TWM246993U - Heat sink - Google Patents

Description

M246993 4. Creation Instructions (1) [Technical Field to which the New Type belongs] This creation relates to a heat sink, especially one that can be placed on an electronic heating element, and uses a thermally conductive post to evenly transfer heat to the fin group to assist electronics. Radiating device for heat radiation of heating element. [Prior art] Please refer to the first and second figures, which are a conventional heat dissipating device, including a thermally conductive post 10 and a fin group 20, wherein the thermally conductive post 10 is made of copper A thermally conductive tube 30 is formed at the lower end of the thermally conductive column 10, and the thermally conductive column 10 is vertically arranged on the thermally conductive plate 30. The thermally conductive plate 30 has a receiving surface 3 1 on the top face. Can be used to receive the fin group 2 0. The fin group 20 is made of aluminum extrusion, and has a plurality of heat radiating fins 2 1. An assembly hole 22 corresponding to the heat conducting post 10 is provided in the middle of the heat radiating fins 21. The thermally conductive pillar 10 is sleeved into the assembly hole 22 of the fin group 20 from bottom to top, so that the thermally conductive pillar 10 and the fin group 20 are integrated into one body. The heat conducting plate 30 can be placed on the electronic heating element (not shown), and the heat conducting post 10 can evenly transfer the heat on the heat conducting plate 30 to the fin group 20, which can assist the electronic heating element. Cooling. In the above conventional heat dissipation device, since the outer edge of the heat conducting column 10 and the inner edge of the assembly hole 22 of the fin group 20 are not smooth surfaces, when the heat conducting column 10 is sleeved in the assembly hole 22, the A point contact is formed between the outer edge of the heat conducting column 10 and the inner edge of the assembly hole 22, and pores will be generated, which makes it difficult to make close contact between the heat conducting column 10 and the assembly hole 22, which makes the heat conduction efficiency great.

M246993 Fourth, creation instructions (2) Discount. In order to solve the above problem, generally, a solder paste or a thermal conductive adhesive is added between the assembly hole 22 and the thermal conductive pillar 10, and the thermal conductive pillar 10 and the fin group 20 are connected as a whole by welding or gluing. In order to fill the pores with solder paste or thermally conductive adhesive. However, when the thermal conductive pillar 10 is sleeved in the assembly hole 22 of the fin group 20, the thermal conductive pillar 10 will be pre-coated on the inner edge of the assembly hole 22 or the outer edge of the thermal pillar 10. The solder paste or thermal conductive adhesive is forced to be pushed out, so the solder paste or thermal conductive adhesive is not easy to fill the pores, resulting in difficult close contact between the thermal conductive pillar 10 and the assembly hole 22, and the poor adhesion degree makes the heat on the electronic heating element impossible. Effectively transmitted to the fin group 20 via the thermally conductive pillar 10. Furthermore, the thermal conductive pillar 10 will push out the solder paste or thermal conductive glue, so a secondary process is needed to clean up the pushed out solder paste or thermal conductive glue, which will also cause inconvenience in operation. Therefore, it can be seen from the above that the conventional heat dissipation device obviously has inconveniences and defects in practical use, and needs to be improved. The reason is that the author feels that the above-mentioned shortcomings can be improved. He has devoted himself to research and cooperated with the application of theories to finally propose a rational design and effectively improve the above-mentioned original creations. [New content] The main purpose of this creation is to provide a heat dissipation device. The fin group is connected to the thermally conductive pillars in a sandwich manner. The solder paste or thermal adhesive can contact the corresponding part. The occurrence of the thermal conductive adhesive occurs. The solder paste or thermal conductive adhesive easily fills the pores, which can make the thermal conductive column and the fin group tight.

M246993 4. The contact of creation note (3) has better adhesion, so that the thermal energy on the electronic heating element is effectively transferred to the fin group through the thermal conductive column, and no secondary processing is required to simplify the operation process. In order to achieve the above purpose, the present invention provides a heat dissipation device, including: a thermally conductive post; and at least two fin groups, each of which has a plurality of thermally conductive fins. A joint surface, the joint surface is a concave solitary surface; wherein the fin groups are sandwiched on the outer edge of the thermally conductive pillar by the joint surface, so that the thermally conductive pillar and the fin group are integrated into one; For further understanding of the features and technical content of this creation, please refer to the following detailed description and drawings of this creation, but the drawings are provided for reference and explanation only, and are not intended to limit this creation. [Embodiment] Please refer to the third, fourth, fifth, and sixth drawings. The present invention provides a heat dissipation device, which includes a thermally conductive post 50 and at least two fin groups 60 and 70. The column 50 is a cylindrical heat pipe made of copper material. A heat conducting plate 80 made of copper material is connected to the lower end of the heat conducting column 50. The heat conducting column 50 is vertically arranged on the heat conducting plate 80. The top surface of the heat conducting plate 80 has a receiving surface 8 1 which can be used to receive the fin groups 60 and 70. This preferred embodiment is provided with two fin groups 60 and 70, which are a first fin group 60 and a second fin group 70 respectively, but the number of fin groups is not limited, and A third fin group, a fourth fin group, etc. may be added to form a plurality of fin groups such as three or four.

