TWM271365U - Improvement of heat dissipation device and heat dissipation fin - Google Patents

Improvement of heat dissipation device and heat dissipation fin Download PDF

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Publication number
TWM271365U
TWM271365U TW94200746U TW94200746U TWM271365U TW M271365 U TWM271365 U TW M271365U TW 94200746 U TW94200746 U TW 94200746U TW 94200746 U TW94200746 U TW 94200746U TW M271365 U TWM271365 U TW M271365U
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Taiwan
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heat
improvement
heat dissipation
item
patent application
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TW94200746U
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Chinese (zh)
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Ju-Yin Lin
Shiou-Shiang Sung
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Ju-Yin Lin
Shiou-Shiang Sung
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Application filed by Ju-Yin Lin, Shiou-Shiang Sung filed Critical Ju-Yin Lin
Priority to TW94200746U priority Critical patent/TWM271365U/en
Publication of TWM271365U publication Critical patent/TWM271365U/en

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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

M271365 四、創作說明(1) 【新型所屬之技術領域】 本創作之一種散熱裝置及其散熱片之改良,尤指一種 可使各该散熱片與熱導體之結合緊度增加,而大幅提昇散 熱裝置之熱傳效率,且能避免製組過程產生破損,而使得 散熱裝置的製組良率提高。 【先前技術】 目前業界在電子元件之散熱方面,係利用熱管、均溫 板等熱導體所具有高熱傳能力、快速傳熱、高熱傳導率、 重i fe、結構簡單及多用途等特性,可以傳遞大量的熱且 •不消耗電力,而非常適合電子產品的散熱需求;故將熱導 體結合散熱片所形成之散熱裝置,已成為解決散熱之重要 中該散熱 對熱管組 緣,期利 積的接觸 形成氣流 然而 伸展有凸 散熱片厚 化的部份 的凸緣, 際上多因 熱管散熱 片係以高 裝的穿孔 用該凸緣 與熱傳作 間隔作用 ,習知之 緣’而此 度,當然 其強度也 以增加其 其厚度變 裝置,主要包括多 導熱材料所製成, ’於該穿孔周緣向 以與熱管結合時, 用,同時也作為多 〇 熱管散熱裝置,係 伸展將使得凸緣的 ,依據金屬材料基 相對減低,因此, 與熱管結合之接觸 薄,而使得結合緊 並於散熱片上沖製相 上延伸形成有一凸 可獲得與熱管較多面 數散熱片堆疊組合時 於散熱片上直接抽拉 厚度相對變薄而小於 本特性,被延展而薄 習知散熱片利用展延 面積及結合緊度,實 度並不足以達到預期M271365 IV. Creation Instructions (1) [Technical Field to which the New Type belongs] An improvement of the heat sink and the heat sink of this creation, especially one that can increase the tightness of the combination of the heat sink and the heat conductor, and greatly improve the heat dissipation. The heat transfer efficiency of the device can avoid breakage during the manufacturing process, thereby improving the manufacturing yield of the heat sink. [Previous technology] At present, in the field of heat dissipation of electronic components, the industry uses the characteristics of high heat transfer capacity, fast heat transfer, high thermal conductivity, heavy weight, simple structure, and multi-purpose characteristics of heat conductors such as heat pipes and temperature equalizing plates. It transfers a large amount of heat and does not consume electricity, which is very suitable for the heat dissipation requirements of electronic products. Therefore, the heat dissipation device formed by combining a heat conductor with a heat sink has become an important solution to heat dissipation. The flange that is part of the thickened part of the convex heat sink that stretches out when it comes into contact with the air. In fact, the heat pipe heat sink uses a high-mounted perforation to use the flange to separate heat from the heat transfer. Of course, its strength is also increased by increasing its thickness, which is mainly made of multiple thermally conductive materials. 'When used in conjunction with the heat pipe at the periphery of the perforation, it is also used as a multi-heat pipe heat sink. The extension will make the flange According to the relative reduction of the metal material base, the contact with the heat pipe is thin, so that the bonding is tight and the punching phase is extended on the heat sink. When a protrusion is formed, the heat sink can be directly drawn on the heat sink when it is combined with a heat pipe with a large number of faces. The thickness is relatively thin and is smaller than this characteristic. It is stretched and thin. The conventional heat sink uses the extended area and the tightness of the joint. To meet expectations

