TW200420658A - Epoxy resin composition and semiconductor device - Google Patents
Epoxy resin composition and semiconductor deviceInfo
- Publication number
- TW200420658A TW200420658A TW093103542A TW93103542A TW200420658A TW 200420658 A TW200420658 A TW 200420658A TW 093103542 A TW093103542 A TW 093103542A TW 93103542 A TW93103542 A TW 93103542A TW 200420658 A TW200420658 A TW 200420658A
- Authority
- TW
- Taiwan
- Prior art keywords
- epoxy resin
- resin composition
- semiconductor device
- coupling agent
- silane coupling
- Prior art date
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 4
- 229920000647 polyepoxide Polymers 0.000 title abstract 4
- 239000000203 mixture Substances 0.000 title abstract 3
- 239000004065 semiconductor Substances 0.000 title abstract 3
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 abstract 4
- 239000006087 Silane Coupling Agent Substances 0.000 abstract 2
- 235000010290 biphenyl Nutrition 0.000 abstract 2
- 239000004305 biphenyl Substances 0.000 abstract 2
- 238000005538 encapsulation Methods 0.000 abstract 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 abstract 1
- 229940058905 antimony compound for treatment of leishmaniasis and trypanosomiasis Drugs 0.000 abstract 1
- 150000001463 antimony compounds Chemical class 0.000 abstract 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 abstract 1
- 229910052794 bromium Inorganic materials 0.000 abstract 1
- 239000011256 inorganic filler Substances 0.000 abstract 1
- 229910003475 inorganic filler Inorganic materials 0.000 abstract 1
- 150000002894 organic compounds Chemical class 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 125000000467 secondary amino group Chemical class [H]N([*:1])[*:2] 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 125000003396 thiol group Chemical group [H]S* 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4042—Imines; Imides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/66—Substances characterised by their function in the composition
- C08L2666/72—Fillers; Inorganic pigments; Reinforcing additives
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003039620 | 2003-02-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200420658A true TW200420658A (en) | 2004-10-16 |
| TWI320421B TWI320421B (en) | 2010-02-11 |
Family
ID=32905179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093103542A TWI320421B (en) | 2003-02-18 | 2004-02-13 | Epoxy resin composition and semiconductor device |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP4692885B2 (zh) |
| KR (1) | KR100982123B1 (zh) |
| CN (1) | CN1315905C (zh) |
| MY (1) | MY146460A (zh) |
| TW (1) | TWI320421B (zh) |
| WO (1) | WO2004074344A1 (zh) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006206696A (ja) * | 2005-01-26 | 2006-08-10 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP2006328360A (ja) * | 2005-04-28 | 2006-12-07 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP5062714B2 (ja) * | 2006-01-19 | 2012-10-31 | 日本化薬株式会社 | 活性エネルギー線硬化型樹脂組成物、及びその用途 |
| KR100699191B1 (ko) * | 2006-03-13 | 2007-03-23 | 제일모직주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한반도체 소자 |
| JP4984722B2 (ja) * | 2006-07-28 | 2012-07-25 | 住友ベークライト株式会社 | エポキシ樹脂組成物、エポキシ樹脂成形材料及び半導体装置 |
| KR100834351B1 (ko) * | 2006-11-24 | 2008-06-02 | 제일모직주식회사 | 멀티칩 패키지 밀봉용 에폭시 수지 조성물 및 이를이용한 멀티칩 패키지 |
| KR100798675B1 (ko) | 2006-12-12 | 2008-01-28 | 제일모직주식회사 | 반도체 소자 밀봉용 에폭시수지 조성물 및 이를 이용한반도체 소자 |
| JP5473196B2 (ja) * | 2007-05-16 | 2014-04-16 | 東レ・ダウコーニング株式会社 | 硬化性エポキシ樹脂組成物およびその硬化物 |
| KR100934558B1 (ko) * | 2007-10-08 | 2009-12-29 | 제일모직주식회사 | 실란커플링제와 선반응된 페놀형 경화수지를 포함하는반도체 조립용 접착 필름 조성물 및 이에 의한 접착 필름 |
