TWI752928B - Inspection jig, inspection jig set, and substrate inspecting apparatus - Google Patents

Abstract

Provided are an inspection jig, an inspection jig set and a substrate inspection apparatus capable of subjecting temperature stress to a substrate of an inspection object as well as reducing inspection time. An inspection jig 3D is an inspection jig 3D for inspecting a substrate 100 of an inspection object, which is set with inspection points P1, the inspection jig 3D including probes Pr for contacting with the inspection points P1, and a contacting surface B1 for contacting with the substrate 100, the inspection jig 3D further including a heating block 35D for heating the substrate 100 by heating the contacting surface B1.

Description

Inspection aids, inspection aid kits, and substrate inspection devices

The present invention relates to an inspection aid, a kit of inspection aids, and a substrate inspection device for contacting a probe with a substrate.

Conventionally, there has been known a board inspection apparatus for inspecting the continuity of wiring patterns formed on substrates such as printed wiring boards, the presence or absence of defective short circuits between wiring patterns, or the resistance between wiring patterns and wiring patterns. For board inspection of value, etc., for example, a movable inspection contact, a plurality of inspection contacts held in a multi-pin shape, etc., are brought into contact with a plurality of pads, lands, etc. formed on the wiring pattern. The inspection point is used to measure the resistance between the inspection points on the inspection target wiring pattern, thereby performing the board inspection.

In such a substrate, for example, the contact between the wiring pattern and the via hole may be incomplete, and the contact state may be unstable even though it is conductive. In such a defect, it is judged that there is continuity between inspection points at the time of inspection, and it is regarded as a good product and assembled into a product, and then the defect may appear due to the thermal stress of the use environment. In particular, in the interior of the substrate, due to the incomplete connection of the buried vias between the wiring patterns The contact defect cannot be visually inspected from the outside of the substrate, so it is difficult to detect it by inspection.

In this regard, an inspection apparatus has been proposed (for example, Patent Document 1), which uses a preheating chamber to heat a space in which a substrate to be inspected is placed and exposes the substrate to a high temperature environment during substrate inspection (for example, Patent Document 1). This kind of incomplete contact is detected by applying thermal stress to inspect it.

(prior art literature) (patent literature)

Patent Document 1: Japanese Patent Laid-Open No. 2001-215257

However, the inspection apparatus using the preheating chamber to heat the placement space of the substrate to be inspected to apply thermal stress to the substrate as described above has the disadvantage that the inspection time is greatly increased due to the time-consuming heating of the substrate.

An object of the present invention is to provide an inspection aid, an inspection aid set, and a substrate inspection apparatus capable of shortening inspection time while applying thermal stress to a substrate to be inspected.

An inspection aid of the present invention is an inspection aid for inspecting a substrate on which an inspection point of an inspection object is set. The inspection aid is provided with: a probe for contacting the inspection point; The substrate is heated by heating the contact surface in contact with the contact surface of the substrate.

According to this configuration, since the substrate can be heated by heating the contact surface in contact with the substrate, it is easier to heat the substrate in a short time than heating the substrate by using a preheating chamber to heat the placement space of the substrate. Therefore, the inspection time can be shortened while applying thermal stress to the substrate to be inspected.

Furthermore, the substrate has a first surface and a second surface, the inspection points are set on the first surface and the second surface, the probes are in contact with the inspection points on the first surface, and the contact surfaces are in contact with each other. The first surface of the region in which the inspection point is set on the second surface of the substrate has a shape separated from the inspection point of the first surface.

According to this configuration, since the region where the inspection point of the substrate is set can be heated from the back side of the surface where the inspection point is set, the substrate can be heated while reducing the risk of heating of the probe for contacting the inspection point.

Furthermore, preferably, the heating portion includes: a metal member having the contact surface and having a thickness in a direction orthogonal to the contact surface; and a heater extending substantially parallel to the contact surface on the contact surface within the thickness of the metal member.

According to this configuration, the heat generated by the heater can be efficiently conducted to the metal member, and the entire contact surface can be heated so as to conduct the heat uniformly.

Furthermore, it is preferable that the inspection aid further includes: a support member for supporting the probe; and a base for integrally supporting the support member and the heating part, the heating part and the base are connected through a connected with a heat insulating heat insulating material.

According to this configuration, since the risk of the heat generated by the heating portion escaping to the base can be reduced, the substrate can be heated quickly and efficiently. Furthermore, the risk of the probe being heated through the substrate can be reduced.

