is a view illustrating a substrate cleaning system using a fluid injection device using a pulse signal according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, wherein like reference numerals are used to designate identical or similar elements, and redundant description thereof will be omitted. The suffix "module" and " part "for the components used in the following description are given or mixed in consideration of ease of specification, and do not have their own meaning or role. In the following description of the embodiments of the present invention, a detailed description of related arts will be omitted when it is determined that the gist of the embodiments disclosed herein may be blurred. It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. , ≪ / RTI > equivalents, and alternatives.

Terms including ordinals, such as first, second, etc., may be used to describe various elements, but the elements are not limited to these terms. The terms are used only for the purpose of distinguishing one component from another.

It is to be understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, . On the other hand, when an element is referred to as being "directly connected" or "directly connected" to another element, it should be understood that there are no other elements in between.

The singular expressions include plural expressions unless the context clearly dictates otherwise.

In the present application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a component, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. It will be apparent to those skilled in the art that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof.

1 is a view illustrating a substrate cleaning system using a fluid ejecting apparatus using a pulse signal according to a preferred embodiment of the present invention.

Referring to FIG. 1, a substrate cleaning system 100 may include a chamber 110, a nozzle unit 112, a fluid supply unit 120, and a controller 130.

The chamber 110 serves as a substrate support for supporting the substrate 116 therein and may include a substrate transfer module 118 for transferring the substrate. The inside of the chamber 110 has a hollow space, and a cleaning process for cleaning the substrate 116 in the internal space can be performed. The substrate 116 may be a wafer or a large-area glass as an object for performing a cleaning process. The substrate transfer module 118 is configured to fix or move the substrate 116 inside the chamber 110. In the present invention, a method of transferring a substrate using a roller is shown. The chamber 110 includes an exhaust port 117 for discharging contaminants (particles) generated by the cleaning of the substrate 116 to the outside together with the liquid or gas injected into the chamber 110. The exhaust port 117 can be connected to the pump 119 to discharge the contaminants after cleaning the substrate 116 to the outside.

The nozzle unit 112 is configured to receive the fluid from the fluid supply module and inject the fluid to the substrate 116. The injection port of the nozzle unit 112 may be formed in a linear shape so as to move in the lateral direction or the longitudinal direction of the substrate 116 and spray the fluid to clean the substrate 116. Or the nozzle orifice of the nozzle portion 112 may be formed in a spot shape to move over the substrate 116 and spray the fluid to clean the substrate 116. [

The nozzle portion 112 may further include a suction portion 114 for sucking the particles separated by the fluid and the fluid injected into the substrate 116. The suction portion 114 may be connected to the pump 115 to suck at least one of a part of the fluid jetted onto the substrate 116 and the contaminant removed from the substrate 116. The fluid and particles sucked through the suction part 114 may be connected to the exhaust port 117 or may be connected to a separate exhaust port and immediately discarded. Alternatively, the fluid from which the particles have been removed can be reused.

 The fluid supply unit 120 may include a heating fluid generating unit, which is configured to supply fluid to the nozzle unit 112. The heating fluid generating section may heat the fluid to supply heated fluid, including gas or liquid (which may include steam), to the nozzle section 112. The heating fluid generating portion may preferably generate pure steam by heating the pure water. Steam contains latent heat. The fluid is preferably capable of heating the deionizewater (DIW) to produce a heated fluid. The pure water may include at least one of deionized water (DIW) and ultrapure water (UPW). The heating fluid generating portion may include various devices capable of supplying heated fluid including steam.

And may include at least one intermittent valve located on the supply path of the fluid injected from the fluid supply unit 120 through the nozzle unit 112. In one embodiment, A valve 122 may be provided. When the valve 122 is opened, the heated fluid generated in the fluid supply part 120 can be supplied to the nozzle part 112. When the valve 122 is closed, the heated fluid generated in the fluid supply part 120 can be blocked from being supplied to the nozzle part 112. The valve 122 may be driven according to a control signal of the controller 130.

The controller 130 may control the operation of the overall configuration of the fluid ejection apparatus for ejecting fluid from the substrate cleaning system 100 to the substrate. The controller 130 may include a pulse signal generator 134 and a drive signal generator 132.

The pulse signal generating unit 134 may generate a pulse signal for controlling the valve 122. [ The generated pulse signal is transmitted to the driving signal generating unit 132, and the driving signal generating unit 132 generates a signal for controlling the driving of the valve 122. Here, the driving signal is a signal for opening and closing the valve 122, and the valve 122 can be opened and closed according to the pulse signal transmitted from the pulse signal generating unit 134. Since the valve 122 is opened or closed according to the pulse signal, the supply time of the fluid can be controlled. By opening or closing the valve 122 for one pulse period, the fluid supply can be regulated.