| KR101023241B1 (ko) * | 2009-12-28 | 2011-03-21 | 제일모직주식회사 | 반도체용 접착제 조성물 및 이를 이용한 접착 필름 |
| JP5423402B2 (ja) * | 2010-01-06 | 2014-02-19 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
| CN102372899A (zh) * | 2010-08-11 | 2012-03-14 | 江苏中鹏新材料股份有限公司 | 一种阻燃绿色环氧模塑料 |
| CN101962466B (zh) * | 2010-09-25 | 2012-01-04 | 江苏中鹏新材料股份有限公司 | 半导体封装用本征阻燃环氧树脂组合物 |
| CN101967266A (zh) * | 2010-09-25 | 2011-02-09 | 江苏中鹏新材料股份有限公司 | 无卤阻燃环氧树脂组合物 |
| JP2013108024A (ja) * | 2011-11-24 | 2013-06-06 | Sumitomo Bakelite Co Ltd | 封止用エポキシ樹脂組成物及び電子部品装置 |
| WO2013129598A1 (ja) * | 2012-03-01 | 2013-09-06 | 住友ベークライト株式会社 | ローター固定用樹脂組成物、ローター、および自動車 |
| JP2013234303A (ja) * | 2012-05-11 | 2013-11-21 | Panasonic Corp | 半導体封止用エポキシ樹脂組成物と半導体装置 |
| JP5949674B2 (ja) | 2013-06-12 | 2016-07-13 | 信越化学工業株式会社 | 新規有機ケイ素化合物、その製造方法及び密着向上剤 |
| CN106592281B (zh) * | 2016-12-15 | 2019-05-28 | 武汉纺织大学 | 一种改善涂料浸透效率的方法 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3192953B2 (ja) * | 1995-12-27 | 2001-07-30 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂成形材料及びその製造方法 |
| JP3267144B2 (ja) * | 1996-03-22 | 2002-03-18 | 松下電工株式会社 | 封止材用エポキシ樹脂組成物及びそれを用いた半導体装置 |
| JPH11140277A (ja) * | 1997-11-10 | 1999-05-25 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及びこれを用いた半導体装置 |
| JPH11140166A (ja) * | 1997-11-11 | 1999-05-25 | Shin Etsu Chem Co Ltd | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
| JP3582576B2 (ja) * | 1998-05-15 | 2004-10-27 | 信越化学工業株式会社 | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
| JP2000281751A (ja) * | 1999-03-31 | 2000-10-10 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP2001040186A (ja) * | 1999-08-03 | 2001-02-13 | Nitto Denko Corp | 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置 |
| JP2001207031A (ja) * | 2000-01-28 | 2001-07-31 | Nitto Denko Corp | 半導体封止用樹脂組成物及び半導体装置 |
| JP2001213942A (ja) * | 2000-02-03 | 2001-08-07 | Nec Corp | 難燃性のエポキシ樹脂組成物 |
| JP2002012742A (ja) * | 2000-06-28 | 2002-01-15 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP4568985B2 (ja) * | 2000-10-31 | 2010-10-27 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
| JP2002179882A (ja) * | 2000-12-07 | 2002-06-26 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP2002220511A (ja) * | 2001-01-25 | 2002-08-09 | Matsushita Electric Works Ltd | 封止用エポキシ樹脂組成物及び半導体装置 |
| JP4734731B2 (ja) * | 2001-02-23 | 2011-07-27 | パナソニック電工株式会社 | 半導体封止用エポキシ樹脂組成物の製造方法 |
| JP2002317102A (ja) * | 2001-04-20 | 2002-10-31 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP4849290B2 (ja) * | 2001-06-26 | 2012-01-11 | 日立化成工業株式会社 | 封止用エポキシ樹脂成形材料及び電子部品装置 |
| JP2003082068A (ja) * | 2001-06-29 | 2003-03-19 | Toray Ind Inc | エポキシ系樹脂組成物およびそれを用いた半導体装置 |
| JP5098125B2 (ja) * | 2001-07-30 | 2012-12-12 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
| JP2003252961A (ja) * | 2002-03-05 | 2003-09-10 | Toray Ind Inc | エポキシ系樹脂組成物およびそれを用いた半導体装置 |
-
2004
- 2004-02-13 KR KR1020057014583A patent/KR100982123B1/ko active IP Right Grant
- 2004-02-13 JP JP2005502690A patent/JP4692885B2/ja not_active Expired - Fee Related
- 2004-02-13 TW TW093103542A patent/TWI320421B/zh not_active IP Right Cessation
- 2004-02-13 CN CNB2004800030641A patent/CN1315905C/zh not_active Expired - Fee Related
- 2004-02-13 WO PCT/JP2004/001569 patent/WO2004074344A1/ja active Application Filing
- 2004-02-14 MY MYPI20040483A patent/MY146460A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP4692885B2 (ja) | 2011-06-01 |
| JPWO2004074344A1 (ja) | 2006-06-01 |
| MY146460A (en) | 2012-08-15 |
| CN1745119A (zh) | 2006-03-08 |
| KR20050107416A (ko) | 2005-11-11 |
| TWI320421B (en) | 2010-02-11 |
| KR100982123B1 (ko) | 2010-09-14 |
| CN1315905C (zh) | 2007-05-16 |
| WO2004074344A1 (ja) | 2004-09-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |