TW200421071A - Method to combine heat-conduction pipe with heat-conduction base - Google Patents

Abstract

A method to combine heat-conduction pipe with heat-conduction base is disclosed, wherein a hole corresponding to the outer diameter of the heat-conduction pipe is installed on the heat-conduction base, then the heat-conduction pipe is embedded into the hole, and the heat conduction base is applied force externally to deform the heat-conduction base and the heat-conduction pipe at the same time, so that the external surface of the heat-conduction pipe is further combined with the inner diameter of the heat-conduction base tightly.

Description

200421071 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a component of a heat dissipation module applied to information or communication products, particularly a method for bonding a heat conducting base and a heat conducting pipe. [Previous technology] At present, most of the heat dissipation devices used in the industry for computer central processing units (CPUs) or high-heat source products use the base of the heat sink made of metal with high heat transfer efficiency to contact the heat source to transfer heat. It is absorbed and transferred to the fins of the heat sink, and the fan is used to blow out cold air to dissipate the heat on the heat sink. This method has its effect on the small heat generated by the small CPU, but it cannot effectively and quickly achieve the heat dissipation effect on the large amount of heat generated by the large CPU with faster and faster operation speed. The reason is that the heat sink is There is a distance between the metal base and the end of the heat sink fin. Since only the base is in contact with the heat sink and the heat source (CPU), the heat absorbed by the base cannot be quickly transferred to the end of the heat sink fin, and heat is dissipated. The heat absorbed by the root and the end of the fin is not the same; in other words, the more heat absorbed by the root of the fin closer to the base, and the less heat absorbed by the end of the fin further away from the base, so As a result, the heat dissipation fin with limited area can only use its part close to the metal base to dissipate heat. Therefore, the heat dissipation efficiency of the aforementioned traditional heat sink cannot really keep up with the rapidly developing CPU computing efficiency or the demand for heat dissipation of high heat source products. Based on the foregoing reasons, the inventor of the present case has developed a heat conducting base combined with a heat conducting tube. The manufactured heat conducting base can be further combined with fins to become a component with heat conduction and heat dissipation effects; Heat sink

200421071 V. Description of the invention (2) Fast heat absorption effect. The side is traditionally drilled out of the hole first. Because the conduction is completely smooth, both the conductive heat pipe and the hole are coated in the hole. The medium has an excellent resistance. Because the conduction medium will be further reduced when applied to the heat conduction. Quickly conduct to the fins to increase the heat dissipation area and improve the heat dissipation of the heat pipe through or through the heat pipe. The heat conduction glue and holes are different from each other. For example, a good pipe is connected to the impervious surface and the solder paste is inserted into the pipe. The thermal properties of the gap must be chosen; after the holes of the heat conductive base are made, before the holes of the heat conductive base, or the heat conductive paste, etc. However, though, after all, the use of a medium is a time-consuming and cumbersome method. The inner surface of the hole in the heat pipe must be guided by the medium first. As a result, the heat conductive glue and the medium still fill the heat conduction base for the two components. , So that the implantation of the hole into a thermally conductive base will not be a hole between a heat pipe and a heat transfer medium such as solder paste filled with the medium. The invention can no longer be described. The invention mainly solves the troubles caused by the fact that the heat conduction medium must be filled between the hole of the heat conduction base and the heat pipe when the traditional heat conduction base is combined with the heat pipe, and the medium forms a heat conduction resistance body and cannot further improve the heat transfer. Lack of efficiency. "Technical means to solve the problem" The main feature of the present invention is that the heat conducting base is first provided with a hole corresponding to the outer diameter of the heat pipe, and then the heat pipe is implanted into the hole, and then the heat conducting base is

