200409924 玖、發明說明： [發明所屬之技術領域] 本發明，係關於檢查配線基板之檢查裝置及檢查方法 ’特別是可進行高可靠性檢查之檢查裝置及檢查方法。 [先前技術] 一般’液晶顯示裝置，具備液晶面板、具可撓性之配 線基板、以及液晶面板之顯示控制用積體電路裝置。顯示 控制用積體電路裝置，係裝載在配線基板的狀態下，粘貼 在液晶面板之顯示領域的周圍，透過該配線基板上之顯示 控制用積體電路裝置，來連接以液晶面板内部之薄膜電晶 體所構成之顯不電路，與位於液晶面板外部、用來控制液 晶面板之顯示的控制電路。 然後’由外部之控制電路所輸入之訊號驅動顯示控制 用積體電路裝置’ ϋ由其所輸出之輸出訊號，來控制液晶 面板的顯不。其結果’將既定之文字及圖形顯示於液晶面 板0 在檢查此種液晶顯示裝置時，將顯示控制用積體電路 裝置實際裳載在配線基板，取代控制電路，藉由檢查裝置 來使顯示控制用積體電路裝置動作，將測試用圖案顯示於 液晶面板，觀其狀態即可判斷好壞。 以本發明之先前技術文獻而言，有曰本專利特開平 11-202278 號公報。 然而’將顯示控制用積體 實際地連接於液晶面板時，將 電路裝置裝載於配線基板， 無法進行配線基板單獨之可 200409924 靠性測試。200409924 发明 Description of the invention: [Technical field to which the invention belongs] The present invention relates to an inspection device and an inspection method for inspecting a wiring board, and particularly to an inspection device and an inspection method capable of inspecting a high reliability. [Prior art] Generally, a liquid crystal display device includes a liquid crystal panel, a flexible wiring substrate, and a integrated circuit device for display control of a liquid crystal panel. The integrated circuit device for display control is mounted on a wiring substrate, and is pasted around the display area of the liquid crystal panel. The integrated circuit device for display control on the wiring substrate is used to connect the thin film electricity inside the liquid crystal panel. A display circuit composed of a crystal and a control circuit located outside the liquid crystal panel and used to control the display of the liquid crystal panel. Then, "integrated circuit device for display control is driven by a signal input from an external control circuit" ϋ The output signal output by it controls the display of the liquid crystal panel. As a result, “the predetermined characters and graphics are displayed on the liquid crystal panel. 0 When inspecting such a liquid crystal display device, the integrated circuit device for display control is actually mounted on the wiring board instead of the control circuit, and the display device is controlled by the inspection device. The integrated circuit device is operated, and the test pattern is displayed on the liquid crystal panel, and the state can be judged whether it is good or bad. In terms of the prior art documents of the present invention, there is Japanese Patent Laid-Open No. 11-202278. However, when the display control assembly is actually connected to a liquid crystal panel, the circuit device is mounted on a wiring substrate, and the reliability test of the wiring substrate alone cannot be performed.
之狀態不同之電壓訊號，而益 上，亦會施加與裝載在液晶面板 而無法進行反映出實際動作狀態 之可靠性測試。因此，會產生在此種可靠性測試下為良品 ’但實際使用時卻為不良品的問題。 本發明係為解決上述習知技術之問題，其目的在提供 一種檢查裝置及檢查方法，可以將與實際動作狀態相同的 訊號’施加於配線基板的訊號線來進行可靠性測試。 又，另一目的，係提供一種能簡便且高精度地進行裝 載於液晶面板之配線基板的檢查技術。 [發明内容] 為解決上述課題，本發明之配線基板檢查裝置，具備 :複數個接觸探針，其能分別以丨支以上抵接於檢查對象 之配線基板所具有之複數條訊號線；以及檢查電路，係透 過前述接觸探針，將既定波形之電壓訊號施加於前述訊號 線’在前述訊號線中，檢測流經欲量測訊號線之電流。 本發明之配線基板檢查裝置，具備檢查用臨時配線裝 置’其係裝載於前述檢查對象之配線基板，將前述訊號線 中既定之訊號線間加以連接。 本發明之配線基板檢查裝置，具備用來加熱前述配線 基板之加熱裝置。 200409924 本發明之配線基板之檢查方法，係用來檢查配線基板 了 /、備4數條戒號線與裝載區域，將積體電路裝置裝載 於别述裝載區域時，前述積體電路裝置之内部電路與前述 :il唬線幵y成連接’其特徵在於··取代前述積體電路裝置， 將k查用&^ k配線裝置裝載於前述裝載區域，透過前述檢 查用臨k gi線裝置所具有之内部配線使前述訊號線間連接 在以4述内部配線連接之2條以上的前述訊號線間，施 加既定之檢查訊號。 本發明之配線基板的檢查方法，係施加矩形波之電壓 來作為前述檢查訊號，以檢測流經之電流。 本發明之構成如上，取代實際使用之液晶顯示控制用 的積體電路裝置，將檢查用臨時配線裝置裝載於裝載區域 ，藉由檢查用臨時配線裝置所具有之内部配線，使配線基 板所具有之訊號線彼此連接。 承上所述，由於一條訊號線係透過内部配線連接於另 一條或二條以上之訊號線，因此即使在一條訊號線僅能抵 接一條接觸探針之情形時，亦能將接觸探針分別抵接於藉 由内部配線所連接之二條以上之各訊號線，以施加既定之 訊號。 藉由測定電壓及電流，可檢測出訊號線間之短路狀態 、以及訊號線之斷路等開放狀態的不良情形。 施加電壓時，將測定對象之配線基板，置於高溫或高 溫高濕狀態下，即能進行可靠性測試。 [實施方式] 7 200409924 圖4之符號10，係表示檢查對象之配線基板。 該配線基板1 0，係具有可撓性之撓性配線基板，具有 由樹脂薄膜所構成之基片（basefilm)l 1，以及分別由金屬配 線構成之複數條輸出訊號線1 3與輸入訊號線1 4。 