In another embodiment, the drive signal generator 132 may be included in the valve 122. The driving signal generating unit 132 may generate a driving signal according to the pulse signal transmitted from the pulse signal generating unit 134 to control the opening and closing of the valve 122. In another embodiment, the valve 122 can be opened and closed by receiving the pulse signal transmitted from the pulse signal generator 134 directly.

While the general substrate cleaning process is in progress, the fluid is continuously sprayed onto the substrate without controlling the valve. There has been a problem in that the fluid continues to be ejected onto the substrate, so that the fluid remains on the substrate, and the contaminants are not properly removed in this state. And there is also a problem that the impact force of the fluid continuously supplied by the fluid remaining on the substrate is lowered.

However, the present invention can control the injection time of the fluid by controlling the opening and closing of the valve 122 using the pulse signal generated by the pulse signal generating unit 134. In particular, the valve 122 can be opened and closed alternately by the pulse signal of the control unit 130. [ Therefore, since the fluid is discontinuously supplied to the nozzle unit 112, the fluid can be jetted discontinuously from the nozzle unit 112. [

Specifically, the contaminants present in the substrate 116 are separated from the substrate 116 by the fluid while the valve 122 is opened and fluid is ejected from the nozzle portion 112. The separated contaminants and ejected fluid on the substrate 116 may then be exhausted out of the substrate 116 while the valve 122 is closed and no fluid is ejected from the nozzle portion 112. After the contaminants and fluid have been evacuated out of the substrate 116, the valve 122 may again open and fluid may be ejected onto the substrate 116. The time at which the fluid is injected to the substrate 116 and the time at which the fluid is not injected are alternately arranged, thereby securing the time at which the fluid can be exhausted from the substrate 116 in the middle. In other words, preferably, the valve 122 can be repeatedly opened and closed by the pulse signal. By controlling the opening and closing of the valve 122 by the pulse signal in this way, it is possible to secure the time for the fluid to be exhausted from the substrate 116, thereby increasing the impact force of the fluid and improving the cleaning power.

The substrate cleaning system 100 according to the present invention may include a compressed air supply 140. The compressed dry air supply unit 140 is connected to a supply pipe for supplying a fluid (steam containing gas or liquid) heated by the nozzle unit 112 or the nozzle unit 112 to generate compressed dry air (CDA) Can be supplied. The heated gas or liquid supplied to the nozzle portion 112 may be mixed with the compressed dry air and sprayed onto the substrate 116. Compressed dry air may be an optimum compressed air in which contaminants such as dust, oil, water, etc. contained in compressed air are removed to a reference value based on the required degree. A valve 142 may be provided between the nozzle unit 112 and the compressed dry air supply unit 140.

The substrate cleaning system according to the present invention may include a pure water supply unit 150. The pure water supply unit 150 may be connected to a supply pipe for supplying a fluid (steam containing gas or liquid) heated by the nozzle unit 112 or the nozzle unit 112 to supply pure water. Pure water can be mixed with the fluid (steam) supplied from the nozzle unit 112 to transmit the impact force to the substrate 116. Or the heated gas or liquid supplied to the nozzle portion 112 may be mixed with the pure water and sprayed onto the substrate 116. The pure water may include at least one of deionized water (DIW) and ultrapure water (UPW). A valve 152 may be provided between the nozzle unit 112 and the pure water supply unit 150.

The fluid ejected through the nozzle portion 112 may be a heated gas or liquid (preferably including steam) mixed with both compressed dry air and pure water. Or the nozzle portion 112 may include at least one of heated gas, liquid, compressed dry air, and pure water.

The controller 130 can control the valves 142 and 152 by the generated pulse signals and driving signals. The valve 142 can be opened and closed by the pulse signal and the driving signal to control the supply of the compressed dry air. Further, the valve 152 is opened and closed by the pulse signal and the driving signal, so that the supply of pure water can be controlled.

Here, the three valves 122, 142 and 152 can be simultaneously opened and closed by the same pulse signal and drive signal. Or at least one of the three valves 122, 142 and 152 can be simultaneously opened and closed by the same pulse signal and drive signal, and the remaining valve can be opened and closed by another pulse signal and drive signal, The supply timing of dry air and pure water can be adjusted.