The inspection aid kit of the present invention is provided with the above-mentioned inspection aid and an inspection aid for the second surface of the substrate, wherein the second surface inspection aid is provided with: a probe for the second surface, a an inspection point in contact with the second surface; and a heating unit for the second surface having a contact surface for the second surface for contacting the second surface of the substrate, and heating the contact surface for the second surface by heating the contact surface for the second surface. The substrate is heated; the contact surface for the second surface is in contact with the second surface of the substrate in the region where the inspection point is set on the first surface, and has a shape separated from the inspection point of the second surface.

According to this inspection aid kit, the substrate can be heated and inspected from both sides of the substrate.

Furthermore, the inspection aid kit of the present invention is used for inspecting a substrate having a first surface and a second surface and an inspection point of an inspection object is set on the first surface, and the inspection aid kit includes: a probe A needle aid having a probe for contacting the inspection point on the first surface; and a heating aid having a contact surface for contacting the second surface of the substrate, heated by heating the contact surface the aforementioned substrate.

According to this configuration, the substrate can be heated by heating the contact surface that is in contact with the substrate by the heating aid, and the substrate can be inspected by the probe aid, compared with the use of a preheating chamber to heat the placement space of the substrate. way to heat the substrate, it is easier to heat the substrate in a short time. Therefore, the inspection time can be shortened while applying thermal stress to the substrate to be inspected. Furthermore, since the area where the inspection point of the substrate is set can be heated from the back side of the surface where the inspection point is set, the substrate can be heated while reducing the risk of heating of the probe for contacting the inspection point.

Further, a substrate inspection apparatus of the present invention includes: the inspection aid; and an inspection processing unit for bringing the probes into contact with the inspection points and bringing the contact surfaces into contact with the substrate, and based on the information obtained from the probes. The inspection of the above-mentioned substrate is carried out according to the electrical signal.

According to this configuration, when the substrate can be heated by heating the contact surface in contact with the substrate, the probe can be used to inspect the substrate, and the substrate can be heated more easily than by using a preheating chamber to heat the placement space of the substrate. The substrate is heated for a short period of time. Therefore, the inspection time can be shortened while applying thermal stress to the substrate to be inspected.

Furthermore, a substrate inspection apparatus according to the present invention includes: the inspection aid set; and an inspection processing unit for bringing the probes into contact with the inspection points on the first surface, and bringing the contact surface into contact with the substrate on the first surface. The first surface in the region of the inspection point is set on both surfaces, and the probe for the second surface is brought into contact with the inspection point of the second surface, and the contact surface for the second surface is brought into contact with the substrate in the substrate. The first surface is provided with the second surface in the region of the inspection point, and the inspection of the substrate is performed based on electrical signals obtained from the probe and the probe for the second surface.

According to this configuration, even when inspection points are set on both sides of the substrate, the contact surfaces on both sides of the substrate can be heated to the second contact surface. It is easier to heat the substrate in a short time than using a preheating chamber to heat the substrate placement space by heating the substrate by surface-to-surface contact, and the probes and the second surface can be contacted with the probes on the inspection points on both sides to inspect the substrate. Internal heating of the substrate. Therefore, the inspection time can be shortened while applying thermal stress to the substrate to be inspected. Furthermore, since the area where the inspection point of the substrate is set can be heated from the back side of the surface where the inspection point is set, it is possible to reduce the risk of heating the probe for contacting the inspection point and the probe for the second surface. under heating the substrate.

Furthermore, the substrate inspection apparatus of the present invention includes: the above-mentioned inspection aid set; and an inspection processing unit that makes the probes come into contact with the inspection points on the first surface and the contact surfaces come into contact with the second surface, and The inspection of the aforementioned substrate is performed based on the electrical signal obtained from the probe.

According to this configuration, since the substrate can be heated by heating the contact surface in contact with the substrate, it is easier to heat the substrate in a short time than heating the substrate by using a preheating chamber to heat the placement space of the substrate. Therefore, the inspection time can be shortened while applying thermal stress to the substrate to be inspected. Furthermore, since the area where the inspection point of the substrate is set can be heated from the back side of the surface where the inspection point is set, the substrate can be heated while reducing the risk of heating of the probe for contacting the inspection point.

