TW200419806A - MOSFET for open drain and semiconductor integrated circuit device using the same - Google Patents
MOSFET for open drain and semiconductor integrated circuit device using the sameInfo
- Publication number
- TW200419806A TW200419806A TW092134519A TW92134519A TW200419806A TW 200419806 A TW200419806 A TW 200419806A TW 092134519 A TW092134519 A TW 092134519A TW 92134519 A TW92134519 A TW 92134519A TW 200419806 A TW200419806 A TW 200419806A
- Authority
- TW
- Taiwan
- Prior art keywords
- drain
- static electricity
- type impurity
- impurity diffused
- open drain
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 230000005611 electricity Effects 0.000 abstract 5
- 239000012535 impurity Substances 0.000 abstract 5
- 230000003068 static effect Effects 0.000 abstract 5
- 230000003071 parasitic effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0843—Source or drain regions of field-effect devices
- H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66659—Lateral single gate silicon transistors with asymmetry in the channel direction, e.g. lateral high-voltage MISFETs with drain offset region, extended drain MISFETs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7833—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's
- H01L29/7835—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's with asymmetrical source and drain regions, e.g. lateral high-voltage MISFETs with drain offset region, extended drain MISFETs
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/08—Modifications for protecting switching circuit against overcurrent or overvoltage
- H03K17/081—Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit
- H03K17/0814—Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit by measures taken in the output circuit
- H03K17/08142—Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit by measures taken in the output circuit in field-effect transistor switches
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002370525A JP3753692B2 (ja) | 2002-12-20 | 2002-12-20 | オープンドレイン用mosfet及びこれを用いた半導体集積回路装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200419806A true TW200419806A (en) | 2004-10-01 |
Family
ID=32588400
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW092134519A TW200419806A (en) | 2002-12-20 | 2003-12-08 | MOSFET for open drain and semiconductor integrated circuit device using the same |
Country Status (5)
Country | Link |
---|---|
US (2) | US6953969B2 (zh) |
JP (1) | JP3753692B2 (zh) |
KR (1) | KR101033724B1 (zh) |
CN (1) | CN1280921C (zh) |
TW (1) | TW200419806A (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4312451B2 (ja) * | 2002-12-24 | 2009-08-12 | Necエレクトロニクス株式会社 | 静電気保護素子及び半導体装置 |
JP4197660B2 (ja) * | 2004-04-30 | 2008-12-17 | ローム株式会社 | Mosトランジスタおよびこれを備えた半導体集積回路装置 |
JP4321444B2 (ja) * | 2004-11-19 | 2009-08-26 | パナソニック株式会社 | Mos型fetを備えたモータ駆動装置、mos型fet、及びmos型fetを備えたモータ |
TW200814320A (en) * | 2006-09-15 | 2008-03-16 | Sanyo Electric Co | Semiconductor device and method for making same |
JP5386916B2 (ja) * | 2008-09-30 | 2014-01-15 | ソニー株式会社 | トランジスタ型保護素子、半導体集積回路およびその製造方法 |
KR102164721B1 (ko) * | 2014-11-19 | 2020-10-13 | 삼성전자 주식회사 | 반도체 장치 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0732237B2 (ja) * | 1985-04-08 | 1995-04-10 | エスジ−エス−トムソン マイクロエレクトロニクス インコーポレイテッド | 静電放電入力保護回路 |
US5907462A (en) * | 1994-09-07 | 1999-05-25 | Texas Instruments Incorporated | Gate coupled SCR for ESD protection circuits |
JP3167931B2 (ja) * | 1996-07-15 | 2001-05-21 | インターナショナル・ビジネス・マシーンズ・コーポレ−ション | Pcカード及び周辺機器 |
JP3204168B2 (ja) | 1997-07-22 | 2001-09-04 | セイコーエプソン株式会社 | 半導体集積回路 |
US6144070A (en) * | 1997-08-29 | 2000-11-07 | Texas Instruments Incorporated | High breakdown-voltage transistor with electrostatic discharge protection |
US6002156A (en) * | 1997-09-16 | 1999-12-14 | Winbond Electronics Corp. | Distributed MOSFET structure with enclosed gate for improved transistor size/layout area ratio and uniform ESD triggering |
JP3191747B2 (ja) * | 1997-11-13 | 2001-07-23 | 富士電機株式会社 | Mos型半導体素子 |
US6657241B1 (en) * | 1998-04-10 | 2003-12-02 | Cypress Semiconductor Corp. | ESD structure having an improved noise immunity in CMOS and BICMOS semiconductor devices |
JP3899683B2 (ja) * | 1998-06-12 | 2007-03-28 | 株式会社デンソー | 横型mosトランジスタ |
GB9921068D0 (en) * | 1999-09-08 | 1999-11-10 | Univ Montfort | Bipolar mosfet device |
US6358781B1 (en) * | 2000-06-30 | 2002-03-19 | Taiwan Semiconductor Manufacturing Company | Uniform current distribution SCR device for high voltage ESD protection |
US6492208B1 (en) * | 2000-09-28 | 2002-12-10 | Taiwan Semiconductor Manufacturing Company | Embedded SCR protection device for output and input pad |
JP2002208644A (ja) * | 2001-01-11 | 2002-07-26 | Mitsubishi Electric Corp | 半導体装置 |
US6489203B2 (en) * | 2001-05-07 | 2002-12-03 | Institute Of Microelectronics | Stacked LDD high frequency LDMOSFET |
TW495952B (en) * | 2001-07-09 | 2002-07-21 | Taiwan Semiconductor Mfg | Electrostatic discharge protection device |
KR100441116B1 (ko) * | 2001-07-21 | 2004-07-19 | 삼성전자주식회사 | 낮은 트리거 전압에서 동작 가능한 반도체-제어 정류기구조의 정전 방전 보호 회로 |
-
2002
- 2002-12-20 JP JP2002370525A patent/JP3753692B2/ja not_active Expired - Fee Related
-
2003
- 2003-12-05 KR KR1020030087900A patent/KR101033724B1/ko not_active IP Right Cessation
- 2003-12-08 TW TW092134519A patent/TW200419806A/zh unknown
- 2003-12-10 US US10/730,995 patent/US6953969B2/en not_active Expired - Fee Related
- 2003-12-11 CN CNB200310120414XA patent/CN1280921C/zh not_active Expired - Fee Related
-
2005
- 2005-05-24 US US11/135,672 patent/US20050218457A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
KR101033724B1 (ko) | 2011-05-09 |
KR20040055581A (ko) | 2004-06-26 |
US20040119120A1 (en) | 2004-06-24 |
CN1280921C (zh) | 2006-10-18 |
US20050218457A1 (en) | 2005-10-06 |
US6953969B2 (en) | 2005-10-11 |
JP2004200601A (ja) | 2004-07-15 |
CN1510759A (zh) | 2004-07-07 |
JP3753692B2 (ja) | 2006-03-08 |
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