該配線基板1 〇的兩端，一端的寬度廣，另一端的寬度 窄。又’在基片Η的中央位置，設有裝載區域12,各輸 出訊號線1 3，係一端設置於裝載區域丨2内，另一端設置 於基片1 1之寬度較廣端部，另一方面，各輸入訊號線， 係一端設置於裝載區域12内，另一端設置於基片n之寬 度較窄的端部。 由於輸出汛號線13須要多條線，因此係設置成多於輸 入Λ號線14，在裝載區域12内，輸出訊號線1 3之配線寬 度及間距，小於輸入訊號線14。 在基片11之輸出訊號線1 3與輸入訊號線14設置面的 表面σ °又有未圖不之保護膜，所有的輸出訊號線1 3及輸 入Λ號線14 ’皆係在兩端露出的狀態下，被保護膜覆蓋其 表面 ° 八 此’所有的輸出訊號線13，位於裝載區域12内ό 部分與位於基片i^命 之較見端部的部分其表面係露出，戶 有的輸入訊號線14， 、 與位於基片11之較窄〇 ,立於裝載區域12内的部； 乂乍立而邛的部分其表面係露出。 各訊號線13 14 + #， ，盘、， 之鉻出部分在裝載區域12内的位3 /、裝载於裝載區域一 置的外部端子位詈支 t心控制用半導體積體電路！ 相對應，透過異方導電性臈將半導體 200409924 裳置設置在裝载區域121，予以加熱及施壓後， :導體積體電路裝置之外部端子即會機械性、電氣性地連 接於各訊號線13, 14的 ^ ^ ^ AA ^ 路出口p刀，其結果，半導體積體電 路裝置的内部電路，即電氣連接於各訊號線13，… 基片11之端部中，鲂空4 七7么m 4 ..1乂乍的一方係用來連接於電源及控 制虞置側之端部，各輪 ^ v 翰入δίι唬14之端部表面露出，以該 邛为連接於電腦本體等之外部控制電路。 …另面，相反側之較寬的-方，係用來連接於由液 日日反之薄版電晶體等所構成之内部電路側之端部。 ^因此，I載於裝載領域12之半導體積體電路裝置，係 :由輸出訊號、線13與液晶面板連接，藉由輸入訊號線14 '連接於電源及控制電路等外部電路。 圖5，為檢查用臨時配線裝置2〇内部之俯視圖。 一、4榀查用臨時配線裝置2〇，與裝載於裝載領域12之 半導體積體電路裝置之外部端子的配置圖案㈣，此外， 外觀上形狀及大小亦相同，係取代顯示控制用之半導體積 體電路裝置，連接於檢查對象之配線基板丨〇的裝載區域 1 2 ’如後述般用於配線基板丨〇之檢查。 此檢查用臨時配線裝置20 ,具有1條或2條以上之内 部配線21，在將檢查用臨時配線裝置2〇裝載於裂載區域 12 Hi , 、’内部配線21，係連接於由輸出訊號線1 3與輸入訊 戒線14所構成之訊號線13, 14之2條以上的訊號線ΐ3, μ 。亦即，藉由此内部配線21，將2條或3條以上之訊號線 13，14彼此連接。此處，舉一例而言，係藉由複數條内部 200409924 、友21將相鄰之2條輪出訊號線13彼此連接，又，將 相鄰之2條輸入訊號線14彼此連接。 如圖2所不，將檢查用臨時配線裝置20裝載於配線基 之衣載區域12，將内部配線2 1連接於輸出訊號線 13及輸入Λ號線14，將配線基板1〇設置在檢查用台架。 圖1之符戒30，為檢查裝置本體，其具有電路基板31 與接觸探針3 3，；&紹# ^ 接觸奴針33之設置數量，大於輸出訊號 、、、13與輸入訊號線14的總數。 ;电路基板3 1上，裝載由產生液晶驅動用訊號之波形 產生用半導體裝置34 #的電子零件所構成之檢查用電路 各接觸彳木針33係電氣連接於檢查用電路32。 在裝載有檢查用臨時配線裝置2〇之配線基板ι〇的所 f 號線13的露出部分與所有輸人訊號線14的露出 p刀α抵接1支接觸探針33之前端時，所有的訊?卢線 13，14即透過接觸探針33連接於檢查電路32。 ^ 圖所不，在該狀態下，以連結棒42將檢杳用美板 41與電路基板31力、土 ’饱宜用基板 、 加以連結，將其設置在測試爐45内部。 在測試爐4 5夕卜却 ^ 該狀態下之本有檢測用電腦38,符號2,係在 内設有檢查^ 個配線基板檢查裝置例，測試爐45 接器37,將電腦二3°，透過設置在電路基板31上之連 8與檢查用電路32加以連接。 在測試爐45 ^ 試器47,使儲存於：内藏加熱裝置及加濕11之環境測 環境測試器47 “丨^ 38之岐檢_式動作，藉由該 、d试爐45内調整成既定溫度、既定濕度 10 200409924 ’在：為維持該狀態之恆溫恆濕後，令檢查用電路32產 生既定波形的檢查訊號，透過接觸探# 33，施加於輸出訊 號線13與輸人訊號線u並持續_定時間。此處，係使用 矩形波之電壓來作為檢查訊號。 k查电路32内設有電壓檢測器及電流檢測器，在施加 矩形波之k查说娩期間，檢測流經既定訊號線丨3，14間的 電流及出現的電壓。 將此檢測持續一定時間、或間斷性地進行，將這些結 果傳送至電腦3 8，判斷好壞。 例如，當檢測出各訊號線13, 14中，在檢查用臨時配 線裝置20之内部短路之訊號線13, 14帛&無電流流動時 ，即可知道因發生斷線及導通不良，該裝置即為不良。 相反的，當檢測出檢查用臨時配線裝置2〇内部未連接 之訊號線1 3，14間有電流開始流動時，即可判斷出發生短 路導致不良。 如妯所述，電腦3 8依據送來之訊號，判斷該檢查對象 之配線基板1 〇的好壞。 若此處檢測之檢查對象配線基板1〇為不良時，由於可 預測在同一製程中所製造之配線基板的不良率高，故可將 之拋棄或者進行篩選，以除去不良品及其可能性高之製品 〇 如前所述，由於本發明之檢查裝置2，係在檢查對象 配線基板1〇裝載檢查用臨時配線裝置20，，因此藉由改 變檢查用臨時配線裝置20之内部配線21之圖案，即能將 200409924 輸出訊號線13與輸入訊號線14中既定之訊號線13, 14加 以連接，在其間施加既定波形之訊號。 因此，對於各種圖案之配線基板之各訊號線，可施加 與實際動作時相同之電壓波形的訊號。 又，由於可施加與實際作動時相同之電壓波形於配線 基板之§fl唬線，並同時進行加熱或者加熱、加濕等之加速 測試，故得到之測試結果，可相當程度反映出實際之不良 結果。 以上，雖係使用如圖6a所示之矩形波的電壓來作為檢籲 查汛號，但只要是能施加與實際作動時相同波形之訊號即 可，例如，對在實際作動中係施加正弦波訊號之訊號線， 可施加如圖6b所示之正弦波電壓，對施加脈衝狀訊號之 訊號線’可施加脈衝狀之電壓。 又，在上述實施例中，雖係對各訊號線13，14分別抵 接1支接觸探針33，但若可能的話，也可抵接2支以上。 又，在上述實施例中，雖係就以撓性配線基為檢查對 象，來作為配線基板1 〇之情形作了說明，但本發明之配_ 線基板檢查裝置及配線基板之檢查方法，並不限於以撓性 配線板為對象之情形，亦包含在玻璃薄板上形成金屬配線 膜之配線基板等，不具有可撓性者。 由於能將檢查訊號直接施加於配線基板之訊號線，因 此藉由使檢查訊號具有與實際作動時相同之波形，即能將 配線基板設定在與實際作動相近之狀態。因此，可以在與 實際動作相近之狀態下，進行可靠性測試。 12 200409924 【圖式簡單說明】 (一）圖式部分 第1圖’係用來說明檢查裝置本體的圖。 第2圖’係用來說明檢查用基板及檢查用臨時配線裝 置的圖。 第3圖’係用來說明本發明之檢查裝置的圖。 第4圖’係檢查對象之配線基板的俯視圖。 第5圖’係用來說明檢查用臨時配線裝置之内部配線 的圖。 第6a圖，係矩形波之訊號波形。 第6b圖，係正弦波之訊號波形。 (二）元件代表符號 2 10 11 12 13，14 20 21 30 31 32 33 34 配線基板檢查裝置 配線基板 基片Voltage signals with different states are beneficially applied to and mounted on the LCD panel and cannot perform reliability tests that reflect the actual operating state. Therefore, there is a problem that the product is a good product under such a reliability test, but is a defective product in actual use. The present invention is to solve the problems of the above-mentioned conventional technology, and an object thereof is to provide an inspection device and an inspection method, which can apply the same signal as the actual operation state to signal lines of a wiring substrate for reliability testing. Yet another object is to provide an inspection technique capable of easily and accurately mounting a wiring substrate mounted on a liquid crystal panel. [Summary of the Invention] In order to solve the above-mentioned problems, the wiring board inspection device of the present invention includes: a plurality of contact probes, each of which can abut a plurality of signal lines on the wiring board to be inspected by the inspection object; and inspection The circuit is to apply a voltage signal of a predetermined waveform to the aforementioned signal line through the aforementioned contact probe. In the aforementioned signal line, the current flowing through the desired signal line is detected. The wiring board inspection device of the present invention includes a temporary wiring device for inspection ', which is mounted on the wiring board to be inspected and connects predetermined signal lines among the signal lines. A wiring board inspection device of the present invention includes a heating device for heating the wiring board. 200409924 The method for inspecting the wiring substrate of the present invention is used to inspect the wiring substrate. There are four ring lines and a loading area. When the integrated circuit device is mounted in another loading area, the inside of the foregoing integrated circuit device The circuit is connected to the aforementioned: Il line 幵 y, which is characterized in that: instead of the integrated circuit device described above, the k-check & ^ k wiring device is mounted in the aforementioned loading area, and passed through the aforementioned inspection-related line The internal wiring is provided so that the aforementioned signal lines are connected between two or more of the aforementioned signal lines connected by the aforementioned internal wiring, and a predetermined inspection signal is applied. The inspection method of the wiring substrate of the present invention is to apply a rectangular wave voltage as the aforementioned inspection signal to detect the current flowing therethrough. The structure of the present invention is as described above. Instead of the integrated circuit device for liquid crystal display control actually used, the temporary wiring device for inspection is mounted in the loading area, and the internal wiring provided by the temporary wiring device for inspection makes the wiring board possess The signal lines are connected to each other. As mentioned above, since one signal line is connected to another or two or more signal lines through internal wiring, even when one signal line can only abut one contact probe, the contact probes can be individually resisted. Connect to two or more signal lines connected by internal wiring to apply a predetermined signal. By measuring the voltage and current, short-circuit conditions between signal lines and open conditions such as open circuit of signal lines can be detected. When a voltage is applied, the wiring board to be measured is placed in a high-temperature or high-temperature and high-humidity state, and the reliability test can be performed. [Embodiment] 7 200409924 Reference numeral 10 in FIG. 4 indicates a wiring board to be inspected. The wiring substrate 10 is a flexible flexible wiring substrate having a base film 11 made of a resin film, and a plurality of output signal lines 13 and input signal lines each made of metal wiring. 1 4. Both ends of this wiring substrate 10 have a wide width at one end and a narrow width at the other end. In the center of the substrate Η, there is a loading area 12, and each output signal line 1 3, one end is arranged in the loading area 丨 2, and the other end is arranged in a wider end of the substrate 1 1 and the other In one aspect, one end of each input signal line is disposed in the loading area 12 and the other end is disposed at the narrower end of the substrate n. Since the output flood line 13 requires multiple lines, it is set to be more than the input Λ line 14. In the loading area 12, the wiring width and spacing of the output signal line 13 is smaller than the input signal line 14. On the surface σ ° where the output signal line 13 and input signal line 14 of the substrate 11 are arranged, there is also a protective film (not shown). All output signal lines 13 and input Λ line 14 ′ are exposed at both ends. In the state, the surface is covered by a protective film. All of the output signal lines 13 are located in the loading area 12 and the part at the end of the substrate i ^ is exposed. The surface is exposed. The input signal line 14 is relatively narrower than the substrate 11 and stands in a portion of the loading area 12; the surface of the part which stands at first is exposed. Each signal line 13 14 + #, chrome, disk, chrome out part in the loading area 12/3, the external terminal is installed in the loading area to support the semiconductor integrated circuit for core control! Correspondingly, the semiconductor 200409924 is placed in the loading area 121 through the anisotropic conductivity. After heating and pressure, the external terminals of the conductive circuit device will be mechanically and electrically connected to the signal lines. 13, 14 ^ ^ ^ AA ^ road exit p knife, as a result, the internal circuit of the semiconductor integrated circuit device, that is, is electrically connected to each signal line 13, ... At the end of the substrate 11, empty 4 7 7? The side of m 4 ..1 is used to connect to the end of the power supply and control side, and the surface of each end of the wheel ^ v 入 入 δίι14 is exposed, and this 邛 is connected to the outside of the computer body and so on. Control circuit. … On the other hand, the wider -square on the opposite side is used to connect to the end of the internal circuit side composed of thin-film transistors and so on. ^ Therefore, the semiconductor integrated circuit device I contained in the loading area 12 is connected to the liquid crystal panel by the output signal, line 13 and connected to external circuits such as power supply and control circuit through the input signal line 14 '. FIG. 5 is a plan view of the inside of the temporary wiring device 20 for inspection. 1. Temporary wiring device 20 for inspection, the arrangement pattern of the external terminals of the semiconductor integrated circuit device 12 mounted in the loading area 12, and the appearance and shape are also the same. It replaces the semiconductor device for display control. The bulk circuit device is connected to the load substrate 12 of the wiring substrate 1 to be inspected as described later for the inspection of the wiring substrate 1 0. The temporary wiring device 20 for inspection has one or two or more internal wirings 21, and the temporary wiring device 20 for inspection is installed in the crack load area 12 Hi, and the 'internal wiring 21' is connected to the output signal line There are more than two signal lines 13 and 14 composed of 1 3 and input signal line 14; 3, μ. That is, by this internal wiring 