TWM249091U - Assembly structure for uniform thermo conductive block - Google Patents

Description

M249091 V. Creation Instructions (l) New Type of Technical Field "This creation is about a peripheral accessory used in the heat sink of information or communication products, especially it can improve the heat dissipation efficiency of the bulk ampule module and be used as an integrated circuit The heat conduction device of the package ^ [Previous technology] At present, the heat dissipation devices used in the industry for computer central processing units (CPUs) or high heat source products are mostly based on heat sinks made of metal with high heat transfer efficiency. The base is in contact with the heat source to absorb and transfer the heat to the heat sink's sheet. 'The cold air is blown out by the fan to remove the heat from the heat sink. In practice, although the traditional heat sinks can be stacked to form a heat sink module, and heat pipes and cooling fans can be used to improve the heat dissipation efficiency; not every group of central processing units needs to be so complicated and expensive. Cooling modules' and some computer hosts have a relatively small space inside, which ca n’t accommodate the volume combined with more than two sets of heat sinks. Instead, as long as the interface elements with better dispersion effect can quickly conduct heat from the heat source, and Pass =, the heat sink to increase the heat dissipation efficiency <. Know the combination of the body of the heat dissipation element and the heat pipe, and connect the heat pipe and the body as a whole by welding, welding, etc .; too much; it is necessary to drill holes before manufacturing, and then apply the heat pipe with solder paste or solder paste. Guide body. But 杲 所 was 66 you from people 丄. $ 才 亘 入洞 孔

Page 5 M249091 V. Creation Instructions (2) [New Content] "Technical Issues to Be Solved" This creation is mainly to solve the problems of traditional interface component structures that are used for heat conduction during manufacturing, and the manufacturing costs are relatively high. In order to achieve functions that can effectively conduct heat and heat. "Technical means to solve problems"

The first technical means of this creation is to divide the body of the thermal interface element into two parts, one of which is a base with a recessed space and the other is a cover plate, which can be combined with each other in a tight manner. Therefore, as long as The heat-conducting tube is set in the recessed space on the base, and then the cover plate is combined with the base to complete the combination of the heat-conducting interface components. The second technical means of this creation is that the heat-conducting tube can be forced into the recessed space of the base in an interference fit manner, so that the heat-conducting tube can be fixed without using fixing glue, heat-conducting glue / paste or solder paste. The third technical means of this creation is that the heat pipe can be placed in the recessed space of the base in a loose fit, but the heat pipe is fixed in the recessed space with fixing glue, thermally conductive glue / paste or solder paste.

The fourth technical means of this creation is to fix and fix the base and the cover board by using the interference cooperation of the convex column and the hole between the base and the cover board. The fifth technical means of this creation is to use one or more scroll-shaped heat-conducting tubes to be arranged in the recessed space of the base, so as to enlarge the contact area between the base and the heat-conducting tubes. The sixth technical means of this creation uses more than one and unequal diameter