第5頁 M271365 四、創作說明(2) 效果,更甚者,業者為於 以使散熱裝置之散熱效^ ^之空間内增加散熱片數量, 的厚度減少變薄,如此月,匕:传提幵’、勢必須將每片散熱片 化,相對結合緊度亦將大冲製形成的凸緣壁厚將更為薄 過程產生破損,使得製作二^低,且因凸緣薄化易於製組 於是,本創作熱裝置r良率相對降低。 之經驗,並針對可進行^呈上述問題,點及從事該行業多年 實際之運用,纟著精益U之問題點’乃潛心研究龙配合 理且有效改善上“;:::=:終於提出-種設計合 【新型内容】 片之ί:作ί :::,在於提供-種散熱裝置及其散熱 ^ π # & ”在政熱片之凸緣設有套環嵌固增加凸緣厚 熱片與熱導體之結合緊度增加,而大幅提 ::卜,、裝!之熱傳效率,且能避免製組過程產生破損,而 使得散熱裝置的製組良率提高。 為達上述之目的,本創作散熱裝置及其散熱片之改 良’ s亥散熱裝置包括有多數散執 一導體,該散 ^具有-板片狀本體,於該^上設μ; 一穿孔,該 牙孔之周緣向上延伸形成有一凸緣,於該凸緣之外部設有 一與其相互套接結合之套環;而該熱導體之一端係與各該 散熱片之穿孔串設連接。 【實施方式】 為了使貴審查委員能更進一步暸解本創作之特徵及 技術内容,請參閱以下有關本創作之詳細說明與附圖,而Page 5 M271365 IV. Creation instructions (2) The effect, what's more, the industry aims to increase the number of heat sinks in the space of the heat dissipation device ^ ^, reducing the thickness of the heat sink, this month, Dagger: Chuan Ti幵 ', each piece of heat sink must be made, and the relative tightness of the joint will also make the flange wall thickness formed by the large punching process thinner, resulting in damage to the process, making the production low, and it is easy to make groups due to the thinning of the flange. Therefore, the yield rate of the original thermal device r is relatively reduced. Experience, and aiming at the above problems, points and practical applications in the industry for many years, the problems of Lean U 'are concentrated on researching the rational and effective improvement of the long distribution "; :: =: finally put forward- A new design [new content] The piece of ί: 作 ί ::: is to provide-a type of heat sink and its heat dissipation ^ π # & "Embedded on the flange of the political heat film to increase the thickness of the flange The tightness of the combination of the film and the thermal conductor is increased, and the mention is greatly improved. Heat transfer efficiency, and can avoid breakage during the manufacturing process, which improves the manufacturing yield of the heat sink. In order to achieve the above-mentioned purpose, the creation of the heat sink and the improvement of the heat sink's heat sink includes a large number of conductors, the fan ^ has a plate-shaped body, on which ^; a perforation, the A peripheral edge of the tooth hole extends upward to form a flange, and a collar is provided on the outside of the flange to be sleeved and combined with each other; and one end of the heat conductor is connected in series with the perforations of the heat sinks. [Embodiment] In order for your review committee to better understand the characteristics and technical content of this creation, please refer to the following detailed description and drawings of this creation, and

