TW200419806A - MOSFET for open drain and semiconductor integrated circuit device using the same - Google Patents

MOSFET for open drain and semiconductor integrated circuit device using the same

Info

Publication number
TW200419806A
TW200419806A TW092134519A TW92134519A TW200419806A TW 200419806 A TW200419806 A TW 200419806A TW 092134519 A TW092134519 A TW 092134519A TW 92134519 A TW92134519 A TW 92134519A TW 200419806 A TW200419806 A TW 200419806A
Authority
TW
Taiwan
Prior art keywords
drain
static electricity
type impurity
impurity diffused
open drain
Prior art date
Application number
TW092134519A
Other languages
English (en)
Inventor
Hidetoshi Nishikawa
Masahiko Sonoda
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of TW200419806A publication Critical patent/TW200419806A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/0843—Source or drain regions of field-effect devices
    • H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66568—Lateral single gate silicon transistors
    • H01L29/66659—Lateral single gate silicon transistors with asymmetry in the channel direction, e.g. lateral high-voltage MISFETs with drain offset region, extended drain MISFETs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/7833—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's
    • H01L29/7835—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's with asymmetrical source and drain regions, e.g. lateral high-voltage MISFETs with drain offset region, extended drain MISFETs
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/08—Modifications for protecting switching circuit against overcurrent or overvoltage
    • H03K17/081—Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit
    • H03K17/0814—Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit by measures taken in the output circuit
    • H03K17/08142—Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit by measures taken in the output circuit in field-effect transistor switches

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
TW092134519A 2002-12-20 2003-12-08 MOSFET for open drain and semiconductor integrated circuit device using the same TW200419806A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002370525A JP3753692B2 (ja) 2002-12-20 2002-12-20 オープンドレイン用ｍｏｓｆｅｔ及びこれを用いた半導体集積回路装置

Publications (1)

Publication Number Publication Date
TW200419806A true TW200419806A (en) 2004-10-01

Family

ID=32588400

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092134519A TW200419806A (en) 2002-12-20 2003-12-08 MOSFET for open drain and semiconductor integrated circuit device using the same

Country Status (5)

Country Link
US (2) US6953969B2 (zh)
JP (1) JP3753692B2 (zh)
KR (1) KR101033724B1 (zh)
CN (1) CN1280921C (zh)
TW (1) TW200419806A (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4312451B2 (ja) * 2002-12-24 2009-08-12 Ｎｅｃエレクトロニクス株式会社 静電気保護素子及び半導体装置
JP4197660B2 (ja) * 2004-04-30 2008-12-17 ローム株式会社 Ｍｏｓトランジスタおよびこれを備えた半導体集積回路装置
JP4321444B2 (ja) * 2004-11-19 2009-08-26 パナソニック株式会社 Ｍｏｓ型ｆｅｔを備えたモータ駆動装置、ｍｏｓ型ｆｅｔ、及びｍｏｓ型ｆｅｔを備えたモータ
TW200814320A (en) * 2006-09-15 2008-03-16 Sanyo Electric Co Semiconductor device and method for making same
JP5386916B2 (ja) * 2008-09-30 2014-01-15 ソニー株式会社 トランジスタ型保護素子、半導体集積回路およびその製造方法
KR102164721B1 (ko) * 2014-11-19 2020-10-13 삼성전자 주식회사 반도체 장치