1‧‧‧Board Inspection Device

2. 2’‧‧‧Inspection aid set

3D‧‧‧Inspection Aids

3D’‧‧‧Heating Aids

3U‧‧‧Inspection aids (inspection aids for the second side)

3U’‧‧‧Probe Aids

4. 4D, 4U‧‧‧Inspection Department

6‧‧‧Substrate fixing device

8‧‧‧Inspection and Processing Department

9‧‧‧Temperature Control Section

30D, 30U‧‧‧Probe block

31D, 31U‧‧‧Support block

31Da, 31Db, 31Ua, 31Ub‧‧‧Support Plate

34‧‧‧Wiring

34a‧‧‧electrode

35D‧‧‧heating block (heating part)

35U‧‧‧heating block (heating part for the second side)

36‧‧‧Insulation components

37‧‧‧Pillar

100‧‧‧Substrate

101‧‧‧Lower surface

102‧‧‧Top surface

321D, 321U‧‧‧Abutment

351D, 351U‧‧‧Metal components

352‧‧‧Heater

353‧‧‧Temperature sensor

A‧‧‧Substrate

B1‧‧‧contact surface

B2‧‧‧contact surface (contact surface for second surface)

C1, C2‧‧‧contact surface

H‧‧‧Through Hole

P1, P2, Px, Py‧‧‧Checkpoints

Pr‧‧‧Probe

X‧‧‧ area

FIG. 1 is a schematic diagram schematically showing the configuration of a substrate inspection apparatus having contact terminals and inspection aids according to an embodiment of the present invention.

FIG. 2 is a plan view showing an example of the substrate shown in FIG. 1 .

FIG. 3 is an explanatory diagram showing an example of the configuration of the inspection aid shown in FIG. 1 .

FIG. 4 is an explanatory diagram showing an example of the configuration of the inspection aid shown in FIG. 1 .

FIG. 5 is an explanatory diagram showing a state where the inspection aid is brought into contact with the lower surface of the substrate for inspection by overlapping the contact surface of the inspection aid and the probe and the substrate from the upper surface side.

Fig. 6 is an explanatory diagram showing a state where the inspection aid is brought into contact with the upper surface of the substrate for inspection by overlapping the contact surface of the inspection aid and the probe and the substrate from the upper surface side.

FIG. 7 is an explanatory diagram showing another example of the inspection aid set shown in FIG. 1 .

FIG. 8 is an explanatory diagram for explaining a board inspection method.

FIG. 9 is a flowchart for explaining an example of a board inspection method.

FIG. 10 is a flowchart for explaining an example of a substrate inspection method.

Hereinafter, the present invention will be described in detail based on the drawings. In addition, the structure which attached|subjected the same code|symbol in each figure shows the same structure, and abbreviate|omits the description.

FIG. 1 is a schematic diagram schematically showing the configuration of a substrate inspection apparatus 1 having contact terminals and inspection aids according to an embodiment of the present invention. The board|substrate inspection apparatus 1 shown in FIG. 1 is an apparatus for inspecting the circuit pattern formed in the board|substrate 100 which is an inspection object.

The substrate 100 may be, for example, a printed wiring substrate, a flexible substrate Plates, ceramic multilayer wiring substrates, electrode plates for liquid crystal displays, plasma displays, etc., semiconductor substrates, packaging substrates for semiconductor packaging, and various substrates such as film reels.

The substrate inspection apparatus 1 shown in FIG. 1 includes inspection units 4U and 4D, a substrate fixing device 6 , an inspection processing unit 8 , and a temperature control unit 9 . The substrate fixing device 6 is configured to fix the substrate 100 to be inspected at a predetermined position. The inspection units 4U and 4D include inspection aids 3U and 3D, and a connection circuit that electrically connects the probes Pr included in the inspection aids 3U and 3D to the inspection processing unit 8 , and the like. The inspection parts 4U, 4D can move the inspection aids 3U, 3D in the three-axis directions of X, Y, and Z that are orthogonal to each other by a drive mechanism (not shown), and the inspection aids 3U, 3D can move the inspection aids 3U, 3D with Z Rotate around the axis.

The inspection unit 4U is located above the substrate 100 fixed to the substrate fixing device 6 . The inspection part 4D is positioned below the substrate 100 fixed to the substrate fixing device 6 . The inspection parts 4U and 4D are configured so that inspection aids 3U and 3D for inspecting the circuit pattern formed on the substrate 100 are detachable. Hereinafter, the inspection units 4U and 4D are collectively referred to as the inspection unit 4 .