21, two or more signal lines 13, 14 are connected to each other. Here, for example, two adjacent outgoing signal lines 13 are connected to each other through a plurality of internal 200409924 and You 21, and two adjacent input signal lines 14 are connected to each other. As shown in FIG. 2, the temporary wiring device 20 for inspection is mounted in the clothing-loading area 12 of the wiring base, the internal wiring 21 is connected to the output signal line 13 and the input Λ line 14, and the wiring substrate 10 is set for inspection. Bench. The ring 30 in FIG. 1 is the main body of the inspection device, which has a circuit substrate 31 and a contact probe 33, and the number of contact pins 33 is greater than the output signal, 13 and 13 and the input signal line 14. total. The circuit board 31 is provided with an inspection circuit composed of electronic components that generate a waveform of a liquid crystal drive signal and a semiconductor device 34 # for generation. Each contact pin 33 is electrically connected to the inspection circuit 32. When the exposed portion of the f-number line 13 on which the wiring substrate 20 of the inspection temporary wiring device 20 is mounted and the exposed p-kn of all the input signal lines 14 abut the front end of one contact probe 33, all The signal wires 13 and 14 are connected to the inspection circuit 32 through the contact probe 33. ^ As shown in the figure, in this state, the inspection board 41 and the circuit substrate 31 are connected by a connecting rod 42 to connect the substrate and the substrate 31, and the test board 45 is installed inside the test furnace 45. In the test furnace 45, there is a test computer 38 in this state, symbol 2, which is equipped with an inspection device for wiring board inspection, including a test furnace 45 connector 37 and a computer 3 °, The inspection circuit 32 is connected through the connection 8 provided on the circuit substrate 31. In the test furnace 45 ^ tester 47, stored in: the built-in heating device and humidifier 11 environmental test environment tester 47 "丨 ^ 38 of the kimono__ action, by adjusting the test furnace 45 into Predetermined temperature and predetermined humidity 10 200409924 'After: in order to maintain the constant temperature and humidity in this state, the inspection circuit 32 causes the inspection signal of a predetermined waveform to be applied to the output signal line 13 and the input signal line through the probe # 33. It lasts for a fixed time. Here, the voltage of the rectangular wave is used as the inspection signal. The k-check circuit 32 is provided with a voltage detector and a current detector. The current and voltage appearing between signal lines 丨 3, 14. This test is continued for a certain period of time or intermittently, and these results are transmitted to the computer 3 8 to determine whether it is good or bad. For example, when each signal line 13 is detected, In 14, when there is no current flowing through the internal short-circuit signal lines 13, 14 帛 in the temporary wiring device 20 for inspection, it can be known that the device is defective due to disconnection and poor conduction. On the contrary, when it is detected Inspection temporary wiring When there is a current flowing between the signal lines 1 3 and 14 that are not connected inside the device 20, it can be judged that the short circuit caused the failure. As mentioned above, the computer 38 judges the wiring substrate of the inspection object based on the signal sent. The quality of 1 〇. If the inspection target wiring board 10 is