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200421071 V. Description of the invention (3) The external deformation of the heat-conducting base and the heat-conducting pipe caused by the application of an external force causes the outer surface of the heat-conducting pipe to be tightly combined with the inner diameter of the hole of the heat-conducting base. "Effects of the prior art" Compared with the prior art, the present invention does not need to use a thermally conductive glue, solder paste, thermally conductive paste and other media as the thermal interface between the thermal pipe and the thermal base, so it can be used in the shortest time. The heat conduction officer is combined with the heat conduction base, and the combination is very tight, which can further improve the heat conduction efficiency, and the production is easier, the manufacturing cost is reduced, and it has more excellent economy. [Embodiment] As shown in the first figure, the present invention is a method for combining a heat conducting tube 2 and a heat conducting base 1. The heat conducting base 1 is made of a metal material with good heat conducting properties. The seat 1 can be provided with a hole 10 corresponding to the outer diameter of the heat pipe 2 by drilling or extrusion. The hole 10 can be a through hole or an impenetrable blind hole. In addition, the hole 1 0 Preferably, it corresponds to the shape of the heat transfer tube 2. For example, when the cross section of the heat transfer tube 2 is circular, the hole 10 is preferably circular. When the cross section of the heat transfer tube 2 is non-circular, the hole 1 0 is also preferably corresponding to a non-circular shape, so that a good fit is obtained when the heat pipe 2 is implanted into the hole. After the heat pipe 2 is implanted into the hole 10, a strong external force is then applied to the heat conduction base 1 by the machine, such as punching with a punch or pressing with a press, which can deform the heat conduction base and cause thickness. Thin. As shown in the second figure, when the heat conduction base 1 is thinned by an external force, the heat conduction pipe 2 is also deformed by being squeezed at the same time. During the deformation process of the heat conduction pipe 2, the surface material of the heat conduction pipe 2 will be squeezed into the hole. Hole 10 inner diameter surface

200421071 5. In the gap of the description of the invention (4), the purpose of tightly combining the heat pipe with the hole is achieved. The upper surface of the heat conducting base combined with the heat conducting tube can be used as the heat conducting element 5 or a fin can be provided on the heat conducting base as a heat dissipation module. The heat-conducting pipe 2 may be a heat-conducting superconducting pipe, which is made of a hollow metal pipe body that can be freely bent or deformed, and is filled with a material having high-speed heat-conducting performance inside; the material having high-speed heat-conducting performance may be the following Several options: 1. Inorganic high-temperature superconducting compound materials, such as: yttrium barium copper oxide (YBC0) superconducting materials, iridium barium calcium copper oxide compounds (TBCC0) superconducting materials, mercury barium calcium copper oxide compounds (HBCC0) superconducting materials Conductive material, bismuth gill calcium copper oxide (BSCC0) superconducting material, or other inorganic superconducting materials. 2. Organic superconducting materials, such as pure water or other organic superconducting materials. 3. Other materials that can achieve high-speed thermal conductivity. The application principle of the inorganic high superconducting material is to use the high-speed vibration and friction generated when the molecules in the tube and the body are heated, so that the thermal energy can fluctuate quickly. The heat transfer is fast; the organic high-temperature superconducting material, its application The principle is based on the use of phase changes generated when the molecules of the liquid in the body are heated by the metal tube to rapidly transfer heat. Because the transfer speed is very fast, it is called "heat-conducting super-conductor and body". The transmission time from the cold end to the cold end is very short, so the temperature difference between the hot end and the cold end is small, which can achieve the best thermal conductivity. It is confirmed by experiments that the heat transfer rate is about five times that of copper, and more than ten times faster than that of ordinary aluminum metals. The above are only used to explain the preferred embodiments of the present invention, and are not intended to limit the present invention in any form. Therefore, any

200421071

200421071 Brief Description of the Drawings The first figure is a plan sectional view showing that a circular heat pipe is inserted into a circular hole of a heat conduction base according to the present invention. The second figure is a plan cross-sectional view showing that the heat-conducting base implanted in the heat-conducting tube of the present invention is deformed by applying an external force, and the heat-conducting tube is also deformed to be tightly integrated in the hole. [Explanation of component symbols] (1) heat conduction base (1 0) hole (2) heat conduction pipe

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Claims (1)

200421071 6. Scope of patent application 1. A method for combining a heat pipe and a heat conducting base. A hole corresponding to the outer diameter of the heat pipe is set in the heat pipe, the heat pipe is implanted into the hole, and then the heat conducting base An external force is applied to deform both the heat conducting base and the heat conducting tube, so that the heat conducting tube is tightly combined with the hole. 2 β According to the method of combining a heat conducting tube and a heat conducting base described in item 1 of the scope of the patent application, the hole provided may be a through hole. 3. According to the method of combining the heat pipe and the heat conduction base described in item 1 of the scope of patent application, the hole provided may be a blind hole. 4. According to the method of combining a heat conducting tube and a heat conducting base according to item 1 of the scope of the patent application, wherein the hole may be circular, and the cross section of the heat conducting tube is also circular. 5. According to the method for combining a heat transfer tube and a heat transfer base described in item 1 of the scope of the patent application, wherein the hole may be non-circular, and the cross section of the heat transfer tube is corresponding to the shape of the hole cross section. Non-circular.