The inspection aids 3U and 3D have a plurality of probes Pr, respectively. In Fig. 1, the detailed display of the inspection aids 3U and 3D is omitted for simplicity. The inspection aids 3U and 3D are provided so as to be replaceable according to the substrate 100 to be inspected. The inspection aids 3U and 3D are respectively equivalent to an example of the inspection aids. In addition, there is a relationship such that one of the inspection aids 3U and 3D corresponds to an example of an inspection aid, and the other is an example of an inspection aid for the second surface. Furthermore, the inspection aids 3U will be The combination with the inspection aid 3D is set as the inspection aid set 2. Details of the inspection aids 3U and 3D will be described later.

The inspection processing unit 8 has, for example, a power supply circuit, a voltmeter, an ammeter, a microcomputer, and the like. The inspection processing unit 8 controls a drive mechanism (not shown) to move and position the inspection units 4U and 4D so that the tips of the probes Pr are brought into contact with the inspection points of the substrate 100 . Thereby, each inspection point can be in electrical contact with the inspection processing unit 8 . Furthermore, the inspection processing unit 8 controls the operation of the temperature control unit 9 to heat the substrate 100 . In this state, the inspection processing unit 8 supplies current or voltage for inspection to the inspection points of the substrate 100 through the probes Pr of the inspection aids 3U and 3D, and based on the voltage signals obtained from the probes Pr Or the current signal, for example, the inspection of the substrate 100 such as disconnection or short circuit of the circuit pattern is performed. Alternatively, the inspection processing unit 8 may supply alternating current or voltage to each inspection point to measure the impedance of the inspection object based on the voltage signal or current signal obtained from each probe Pr.

The substrate 100 has a lower surface 101 and an upper surface 102 . The lower surface 101 corresponds to an example of the first surface, and the upper surface 102 corresponds to an example of the second surface. In addition, the first surface and the second surface may be one surface and the other surface of the substrate 100 , and the directions thereof are not limited.

FIG. 2 is a plan view showing an example of the substrate 100 shown in FIG. 1 . The board|substrate 100 shown in FIG. 2 is a flexible board|substrate, for example, and is formed as a group board|substrate which combined the board|substrate A of the two inspection objects which have the same shape and the same wiring. The two substrates A are combined in different directions from the viewpoint of increasing the number of substrates that can be obtained from the substrate material. In addition, the substrate 100 is not limited to such an assembled substrate. Furthermore, it can also be Such an arrayed substrate is further combined into a plurality of arrayed assemblies to constitute the substrate 100 . The board|substrate A may be mounted|worn with electronic components, such as a touch panel display, for example, or the board|substrate which is integrated in a touch panel display and used.

A plurality of inspection points P1 are set on the lower surface 101 of the substrate 100 . A plurality of inspection points P2 are set on the upper surface 102 of the substrate 100 . The inspection points P1 and P2 may be electrodes for connecting electronic components such as touch panel displays, pads for mounting electronic components, wiring patterns, or connector terminals. In the example shown in FIG. 2, for example, the inspection point P1 is assumed to be a connector terminal called solder lug terminal for connecting electronic components such as a touch panel display to the outside, and for example, the inspection point P2 is assumed to be used to connect electronic components electrodes, pads for mounting electronic components, or wiring patterns.

FIG. 3 is an explanatory diagram showing an example of the configuration of the inspection aid 3D shown in FIG. 1 . FIG. 3( a ) is a plan view showing an example of the upper surface of the inspection aid 3D shown in FIG. 1 , that is, the opposite surface of the inspection aid 3D facing the substrate 100 . Fig. 3(b) is a sectional view taken along the line b-b of the inspection aid 3D shown in Fig. 3(a).

The inspection aid 3D shown in FIG. 3 includes a probe block 30D, a heating block 35D (heating part), and a base 321D. The base 321D has, for example, a substantially plate-like shape, and the probe block 30D and the heating block 35D are mounted on one surface of the base 321D. In this way, the base 321D is constructed to hold the probe block 30D and the heating block 35D integrally.

The heating block 35D includes, for example, a metal member 351D having a substantially rectangular parallelepiped shape, having a contact surface B1 for contacting the lower surface 101 of the substrate 100 , and having a thickness and a complex thickness in a direction orthogonal to the contact surface B1. The plurality of heaters 352 are embedded in the thickness of the metal member 351D and the temperature sensors 353 are embedded in the thickness of the metal member 351D so as to extend substantially parallel to the contact surface B1. The temperature sensor 353 detects the temperature of the metal member 351D. For example, a thermocouple can be used as the temperature sensor 353 .

The metal member 351D is made of a metal material with high thermal conductivity. For example, aluminum can be suitably used as the metal member 351D. The contact surface B1 is in contact with the lower surface 101 of the region where the inspection point P2 is set on the upper surface 102 of the substrate 100 , and has a shape separated from the inspection point P1 of the lower surface 101 .

In the thickness of the metal member 351D, a plurality of holes extending substantially parallel to the contact surface B1 are formed along the longitudinal direction of the metal member 351D, and a cylindrical heater 352, for example, is inserted into the holes. As the heater 352 , for example, a so-called cassette heater in which a nichrome wire is wound around a ceramic core and enclosed in a stainless steel sheath can be used.

The heater 352 and the temperature sensor 353 are connected to the temperature control unit 9 . For the temperature control unit 9, a so-called temperature regulator can be used. The temperature control unit 9 starts heating of the metal members 351D and 351U in accordance with, for example, a control signal from the inspection processing unit 8 . For example, the temperature control unit 9 feeds back the heating of the heater 352 according to the temperature of the metal members 351D and 351U detected by the temperature sensor 353 , thereby heating the metal members 351D and 351U to a preset temperature Tta. For example, a temperature in the range of 60°C to 130°C can be suitably used as the set temperature Tta. The substrate is heated by heating the metal members 351D and 351U that have been in contact with the substrate 100 to a set temperature Tta. The plate 100 is heated to the set temperature Tta. In addition, in order to rapidly and surely heat the substrate 100 to the set temperature Tta, the temperature control unit 9 may be configured to heat the metal members 351D and 351U to a temperature higher than the set temperature Tta.

The metal member 351D is connected to the base 321D by, for example, a plurality of struts 37 . Between the metal member 351D and the plurality of pillars 37, for example, a sheet-shaped heat insulating member 36 is provided with an interposition. That is, the heating block 35D and the base 321D are connected through the heat insulating member 36 .

As the heat insulating member 36, for example, a heat insulating member having a thermal conductivity of 0.1 W/(m.K) or less can be suitably used. In this way, since the heat generated by the heater 352 can be suppressed from being conducted to the base 321D and the probe block 30D, it is possible to reduce the positional displacement of the base 321D and the probe block 30D due to thermal expansion and the like, and the occurrence of the probe Pr. There is a concern that the resistance value of the probe Pr will increase due to the temperature rise.

Furthermore, since the heat dissipation of the metal member 351D heated by the heater 352 can be suppressed by the heat insulating member 36, the temperature of the metal member 351D can be easily increased rapidly by the heater 352. It is also easy to maintain the temperature of the metal member 351D at the fixed set temperature Tta.

The probe block 30D is provided so as to surround the circumference of the heating block 35D, for example. The probe block 30D includes a plurality of probes Pr, and a support block 31D that holds the tips of the plurality of probes Pr so as to face the substrate 100 .

The probe Pr has a rod-like or needle-like shape. The probe Pr is made of a highly conductive material, and various materials such as nickel, nickel alloys, and palladium alloys can be used, for example.

A plurality of through holes H for supporting the probes Pr are formed in the support block 31D. Each through hole H is arranged so as to correspond to the position of the inspection point P1 on the lower surface 101 of the substrate 100 to be inspected. Thereby, the tip portion of the probe Pr is brought into contact with the inspection point P1. The base 321D is provided with an electrode 34a that is in contact with the rear end of each probe Pr and is electrically conductive. The inspection unit 4D includes a connection circuit (not shown) for electrically contacting the rear end of each probe Pr with the inspection processing unit 8 through each electrode of the base 321D, switching the connection, and the like.

The support block 31D is constituted by, for example, plate-shaped support plates 31Da and 31Db being connected and supported by struts (not shown) so as to be spaced apart and arranged to face each other. The support plate 31Db is the front end side of the support block 31D, that is, the side facing the substrate 100, and the support plate 31Da is the rear end side of the support block 31D, that is, the side mounted on the base 321D. The upper surface of the support plate 31Db is set as a contact surface C1 for contacting with the substrate 100 . The contact surface C1 and the contact surface B1 are the same surface, and a space is provided between the contact surface B1 and the contact surface B1. In addition, a plurality of through holes H are formed so as to penetrate through the support plates 31Da and 31Db.

A base 321D made of, for example, an insulating resin material is attached to the rear end side of the support plate 31Da. The rear end side opening of the through hole H is closed by the base 321D. The wirings 34 are provided so as to penetrate through the base 321D at the position of the base 321D facing each of the rear end side openings. The surface of the base 321D on the side facing the support plate 31Da and the end surface of the wiring 34 exposed to this surface are the same surface. The end surface of this wiring 34 is set as the electrode 34a. A probe Pr is inserted into each through-hole H. Wiring 34 series and inspection processing Section 8 is connected. In this way, the inspection processing unit 8 is connected to the probe Pr through the wiring 34 and the electrode 34a.

FIG. 4 is an explanatory diagram showing an example of the configuration of the inspection aid 3U shown in FIG. 1 . FIG. 4( a ) is a plan view showing an example of the lower surface of the inspection aid 3U shown in FIG. 1 , that is, an opposite surface of the inspection aid 3U facing the substrate 100 . Fig. 4(b) is a sectional view taken along the line b-b of the inspection aid 3U shown in Fig. 4(a). The inspection aid 3U is an example of the inspection aid for the second face.

The inspection aid 3U shown in FIG. 4 includes a probe block 30U, two heating blocks 35U (heating parts for the second surface), and a base 321U. The base 321U has, for example, a substantially plate-like shape, and the probe block 30U and the heating block 35U are mounted on one surface of the base 321U. Thereby, the base 321U holds the probe block 30U and the heating block 35U integrally. The probe Pr supported by the probe block 30U corresponds to an example of the probe for the second surface.

The heating block 35U includes, for example, two “L”-shaped metal members 351U, each of which has a contact surface B2 (contact surface for the second surface) for contacting the upper surface 102 of the substrate 100 , and is located directly with the contact surface B2. The intersecting direction has a thickness, the heater 352 is embedded in the thickness of each metal member 351U so as to extend substantially parallel to the contact surface B2, and the temperature sensor 353 is attached to the side surface of each metal member 351U. Each temperature sensor 353 detects the temperature of each metal member 351U.

The metal member 351U is formed of the same material as the metal member 351D. The contact surface B2 is in contact with the upper surface 102 of the region of the substrate 100 where the inspection point P1 is set on the lower surface 101 , and has a connection with the upper surface 102 . The checkpoint P2 separates the shape.

In the thickness of the metal member 351U, a hole extending substantially parallel to the contact surface B2 is formed along the longitudinal direction of the metal member 351U, and the heater 352 is inserted into the hole. For example, the temperature control unit 9 feeds back the heat generation of the heater 352 according to the temperature of the metal member 351U detected by the temperature sensor 353 , thereby heating the metal member 351U to the set temperature Tta.

The heater 352 has a shape elongated in one direction, for example, a rod-like shape. The heating blocks 35D and 35U are embedded with the heaters 352 in the thick metal members 351D and 351U, and the heaters 352 are extended substantially parallel to the contact surfaces B1 and B2 along the length direction of the metal members 351D and 351U. . As a result, the heat generated by the heater 352 can be efficiently conducted to the metal members 351D and 351U, and the contact surfaces B1 and B2 can be heated so that the heat can be conducted with good uniformity.

In addition, the heating blocks 35D and 35U only need to be heated by bringing the contact surfaces B1 and B2 into contact with the substrate 100 , and it is not necessary to embed the heater in the metal member, and the heater does not need to extend parallel to the contact surfaces B1 and B2 composition of the set.

The metal member 351U is connected to the base 321U by, for example, a plurality of struts 37 . Between the metal member 351U and the plurality of pillars 37, for example, a sheet-shaped heat insulating member 36 is provided with an interposition. That is, the heating block 35U and the base 321U are connected through the heat insulating member 36 . Thereby, since the heat generated by the heater 352 can be suppressed from being conducted to the base 321U and the probe block 30U, the position of the base 321U and the probe block 30U caused by thermal expansion can be reduced. There is a concern that the resistance value of the probe Pr is increased due to an increase in the temperature of the probe Pr due to offsets and the like.

Furthermore, since the heat dissipation of the metal member 351U heated by the heater 352 can be suppressed by the heat insulating member 36, the temperature of the metal member 351U can be easily increased rapidly by the heater 352. It is also easy to maintain the temperature of the metal member 351U at the fixed set temperature Tta.