At least one of the three valves 122, 142 and 152 (hereinafter referred to as the first valve 122, the second valve 142 and the third valve 152) is controlled by a pulse signal and a drive signal .

The type of the fluid jetted onto the substrate 116 must be adjusted according to the type of the cleaning process. For example, the controller 130 may alternately control opening and closing of the first valve 122 and closing the remaining second and third valves 142 and 152 using the pulse signal and the driving signal. Only the heated fluid generated in the fluid supply part 120 through the nozzle part 112 can be injected into the substrate 116. [

Alternatively, the control unit 130 may alternately control the opening and closing of the second valve 142 using the pulse signal and the driving signal, and may close the remaining first and third valves 122 and 152. Then, only the compressed dry air supplied from the compressed dry air supply unit 140 through the nozzle unit 112 can be sprayed onto the substrate 116.

Alternatively, the control unit 130 may alternately control the opening and closing of the third valve 152 and may close the first and second valves 122 and 142 using the pulse signal and the driving signal. Only the pure water supplied from the pure water supply unit 150 through the nozzle unit 112 can be sprayed onto the substrate 116.

Alternatively, the control unit 130 may alternately control the opening and closing of the first and second valves 122 and 142 using the pulse signal and the driving signal, and may close the third valve. Then, the fluid heated through the nozzle unit 112 and the compressed dry air may be mixed and sprayed onto the substrate 116.

Alternatively, the control unit 130 may alternately control the opening and closing of the first and third valves 122 and 152 using the pulse signal and the driving signal, and may close the second valve. Then, the fluid heated through the nozzle unit 112 and the pure water may be mixed and sprayed onto the substrate 116.

Alternatively, the control unit 130 may alternately control opening and closing of the second and third valves 142 and 152 using the pulse signal and the driving signal, and the first valve may be closed. Then, compressed dry air and pure water may be mixed through the nozzle unit 112 and sprayed onto the substrate 116.

Alternatively, the control unit 130 may alternately control the opening and closing of the first, second, and third valves 122, 142, and 152 using the pulse signal and the driving signal. Then, the heated fluid, compressed dry air, and pure water may be mixed through the nozzle unit 112 and sprayed onto the substrate 116.

The substrate cleaning system according to the present invention may include a force sensing unit for sensing the force of fluid ejected from the nozzle unit 112. The force sensing unit senses a force (force) that the fluid ejected from the nozzle unit 112 is ejected onto the substrate 116, and can transmit the force to the control unit 130. The impact sensing unit may be provided inside the chamber 110, and particularly, may be disposed at a position adjacent to a front end (a portion to which the fluid is injected) from which the fluid is injected from the nozzle unit 112.

The controller 130 may feedback-control opening and closing of the first, second, and third valves 122, 142, and 152 according to the sensed force. The controller 130 may control opening and closing of the first, second, and third valves 122, 142, and 152 simultaneously or using a pulse signal and a driving signal so that the first, second, and third valves 122, 142, Also, the controller 130 may control to open / close at least one of the first, second, and third valves 122, 142, and 152.

Particularly, the impact sensing unit may be an optical sensor. An optical sensor refers to a sensor that senses an object by using the light emitted from the light emitting element 172 and the light received by the light receiving element 174 using the light emitting element 172 and the light receiving element 174. [ The light emitting element 172 and the light receiving element 174 in the present invention may be positioned with the fluid injected from the nozzle portion 112 interposed therebetween. The light emitting element 172 and the light receiving element 174 may be driven by a control signal of the controller 130. [

It is possible to check the injection amount of the fluid ejected from the nozzle unit 112 by using the light receiving amount measured by the light receiving element 174 and measure the impact force of the fluid through the injection amount of the fluid. For example, when the amount of received light received by the light receiving element 174 is reduced, the injection amount of the fluid ejected from the nozzle portion 112 is increased. Therefore, the driving force of the fluid ejected from the nozzle unit 112 can be measured in proportion to the ejection amount of the fluid. The control unit 130 may feedback-control the valve using the measured force of the fluid.

The light emitting element 172 and the light receiving element 174 are adjacent to a front end portion where the fluid is ejected from the nozzle portion 112 Lt; / RTI > When the fluid is jetted from the nozzle unit 112, the controller 130 drives the light emitting element 172 and the light receiving element 174 to measure the amount of light received. The control unit 130 may synchronize the timing at which the fluid is ejected from the nozzle unit 112 with the timing at which the light emitting element 172 and the light receiving element 174 are driven.

In order to measure the driving force of the fluid, the driving time of the light emitting element 172 and the light receiving element 174 is preferably kept constant. It is possible to measure the amount of fluid to be injected during the same time and to measure the force of the fluid using the amount of the injected fluid.

2 is a view illustrating a process of continuously opening and closing a valve according to a pulse signal in a fluid injection device according to a preferred embodiment of the present invention.

Referring to FIG. 2, the opening / closing time of the valves 122, 142 and 152 can be controlled by adjusting the width or cycle (Hz) of the pulse signal. For example, the controller 130 may control the valves 122, 142, and 152 to be turned on and off repeatedly in units of 0.1 second. Or the control unit 130 can repeatedly control the valve 122, 142, 152 to open for 0.2 second and the valve 122, 142, 152 to be closed for 0.1 second. When the valves 122, 142 and 152 are opened, fluid can be supplied to the nozzle part 112 and sprayed onto the substrate 116. When the valves 122, 142 and 152 are closed, The fluid is not supplied and is not sprayed onto the substrate 116. The supply time of the fluid and the fluid injection amount can be adjusted by adjusting the time at which the valves 122, 142, 152 are opened.

Also, the valves 122, 142, 152 may be controlled individually or simultaneously. As described above, the opening and closing times of the valves 122, 142 and 152 and the fluid injection amount can be variously adjusted by using the pulse signal.

3 is a view illustrating a substrate cleaning system using a fluid injection device using a pulse signal according to another preferred embodiment of the present invention.

Referring to FIG. 3, the substrate cleaning system 300 may include a nozzle portion 312 or a gas supply portion 360 connected to a fluid supply line supplied to the nozzle portion 312. The gas supply unit 360 can supply the gas necessary for cleaning the substrate. The gas supplied from the gas supply unit 360 may be mixed with at least one of the heated fluid, the compressed dry air, and the pure water and sprayed onto the substrate 316.

A valve 362 may be provided between the gas supply unit 360 and the nozzle unit 312. The valve 362 may be opened or closed by a pulse signal and a driving signal generated by the control unit 330. The control method of the valve 362 based on the pulse signal and the drive signal has been described in detail above, and therefore will not be described.

Other configurations except for the gas supply part 360 and the valve 362 are the same as those of the substrate cleaning system of Fig. Therefore, detailed description is omitted in FIG.

4 is a view illustrating a substrate cleaning system using a fluid ejecting apparatus using a pulse signal according to another preferred embodiment of the present invention.

Referring to FIG. 4, the substrate cleaning system may include a plurality of fluid supplies 422, 424, 426. A plurality of fluid supply portions 422, 424, and 426 may be connected to the nozzle portion 412 to supply the fluid to the nozzle portion 412, respectively. At this time, a plurality of valves 423, 425, and 427 may be provided between the plurality of fluid supply units 422, 424, and 426 and the nozzle unit 412, respectively. The control unit 430 can control the opening and closing of the plurality of valves 423, 425, and 427, respectively. As described above, the control unit 430 can control the opening and closing of the plurality of valves 423, 425, and 427 using the pulse signal.

In one embodiment, the plurality of fluid supply portions 422, 424, and 426 may supply the same fluid and may supply different fluids. The supply of the fluid supplied from the plurality of fluid supply units 422, 424 and 426 to the nozzle unit 412 can be controlled by opening and closing the plurality of valves 423, 425 and 427 under the control of the control unit 430 . At least one or more of the valves 423, 425, and 427 may be controlled by the controller 430. Also, the plurality of valves 423, 425, and 427 may be controlled by the same pulse signal or may be controlled by different pulse signals.

The plurality of valves 423, 425 and 427 may be opened or closed for the same time or may be opened or closed for different times. The nozzle unit 412 may further include a suction unit 414. 4 except for the plurality of fluid supply portions 422, 424, and 426 and the plurality of valves 423, 425, and 427 are the same as those shown in FIG. 1, detailed description will be omitted.

5 is a view illustrating a substrate cleaning system using a fluid injection device using a pulse signal according to another embodiment of the present invention.

5, a valve 527 may be provided at a front end portion of the nozzle portion 512 (a portion of the fluid to be sprayed opposite to the substrate) for controlling the injection amount of fluid ejected through the nozzle portion 512 . The valve 527 can be controlled to open and close by the pulse signal of the control unit 530. When the valve 527 is opened by the control unit 530, the fluid supplied to the nozzle unit 512 through the fluid supply unit 520 may be injected into the substrate 116. When the valve 527 is closed by the control unit 530, the fluid supplied to the nozzle unit 512 through the fluid supply unit 520 is not sprayed onto the substrate 116. The control unit 530 controls the opening and closing of the valve 522 to control the supply of the fluid to the nozzle unit 512 in the fluid supply unit 520 and to control the opening and closing of the valve 527, As shown in FIG. The nozzle unit 512 may further include a suction unit 514.

In another embodiment, a valve 528 may be provided within the nozzle portion 512. The valve 528 is controlled by the control unit 530 to control the injection amount of the fluid ejected onto the substrate 116. The control unit 530 may control the opening and closing of the valve 522 to control the supply of the fluid to the nozzle unit 512 in the fluid supply unit 520.

In another embodiment, valves 527 and 528 may be provided at the front end of the nozzle unit 512 and inside the nozzle unit 512. The control unit 530 may control the opening and closing of the valves 527 and 528 with the same pulse signal or different pulse signals. The control unit 530 may control the opening and closing of the valve 522 to control the supply of the fluid to the nozzle unit 512 in the fluid supply unit 520.

6 is a view illustrating a substrate cleaning system using a fluid injection device using a pulse signal according to another embodiment of the present invention.

Referring to FIG. 6, the substrate cleaning system may include valves 627 and 628 at the front end of the nozzle unit 612 and inside the nozzle unit 612. And a plurality of valves 623, 624, 626 for controlling the supply of the fluid supplied to the nozzle unit 612 from the plurality of fluid supply units 622, 624, 626, 625, and 627 may be provided. The valves 622, 624, 626, 627 and 628 can be controlled to be opened or closed by a pulse signal transmitted from the control unit 630. The control unit 630 may control the opening and closing of the valves 622, 624, 626, 627 and 628 with the same pulse signal or different pulse signals.

The foregoing detailed description should not be construed in any way as being restrictive and should be considered illustrative. The scope of the present invention should be determined by rational interpretation of the appended claims, and all changes within the scope of equivalents of the present invention are included in the scope of the present invention.

Claims (12)

A nozzle unit for spraying the fluid onto the substrate;
At least one fluid supply portion for supplying fluid to the nozzle portion; And
And at least one valve positioned on a supply path of the fluid injected from the fluid supply part through the nozzle part,
The fluid is discontinuously jetted at the nozzle portion corresponding to the opening and closing of the valve,
Further comprising a control unit for controlling opening and closing of the valve,
Wherein,
And a pulse signal generator for generating a pulse signal,
Wherein the valve comprises:
The pulse signal being generated by the pulse signal generator, the pulse signal being opened or closed,
Further comprising a force sensing unit for sensing a force of the fluid ejected from the nozzle unit,
Wherein,
Feedback control of the valve using the force of the fluid sensed by the force sensing unit,
Wherein the hit-
Optical sensors,
The optical sensor includes:
And a light emitting element and a light receiving element provided between the fluid ejected from the nozzle unit,
Wherein the light emitting element emits light toward the ejected fluid, and the light receiving element uses a pulse signal that receives light emitted from the light emitting element.
The method according to claim 1,
Wherein,
And a drive signal generator for generating a drive signal for controlling the opening and closing of the valve in accordance with the pulse signal generated by the pulse signal generator.
delete The method according to claim 1,
Wherein the valve comprises:
Wherein the controller uses the pulse signal whose opening and closing are alternately controlled.
5. The method of claim 4,
Wherein the valve comprises:
Wherein the pulse signal is adjusted by the control unit so that the time of opening and the time of closing of the fluid are adjusted.
The method according to claim 1,
Wherein the valve comprises:
A first valve for selectively introducing the heated liquid or gas supplied from the heating fluid supply portion into the fluid;
A second valve for selectively containing compressed dry air supplied from the compressed dry air supply unit into the fluid; And
And a third valve selectively incorporating pure water supplied from the pure supply section into the fluid,
Wherein at least one of the first, second,
A fluid ejection apparatus using a pulse signal whose opening and closing are controlled.
The method of claim 6,
The fluid may comprise,
And a pulse signal including at least one of a heated liquid, gas, pure water, and compressed dry air.
The method according to claim 1,
The fluid may comprise,
Steam,
And a pulse signal from which the substrate is cleaned by the steam injected through the nozzle unit.
The method according to claim 1,
Further comprising a suction portion for sucking at least one of a part of the fluid ejected to the substrate and a contaminant removed from the substrate.
The method according to claim 1,
Wherein the valve comprises:
Wherein a pulse signal is provided between at least one of the fluid supply unit and the nozzle unit, the front end of the nozzle unit, and the nozzle unit.
delete delete

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