第6頁 M271365 四、創作說明(3) 所附圖式僅提供參考與說明’並非用來對本創作加以限制 者。 請參閱第一圖及第二圖所示’係分別為本創作散熱片 之立體分解圖及組合示意圖,本創作係提供一種散熱裝置 及其散熱片之改良,該散熱片1具有一板片狀本體11,於 該本體11上設有複數穿孔1 2,各該穿孔1 2之周緣向上延伸 形成有一凸緣1 3,於該凸緣1 3上設有至少一縱向缺槽 131,且於其外部設有一圓形套環14,以與凸緣13相互套 接結合,該套環1 4係可為金屬環或其他各種材質之環體所 鲁製成,其中金屬環係可為SUS304或SUS430之不繡鋼;另該 凸緣13向上延伸之高度係可高於套環14之高度,並於該凸 緣1 3之末端向外翻折而形成有一壓制部丨5,以將套環丨4局 部包覆結合成一體。 ° 組合日守係先將該專套環1 4依序套設於各該本體1 1之凸 緣13上,因凸緣13之高度係高於套環14的高度,如此,該 向外翻折製程以形成壓制部15,該壓制部 而;Π包覆狀態’箝制式的結合於凸緣13之 卜周、、彖上,而形成無脫出之虞的結合。 _ 請麥閱第三圖及第四圖所示八 與熱管之組合示意圖及第三圖之Α區试刀別為本創作散熱片 熱/ 1係可與至少一熱導體2組合成—或局敎部放大圖,該散 2係可為熱管或均溫板,本實施 ,,、、裝置,該熱導體 之形狀係可為一「U」形、一[/、/马一熱管,該熱導體2 型態,於其底部具有一受敎部2」丨形J其他各種不同之幾何 … 5亥雙熱部21係用以與傳Page 6 M271365 IV. Creative Instructions (3) The drawings are provided for reference and explanation only, and are not intended to limit this creative work. Please refer to the first diagram and the second diagram, which are a three-dimensional exploded view and a combined schematic diagram of the radiating fins of the creation. This creation provides a cooling device and an improvement of the radiating fins. The radiating fin 1 has a plate shape. The main body 11 is provided with a plurality of perforations 12 on the main body 11. A peripheral edge of each of the perforations 12 extends upward to form a flange 13. At least one longitudinal notch 131 is provided on the flange 13, and A circular ferrule 14 is provided on the outside to be sleeved and combined with the flange 13. The ferrule 14 or 4 can be made of a metal ring or a ring body of various materials. The metal ring system can be SUS304 or SUS430. In addition, the height of the flange 13 extending upward is higher than the height of the collar 14 and is folded outward at the end of the flange 13 to form a pressing portion 丨 5 to turn the collar 丨4 Partial coating is combined into one body. ° The combined sun guard is firstly set the special collars 14 on the flanges 13 of each of the bodies 11 in sequence, because the height of the flanges 13 is higher than the height of the collars 14, so the outward turning The folding process is performed to form a pressing part 15, and the pressing part is in a cladding state and is clamped on the periphery of the flange 13 to form a bond without the risk of detachment. _ Please read the schematic diagram of the combination of eight and heat pipes shown in the third and fourth pictures and the test knife in the area A of the third picture. The heat sink for the creative heat / 1 series can be combined with at least one heat conductor 2-or the bureau Enlarged view of the crotch, the scattered 2 series can be a heat pipe or a temperature equalizing plate. In this implementation, the shape of the heat conductor can be a "U" shape, a [/, / 马, a heat pipe, the heat The type of conductor 2 has a receiving part 2 ″ at its bottom, and other various geometries ... The double heating part 21 is used to communicate with

第7頁 M271365 马、創作說明(4) '"一~—-- 熱件連接或直接貼附接觸於電子發熱元件上;而熱導體 2之一側則各形成有一傳熱部22,該傳熱部22係用以穿設 、接於各忒散熱片1之穿孔1 2内;另者,該套環1 4之熱膨 /系數]於熱導體2之熱膨脹係數,藉以令該熱導體2於受 熱後仍此與各該散熱片1形成一緊密結合,而大幅提昇 月欠熱I置之熱傳效率。 、、且Γ蚪係於各該散熱片1之凸緣1 3内部,或於熱導體2 ,ίϊ塗?有—導熱介質30 ’該導熱介質30係可為導熱膏 f ^ ^ ^曰加熱導體2與各該散熱片1之密封性、並可作 為串=^潤滑劑及提昇導熱效果。 作鞞:=第五圖所示,係為本創作散熱片之另-實施例 立體分解圖,盆 、μ ^ , 八中政熱片1之穿孔12係可為一長矩形,藉 以^形狀之均溫板串設連接,於該穿孔1 2之周緣向上 ^1,葬以矩^!凸^表13,於該凸緣13之一侧處設有一缺槽 1 Ir%14套設於凸緣13上時,可使凸緣13之口 緣易於有效地獲得縮小。 的气:ί ί述f數散熱片1之穿孔12相對熱導體2結合組成 位於穿孔12延伸之凸緣13,以及箱套結: ;壁2_:時也提高相對熱導體2結合緊度與接觸面 f生破損田i:散熱裝置之熱傳效率,且能避免製組過程 產生破損,而使得散熱裝置的製組 綜上所述,备士石丨A > R千捉冋 p且右產堂i m田 散熱裝置及其散熱片之改良 已具'有屋業利用性、主A u 新穎11與進步性,又本創作之構造亦Page 7 M271365 horse, creation instructions (4) '" a ~ --- hot parts connected or directly attached to the electronic heating element; and one side of the heat conductor 2 is formed with a heat transfer section 22, the The heat transfer part 22 is used to pass through and be connected to the perforations 12 of each heat sink 1; in addition, the thermal expansion / coefficient of the collar 14 is the thermal expansion coefficient of the thermal conductor 2 so that the thermal conductor 2 After heating, it still forms a tight combination with each of the heat sinks 1, and greatly improves the heat transfer efficiency of the monthly underheating I. , And Γ 蚪 is inside the flange 1 3 of each heat sink 1 or is coated on the heat conductor 2? Yes—Heat conducting medium 30 ′ The heat conducting medium 30 may be a heat conducting paste f ^ ^ ^, which means that the sealing properties of the heating conductor 2 and each of the heat sinks 1 may be used as a string of lubricant and enhance the heat conducting effect. Operation: = The fifth figure is a three-dimensional exploded view of another embodiment of the creative heat sink. The perforation 12 of the basin, μ ^, and the eight central political heat sinks 1 can be a long rectangle. The temperature-equalizing plates are connected in series, and the peripheral edge of the perforation 12 is upwards ^ 1, and is buried with a moment ^! Convex ^ Table 13, a notch 1 Ir% 14 is set on one side of the flange 13 and is set on the flange When 13 is on, the mouth edge of the flange 13 can be easily and effectively reduced. Gas: ί Describing the perforation 12 of the f-number fin 1 combined with the thermal conductor 2 to form a flange 13 extending from the perforation 12, and the box sleeve: Wall 2_: also increases the tightness and contact of the relative thermal conductor 2 Surface breakage i: The heat transfer efficiency of the heat sink, and it can avoid damage during the manufacturing process, so that the heat sink manufacturing system can be summarized as described above. The improvement of Tang Imtian's heat dissipation device and its heat sink has already possessed the utility of the housing industry, the main A u novelty 11 and progressiveness, as well as the structure of this creation.