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0732237B2 (ja) * 1985-04-08 1995-04-10 エスジ−エス−トムソン マイクロエレクトロニクス インコーポレイテッド 静電放電入力保護回路
US5907462A (en) * 1994-09-07 1999-05-25 Texas Instruments Incorporated Gate coupled SCR for ESD protection circuits
JP3167931B2 (ja) * 1996-07-15 2001-05-21 インターナショナル・ビジネス・マシーンズ・コーポレ−ション Ｐｃカード及び周辺機器
JP3204168B2 (ja) 1997-07-22 2001-09-04 セイコーエプソン株式会社 半導体集積回路
US6144070A (en) * 1997-08-29 2000-11-07 Texas Instruments Incorporated High breakdown-voltage transistor with electrostatic discharge protection
US6002156A (en) * 1997-09-16 1999-12-14 Winbond Electronics Corp. Distributed MOSFET structure with enclosed gate for improved transistor size/layout area ratio and uniform ESD triggering
JP3191747B2 (ja) * 1997-11-13 2001-07-23 富士電機株式会社 Ｍｏｓ型半導体素子
US6657241B1 (en) * 1998-04-10 2003-12-02 Cypress Semiconductor Corp. ESD structure having an improved noise immunity in CMOS and BICMOS semiconductor devices
JP3899683B2 (ja) * 1998-06-12 2007-03-28 株式会社デンソー 横型ｍｏｓトランジスタ
GB9921068D0 (en) * 1999-09-08 1999-11-10 Univ Montfort Bipolar mosfet device
US6358781B1 (en) * 2000-06-30 2002-03-19 Taiwan Semiconductor Manufacturing Company Uniform current distribution SCR device for high voltage ESD protection
US6492208B1 (en) * 2000-09-28 2002-12-10 Taiwan Semiconductor Manufacturing Company Embedded SCR protection device for output and input pad
JP2002208644A (ja) * 2001-01-11 2002-07-26 Mitsubishi Electric Corp 半導体装置
US6489203B2 (en) * 2001-05-07 2002-12-03 Institute Of Microelectronics Stacked LDD high frequency LDMOSFET
TW495952B (en) * 2001-07-09 2002-07-21 Taiwan Semiconductor Mfg Electrostatic discharge protection device
KR100441116B1 (ko) * 2001-07-21 2004-07-19 삼성전자주식회사 낮은 트리거 전압에서 동작 가능한 반도체-제어 정류기구조의 정전 방전 보호 회로

Also Published As

Publication number Publication date
US20040119120A1 (en) 2004-06-24
JP3753692B2 (ja) 2006-03-08
KR101033724B1 (ko) 2011-05-09
US6953969B2 (en) 2005-10-11
KR20040055581A (ko) 2004-06-26
CN1510759A (zh) 2004-07-07
JP2004200601A (ja) 2004-07-15
US20050218457A1 (en) 2005-10-06
CN1280921C (zh) 2006-10-18

Similar Documents

Publication Publication Date Title
TW200509259A (en) Highly integrated semiconductor device with silicide layer that secures contact margin and method of manufacturing the same
ATE463048T1 (de) Komplementäre mis-vorrichtung
DE60222751D1 (de) Feldeffekttransistorstruktur und herstellungsverfahren
TW200625640A (en) Field effect transistor
TWI257166B (en) Circuit to improve ESD performance made by fully silicided process
TW200516717A (en) Structure and method of a strained channel transistor and a second semiconductor component in an integrated circuit
TW200633209A (en) Semiconductor device having transistor with vertical gate electrode and method of fabricating the same
TW200419803A (en) Transistors having buried p-type layers beneath the source region and methods of fabricating the same
TW200717777A (en) Semiconductor memory device and manufacturing method thereof
ATE515801T1 (de) Ladungsträger-extraktions-transistor
TW200644237A (en) High-voltage MOS device
TW200623327A (en) Semiconductor storage device, manufacturing method therefor and portable electronic equipment
TW200644248A (en) Semiconductor device and manufacturing method thereof
TW200620561A (en) Integrated circuit and method of fabricating the same
TW200500702A (en) Thin film transistor array panel and manufacturing method thereof
EP1143526A3 (en) Field effect transistor and method of manufacturing the same
TW200503268A (en) High voltage metal-oxide semiconductor device
TW200644221A (en) Method of forming an integrated power device and structure
TW200715563A (en) Semiconductor device and method for manufacturing the same
SG133477A1 (en) Method to enhance device performance with selective stress relief
WO2008008672A3 (en) Bi-directional mosfet power switch with single metal layer
TW200505030A (en) MOS type semi conductor device
TW200733386A (en) Semiconductor device
TW200614519A (en) Semiconductor device and method of manufacturing the same
TWI263334B (en) High voltage devices and method of fabricating the same