M246993 4. Creation instructions (4) The first fin group 60 is made of aluminum extrusion, and has a plurality of heat dissipation fins 6 1. The shape and structure of the heat dissipation fins 6 1 are not limited. It can be changed according to actual needs. A joint surface 6 2 corresponding to the thermally conductive pillar 50 is provided at the middle of the radiating fins 6 1. The joint surface 62 is a concave solitary surface. The radian of the joint surface 62 is outside the thermally conductive pillar 50. The loneliness of the edge corresponds. The second fin group 70 is symmetrical to the first fin group 60 in structure, so that it can be manufactured by using the same mold. The second fin group 70 is also made of aluminum extrusion, which has a large number of heat dissipation. The shape and structure of the fins 71 and the heat dissipation fins 71 are not limited, and may be changed according to actual needs. A joint surface 7 2 corresponding to the thermally conductive pillar 50 is provided at the middle of the heat dissipation fins 7 1. The joint surface 7 2 is a concave arc surface. The 5 degree of the joint surface 7 2 is connected to the thermally conductive pillar 5. Corresponds to the loneliness of 0 outer edges. The two fin groups 60 and 70 are sandwiched by two sides to the outer edge of the heat conducting column 50, so that the heat conducting column 50 and the two fin group 60 and 70 are integrated into one body, and the two fin group 6 0, 7 0 is clamped in front of the outer edge of the thermal conductive pillar 50, and a solder paste (or thermal conductive glue) is applied in advance on the joint surfaces 62, 72 of the fin group 60, 70 or the outer edge of the thermal conductive pillar 50, so when When the joint surfaces 62 and 72 of the two fin group 60 and 70 are clamped on the outer edge of the thermally conductive pillar 50, the solder paste (or thermal conductive glue) can contact the outer edge of the thermally conductive pillar 50 or the joints 6 2 and 7 2 Corresponding part, the two fin groups 60 and 70 can be welded and connected as a whole by means of a tin furnace and the like, and the thermal conductive pillar 50 and the joint surfaces 62 and 72 can be connected together as a whole, so that the thermal conductive pillar 50 and the The two fin groups 60 and 70 are tightly connected as a whole; formed by the above-mentioned composition

M246993

4. Creative Instructions (5) The cooling device of this creative work. The heat-conducting plate 80 heat-generating element (the heat-generating transfer element heat-generating element on the figure is radiated. Can be placed in a central processing unit), and the heat-conducting column 5 to 60 yuan (CP u) such as the two-fin group 0 can heat the heat transfer plate 80, 70, and can assist the creation of electricity books mainly by connecting the fin group 60, 70 to the heat conduction column 50 in a clamping manner, and when the two fin group 60, 70 clip When attached to the outer edge of the thermal conductive pillar ^ 0, the solder paste or thermal conductive adhesive can contact the thermal conductive pillar 5 〇 The outer edge or the corresponding part on the bonding surface 6 2, 7 2 will not have the same thermal conductive pillar sleeve as the conventional fin ^ on the fin When the assembly hole of the chip group is in, the thermal conductivity can push out the solder paste or thermal adhesive. This creation can make the solder paste or thermal conductive adhesive easily fill the pores, so the thermal contact 50 and the joint surfaces 62 and 72 of the fin group 60 and 70 are in close contact, and the adhesion is better, which makes the electronic heating element The thermal energy on the surface is effectively transmitted through the thermal conductive column 50 to the fin group 60 and 70. 、 / Furthermore, the thermal conductive pillar 50 will not push out the solder paste or thermal conductive adhesive, and does not need to be processed once (cleaning out the solder paste or thermal conductive adhesive that has been pushed out) to simplify the industrial process. Bu Duo said that the above mentioned is extremely productive, I; the play is consistently a new creative product that is not worthy. Shen Jing wants to make use of it, novelty, and progress, which is fully in line with the new patents and benefits. j: iLifa filed an application. Please check and grant the rights of the early creators in this case. The preferred and feasible embodiment of this creation is restricted to the fact that the content is not the content of the night, so the use of this creation instruction and drawings, and changes in the special structure are equally included in the scope of this creation. M246993 4. In the description of creation (6), Chen Ming is co-authored.

hi · Page 10

M246993 Schematic illustration [Schematic description] The first diagram is an exploded perspective view of a conventional heat sink. The second figure is a three-dimensional assembled view of a conventional heat sink. The third figure is an exploded perspective view of the heat sink of this creation. The fourth picture is a three-dimensional combined view of the heat sink of this creation. The fifth picture is a three-dimensional combined view of the cooling device of this creation from another angle. The sixth figure is a top view of the heat sink of this creation. [Representative Symbols of Components] [Knowledge] 1 0 Thermally conductive post 2 0 Fin set 2 1 Radiating fin 2 2 Assembly hole 3 0 Thermally conductive plate 3 1 Receiving surface [This creation:] 5 0 Derivative post 6 0 First fin Sheet group 6 1 Radiating fin 6 2 Joint surface 7 0 First, — Fin group 7 1 Radiating fin 7 2 Joint surface 8 0 Thermally conductive plate 8 1 Receiving surface

Page 11

Claims (1)

M246993 5. Application patent scope 1. A heat dissipation device, including: a thermally conductive post; and at least two fin groups, each of which has a plurality of cooling fins, and one side of the cooling fins is provided with a joint corresponding to the thermally conductive posts. Surface, the joint surface is a concave arc surface; wherein the fin groups are sandwiched on the outer edge of the thermally conductive pillar by the joint surface, so that the thermally conductive pillar and the fin group are integrated into one body. 2. The heat dissipation device according to item 1 of the scope of patent application, wherein a lower end of the thermally conductive pillar is connected to a thermally conductive plate, the thermally conductive pillar is vertically arranged on the thermally conductive plate, and the thermally conductive plate has a receiving surface for receiving the fins Film group. 3. The heat dissipation device as described in item 1 of the scope of patent application, wherein the fin groups are clamped in front of the outer edges of the thermally conductive pillars, and solder paste or thermally conductive glue is set in advance on the joint surfaces of the fins or the outer edges of the thermally conductive columns Contact the solder paste or the thermally conductive glue with the corresponding part of the outer edge of the thermally conductive pillar or the joint surface. 4. The heat dissipation device according to item 1 of the scope of patent application, wherein the fin groups are integrally connected by welding. Page 12