defective, the wiring board manufactured in the same process can be predicted to have a high defect rate, so it can be discarded or screened to remove Good products and highly probable products. As described above, since the inspection device 2 of the present invention is loaded with the temporary wiring device 20 for inspection on the inspection target wiring substrate 10, it is necessary to change the temporary wiring device 20 for inspection. The pattern of the internal wiring 21 can connect the 200409924 output signal line 13 to the predetermined signal lines 13 and 14 of the input signal line 14 and apply a signal of a predetermined waveform therebetween. Therefore, for each signal line of the wiring substrate of various patterns , Can apply the same voltage waveform signal as in actual operation. Also, because the same voltage waveform as in actual operation can be applied to the wiring board. Line, and at the same time perform accelerated testing of heating or heating, humidification, etc., so the test results obtained can reflect the actual bad results to a considerable extent. Although the voltage of the rectangular wave as shown in Figure 6a is used as a test I want to check the flood signal, but it only needs to apply a signal with the same waveform as the actual operation. For example, for a signal line that applies a sine wave signal during actual operation, a sine wave voltage as shown in Figure 6b can be applied. A pulsed voltage signal line can be used to apply a pulsed voltage. In the above-mentioned embodiment, although each of the signal lines 13 and 14 abuts a contact probe 33, it can also be used if possible. Connect more than 2. In the above-mentioned embodiment, although the flexible wiring substrate is used as the inspection object as the wiring substrate 10, the wiring board inspection device and wiring substrate of the present invention are described. The inspection method is not limited to the case where a flexible wiring board is used, and also includes a wiring board in which a metal wiring film is formed on a thin glass plate, etc., which is not flexible. Since the inspection signal can be directly applied to the signal line of the wiring board, the wiring board can be set to a state close to the actual action by making the inspection signal have the same waveform as that during the actual action. Therefore, the reliability test can be performed in a state close to the actual operation. 12 200409924 [Brief description of the drawings] (I) Schematic part The first figure 'is a diagram for explaining the main body of the inspection device. Fig. 2 'is a diagram for explaining a substrate for inspection and a temporary wiring device for inspection. Fig. 3 'is a diagram for explaining the inspection apparatus of the present invention. Fig. 4 'is a plan view of a wiring substrate to be inspected. Fig. 5 'is a diagram for explaining the internal wiring of the temporary wiring device for inspection. Figure 6a shows the signal waveform of a rectangular wave. Figure 6b shows the signal waveform of a sine wave. (II) Symbols for component 2 10 11 12 13, 14 20 21 30 31 32 33 34 Wiring board inspection device Wiring board Substrate
裝載區域 訊號線 檢查用臨時配線裝置 内部配線 檢查裝置本體 電路基板 檢查用電路 接觸探針 半導體裝置 13 200409924 37 連接器 38 檢測用電腦 41 檢查用基板 42 連結棒 45 測試爐 47 環境測試器Loading area Signal wiring Inspection temporary wiring device Internal wiring Inspection device body Circuit board Inspection circuit Contact probe Semiconductor device 13 200409924 37 Connector 38 Testing computer 41 Inspection board 42 Connecting rod 45 Test furnace 47 Environmental tester
1414