Page 6 M249091

In the recessed space of the round base, to expand the "effect on the previous technology": the first month; compared with the "I" technology, this work mainly uses the tight fit to fix the two base plates of the base, and then the scroll or circular heat pipe It is arranged between the base and the cover plate to form a thermally conductive soaking block, which is more convenient to manufacture and the cost is further reduced. The volume of the group and the effective application to the package of the integrated circuit can improve the heat transfer efficiency. [Embodiment] The following description of the creation will be made clearer with the help of the drawings, in which: Refer to the first figure, the structure of the thermally conductive soaking block provided by this creation includes ^ a base 1, a cover 2 与 热 管 3。 2 and the heat pipe 3. The base 1 and the cover plate 2 are both made of metal materials with good thermal conductivity, such as copper metal, aluminum, etc .; a recessed space 10 is provided on the base 1 A recessed hole π is provided in the center of the recessed metal 0, and a recessed space Λ12 is provided on the periphery of the upper surface of the base 1. The cover plate 2 basically corresponds to the shape of the base 1, and a plurality of pillars 21 corresponding to the recessed holes 11 and a lower hole 26 corresponding to the cover plate 2 are placed in the plurality. Of course, the pillar 21 and the recessed hole 11 are provided in the convex and vertical exchanges; the positions of the convex pillar 12 and the hole 22 can also be adjusted to each other.丨 Machine is relocated on the base 1 and replaced with the cover. In other words, ----------- iTT 'V. Creation Instructions (4) 2; The convex pillars 12 and the holes 22 can also achieve the function of cooperating and fixing each other. The text § is again on the plate 2 and the base! The disassembled heat pipe 3 can be a heat conducting superconducting tube, or a hollow metal tube with a k-shape, or a k-shaped hollow metal tube, which can be used for personal use today. In the end, the metal was originally made with high-speed thermal conductivity <# _ γ Β *. Households) based on 1 material, such as: yttrium barium steel oxide plate) superconducting materials, barium calcium calcium copper oxide bismuth copper oxide compounds (HBCC0) superconducting materials) superconducting materials, or other inorganic Superconducting materials.口 :: J J: 材? 'For example: pure water or other organic superconducting materials. Dagger can reach high speed thermally conductive materials. The principle of the application of the inorganic superconducting material is: the high-speed oscillation and friction of molecules generated when the molecules are heated, so that the heat energy is transmitted in waves, heat transfer, and organic high-temperature superconducting materials. 、 The molecules of the liquid in the body undergo a phase change when they are heated to quickly transfer heat. The wheel speed is very fast, so it is called a "heat-conducting superconductor, body", and because the superconductor and body are transmitted from the hot end to the cold end The time is short, so the temperature difference between the cold end of the grate is very small, which can achieve the best thermal conductivity. It has been confirmed by experiments that the heat rate is about five times that of copper, and more than ten times that of ordinary aluminum metals. ..... The combination of the base 1, the cover plate 2 and the heat pipe 3 can be formed into a scroll shape in advance by applying a fixing glue, a heat conductive glue or a solder paste in the recessed space 10 on the 1st. The heat transfer tube 3 is placed in the recessed space, and all of them are freely bent. The material filling device (YBC, mercury-barium material (in-body fast metal due to the conductive end and its fast base) will use solid M249091. V. Creation Explanation (5) Fixing glue, thermal conductive glue or solder paste fixes the heat pipe 3 to the bottom surface of the recessed space 10 'Finally, the lower surface of the cover plate 2 and the pillar 2 1 are also coated with fixing glue, thermal glue or poor solder' Cover the cover plate 2 on the base 1 so that the column body 21 is inserted into the recessed hole 11 'and the protruding post 2 is also inserted into the hole 22, and the cover plate 2 is fixed by a fixing glue, a thermally conductive glue or a solder joint. It is fixed on the base 1 so that the heat pipe 3 is covered and fixed in the recessed space 10 between the base 1 and the cover plate 2 (as shown in the second picture, this work can also be done without using fixing glue or heat conducting glue Or solder paste as the bonding medium between the cover plate 2 and the base 1, and it is completed in a tight fit. An embodiment of the method is to design the maximum diameter of the heat transfer tube 3 to be larger than the inner diameter of the recessed space 10, and then squeeze the heat transfer tube 3 into the recessed space 10; between the heat transfer tube 3 and the recessed space 10 The gap is filled with thermally conductive adhesive or solder paste to ensure the contact between the thermally conductive tube 3 and the base 1 to exert the heat conduction effect. In addition, the diameter of the cylinder 2 of the cover plate 2 is set to be larger than the inner diameter of the recessed hole 11; The diameter of the column 2 is also set to be larger than the inner diameter of the hole 2 2, so that the column 2 1 and the convex column 12 are pressed tightly against the concave hole 1 1 and the hole 22 respectively, and fixed by interference interference, or It is fixed by riveting. This creation is used to combine the scroll-shaped heat-conducting tube 3 between the base 1 and the cover plate 2 and can be placed in the recessed space 1 0 in a single scroll form (as shown in the third figure) ) 'Or two or more scroll-shaped heat-conducting pipes 3 are placed in a staggered manner and then placed in the recessed space 10. When used, the heat-conducting soaking block is combined with the thermal repair source and the heat dissipation module. So that the base i contacts the heat source such as the CPU, and the cover 2 contacts the heat dissipation module; A block disposed on the package body with the laminate of $ way, when the base 1 absorbs the heat generated by the heat source, heat will be part of a thermally conductive heat block directly to the heat transfer tube 3, and then passed by a heat transfer pipe 3

Page 9 M249091 V. Creation instructions (6) Lead to the heat dissipation module; since the heat pipe 3 is designed in a scroll shape, it has a larger area to absorb and conduct heat, so it can achieve the effect of improving heat dissipation efficiency. In addition to the volute design, the heat transfer tube 3 provided on the base 1 can also be arranged in a recessed space 10 above the base 1 in a concentric circle (such as (Shown in the fourth figure), and the heat pipe is fixed in the recessed space 10 by using a fixing glue, a thermally conductive glue or a solder paste, and finally the cover plate 2 is combined with the base 1 in the aforementioned manner.

The above are only for explaining the preferred embodiment of the creation, and are not intended to restrict the creation in any form. Therefore, any modification or change of the creation made in the same spirit of creation , Should still be included in the scope of protection of this creative intention.

Page 10 M249091 Brief description of the diagram The first diagram is an exploded perspective view showing the combination of the base, heat pipe and cover plate of this creation. The second figure shows a sectional plan view of the structure of the base, heat pipe, and cover plate combined in this creation. The third figure is a plan view showing an embodiment of a recessed space in which a vortex-shaped heat pipe is set on a base. The fourth figure is a plan view showing an embodiment in which a plurality of circular heat pipes of different sizes are arranged in a recessed space on the base and arranged in a concentric circle. [Description of component symbols] (1) base (1 0) recessed space (11) recessed hole (12) convex column (2) cover plate (2 1) column body (2 2) hole (3) heat pipe

Claims (1)

M249091 VI. Scope of patent application 1. A combined structure of a thermally conductive soaking block, comprising:-a base with a recessed space on it; a heat pipe connected to the recessed space of the base; a cover plate that is bonded On the top of the base, and covering the heat pipe between the base and the cover. 2. According to the combined structure of the thermally conductive soaking block described in item 1 of the scope of the patent application, wherein the base is provided with a convex post and a recessed hole, and a hole corresponding to the convex post is provided under the cover plate. , And the cylinder corresponding to the recessed hole. 3. According to the combined structure of the thermally conductive soaking block described in item 1 of the scope of the patent application, wherein the thermally conductive tube has a scroll shape. 4. According to the combined structure of the thermally conductive soaking block described in item 3 of the scope of the patent application, wherein one of the scroll-shaped heat conducting tubes provided in the recessed space is provided. 5. According to the combined structure of the thermally conductive soaking block described in item 3 of the scope of the patent application, in which two or more spiral-shaped heat-conducting tubes can be staggered and placed in the recessed space. 6. The combined structure of the thermally conductive soaking block according to item 1 of the scope of the patent application, wherein the thermally conductive tube has a circular shape. 7. According to the combined structure of the thermally conductive soaking block described in item 6 of the scope of the patent application, a plurality of circular heat conducting tubes of unequal diameter are arranged in a concentric circle in a recessed space of the base. Page 12