M271365 、創作說明(5) 未曾見於同類產品及公開使用,&入μ人 件,爰依專利法提出申請。 兀王付&創作專利申請要 惟以上所述僅為本創作之 :拘限本創作之專利範 施例,Μ非因此 式内容所為之等效結構變化,;本創作說明書及圖 合予陳明域’均同理皆包含於本創作所涵蓋:☆相 « 第9頁 M271365 圖式簡單說明 【圖式簡單說明】 第一圖 係為本創作散熱片之立體分解圖。 第二圖 係為本創作散熱片之組合示意圖。 第三圖 係為本創作散熱片與熱導體組合示意圖。 第四圖 係為第三圖之A區域局部放大圖。 第五圖 係為本創作散熱片之另一實施例立體分解圖。 【主要元件符號說明】 散熱片1M271365, Creation Note (5) has not been seen in similar products and used publicly, & enters the file, and applies according to the Patent Law. Wu Wangfu & creation patent application is only for the above creation: the patent examples restricting this creation, M is not equivalent to the structural changes made by this type of content; this creation specification and drawings are shared with Chen Mingyu 'All the same reason are included in this creation: ☆ phase «Page 271 M271365 Simple illustration of the diagram [Simplified illustration of the diagram] The first picture is a three-dimensional exploded view of the heat sink of the creation. The second picture is the combined schematic diagram of this creative heat sink. The third picture is the combination of heat sink and heat conductor. The fourth picture is a partial enlarged view of the area A of the third picture. The fifth figure is an exploded perspective view of another embodiment of the creative heat sink. [Description of main component symbols] Heat sink 1

第10頁 本體11 穿孔12 凸緣13 缺槽1 3 1 套環14 壓制部1 5 熱導體2 受熱部2 1 傳熱部2 2 導熱介質30Page 10 Body 11 Perforation 12 Flange 13 Notch 1 3 1 Collar 14 Pressing section 1 5 Heat conductor 2 Heat receiving section 2 1 Heat transfer section 2 2 Heat conducting medium 30

Claims (1)

M271365 五、申請專利範圍 1、一 多數散 上設有至少 緣,於該凸 及 至少一 接 種散熱裝置改良,其包括: 熱片’該散熱片具有一板片狀本體,於該本體 一穿孔,該穿孔之周緣向上延伸形成有一凸 緣之外部設有一與其相互套接結合之套環;以 熱導體,係與所述各該散熱片之穿孔串設連 2、如 中各該散熱 _ 3、如 中各該散熱 4、 如 中該套環之 5、 如 中该套被係 6、 如 中該金屬環 7、 如 I中該熱導體 8、 如 中各该散熱 9、 — 上設有至少 緣,於該凸 申清專利範 片之凸緣上 申明專利範 片之凸緣末 申請專利範 熱膨脹係數 申请專利範 為一金屬環 申請專利範 係為S U S 3 0 4 申請專利範 係為熱管或 申清專利範 片與熱導體 種散熱片改 一穿孔,該 緣之外部設 圍第1項所述之散熱裝置改良’其 設有至少一縱向缺槽。 圍第1項所述之散熱裝置改良’其 端係向外翻折並形成有一歷制部。 圍第1項所述之散熱裝置改良’其 小於熱導體之熱膨脹係數。 圍第1項所述之散熱裝置改良’其 〇 圍第5項所述之散熱裝置改良,其 或SUS430之任一種不繡鋼製成。 圍第1項所述之散熱裝置改良,其 均溫板之任一種。 圍第1項所述之散熱裝置改良,其 之間填佈有一導熱介質。 良,具有一板片狀本體,於該本體 牙孔之周緣向上延伸形成有一凸 有一與其相互套接結合之套環。M271365 5. Scope of patent application 1. There is at least a margin on the majority, and the improvement of the projection and at least one inoculation heat dissipation device includes: a heat sink. The heat sink has a plate-shaped body, and a perforation is formed in the body. The peripheral edge of the perforation extends upwards to form a flange. A collar is provided on the outside and is connected with each other. A thermal conductor is connected in series with the perforations of the heat sinks. , Such as the heat sink 4 , such as the collar 5 , such as the quilt 6 , such as the metal ring 7 , such as the heat conductor 8 in I , such as the heat sink 9 —— At least, on the flange of the convex patent application, the flange of the patent application is declared. The patent application is for a thermal expansion coefficient. The patent application is for a metal ring. The patent application is for SUS 300. The patent application is for a heat pipe. Or apply for the patented fan sheet and the heat conductor type heat sink to change a perforation, and the outer side of the edge is surrounded by an improvement of the heat dissipation device described in item 1, which is provided with at least one longitudinal notch. The improvement of the heat dissipation device described in item 1 is that the end thereof is folded outward and a calendar part is formed. The improvement of the heat dissipation device described in item 1 is smaller than the thermal expansion coefficient of the thermal conductor. The improvement of the heat dissipation device described in item 1 ′ is 〇 The improvement of the heat dissipation device described in item 5 is made of stainless steel or any of SUS430. The improvement of the heat dissipation device described in item 1, any one of the temperature equalizing plates. The heat dissipation device improvement described in item 1 is filled with a thermally conductive medium in between. Good, it has a plate-shaped body, and a collar ring is formed on the peripheral edge of the tooth hole of the body to protrude upward. M271365 五、申請專利範圍 1 0、如申請專利範圍第9項所述之散熱裝置改良,其 中各該散熱片之凸緣上設有至少一縱向缺槽。 1 1 、如申請專利範圍第9項所述之散熱裝置改良,其 中各該散熱片之凸緣末端係向外翻折並形成有一壓制部。 1 2 、如申請專利範圍第9項所述之散熱片改良,其中 該套環係為一金屬環。 1 3、如申請專利範圍第1 2項所述之散熱片改良,其 中該金屬環係為SUS3 04或SUS430之任一種不繡鋼製成。M271365 V. Application scope of patent 10. The improvement of the heat dissipation device as described in item 9 of the scope of patent application, wherein each flange of the heat sink is provided with at least one longitudinal notch. 1 1. The heat dissipation device improvement as described in item 9 of the scope of patent application, wherein the flange end of each of the heat sinks is folded outward and a pressing portion is formed. 12. The heat sink improvement as described in item 9 of the scope of patent application, wherein the collar is a metal ring. 1 3. The heat sink improvement as described in item 12 of the scope of the patent application, wherein the metal ring is made of any of stainless steel SUS304 or SUS430. 第12頁Page 12
TW94200746U 2005-01-14 2005-01-14 Improvement of heat dissipation device and heat dissipation fin TWM271365U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI454209B (en) * 2011-12-05 2014-09-21 Giga Byte Tech Co Ltd Heat dissipation module and assembly method thereof
TWI600871B (en) * 2015-09-07 2017-10-01 力致科技股份有限公司 Heat dissipating assembly

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI454209B (en) * 2011-12-05 2014-09-21 Giga Byte Tech Co Ltd Heat dissipation module and assembly method thereof
TWI600871B (en) * 2015-09-07 2017-10-01 力致科技股份有限公司 Heat dissipating assembly

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