In addition, the heat insulating member 36 may not be sheet-like. For example, the support|pillar 37 may be comprised with the material which has heat insulation, and the structure which the support|pillar 37 functions as a heat insulating member may be used instead of the heat insulating member 36 provided with the sheet shape. Alternatively, the inspection aids 3U and 3D may be configured without a heat insulating member.

For example, one of the probe blocks 30U is partially vacated and arranged to face the continuous two sides of the heating block 35U, and the other is partially vacated and arranged to face the other two sides of the heating block 35U. The probe block 30U includes a plurality of probes Pr, and a support block 31U that holds the tips of the plurality of probes Pr so as to face the substrate 100 .

A plurality of through holes H for supporting the probes Pr are formed in the support block 31U. Each through hole H is arranged so as to correspond to the position of the inspection point P2 on the upper surface 102 of the substrate 100 to be inspected. Thereby, the tip portion of the probe Pr is brought into contact with the inspection point P2. The base 321U is provided with an electrode 34a that is in contact with the rear end of each probe Pr and is electrically conductive. The inspection unit 4U includes a connection circuit (not shown) for electrically contacting the rear end of each probe Pr with the inspection processing unit 8 through each electrode of the base 321U, switching the connection, and the like.

The support block 31U is constituted by, for example, plate-shaped support plates 31Ua and 31Ub being connected and supported by struts (not shown) so as to be spaced apart and arranged to face each other. The support plate 31Ub is the front end side of the support block 31U, that is, the side facing the substrate 100, and the support plate 31Da is the rear end side of the support block 31U, that is, the side mounted on the base 321U. The lower surface (upper surface in FIG. 4( b )) of the support plate 31Ub is set as a contact surface C2 for contacting with the substrate 100 . The contact surface C2 and the contact surface B2 are the same surface, and a space is provided between the contact surface B2 and the contact surface B2. In addition, a plurality of through holes H are formed so as to penetrate through the support plates 31Ua and 31Ub.

A base 321U is attached to the rear end side of the support plate 31Ua. The rear end side opening of the through hole H is closed by the base 321U. The wiring 34 is provided so as to penetrate through the base 321U at a position of the base 321U facing each rear end side opening. The surface of the base 321U on the side facing the support plate 31Ua and the end surface of the wiring 34 exposed to the surface are the same surface. The end surface of this wiring 34 is set as the electrode 34a. A probe Pr is inserted into each through-hole H. The wiring 34 is connected to the inspection processing unit 8 . In this way, the inspection processing unit 8 is connected to the probe Pr of the inspection aid 3U through the wiring 34 and the electrode 34a.

FIG. 5 is an explanatory diagram showing a state in which the inspection aid 3D is in contact with the lower surface 101 of the substrate 100 for inspection by overlapping the contact surface of the inspection aid 3D and the probe Pr and the substrate 100 from the upper surface 102 side. FIG. 6 is an explanatory diagram showing a state in which the inspection aid 3U is in contact with the upper surface 102 of the substrate 100 for inspection by overlapping the contact surface of the inspection aid 3U and the probe Pr with the substrate 100 from the upper surface 102 side.

As shown in Fig. 5, the inspection aid 3D is brought into contact with the base When the lower surface 101 of the board 100 is contacted, the contact surface B1 contacts the lower surface 101 of the region where the inspection point P2 is set on the upper surface 102 of the substrate 100 , and is separated from the inspection point P1 on the lower surface 101 of the substrate 100 . On the other hand, as shown in FIG. 6 , when the inspection aid 3U is brought into contact with the upper surface 102 of the substrate 100 , the contact surface B2 is brought into contact with the upper surface of the region of the substrate 100 where the inspection point P1 is set on the lower surface 101 . 102, and is separated from the inspection point P2 of the upper surface 102.

According to the inspection aids 3D and 3U, the probes Pr can be brought into contact with the inspection points P1 and P2 while heating the region of the substrate including the inspection points P1 and P2 from the back side of the inspection points P1 and P2 without heating the probes Pr. Therefore, the influence of the inspection due to the heating of the probes can be reduced, and the inspection of the substrate 100 can be performed while heating the substrate 100 to apply thermal stress. By doing so, it is possible to detect board defects that are difficult to appear in inspection at room temperature. Furthermore, since the contact surfaces B1 and B2 can be directly contacted with the substrate 100 to heat the substrate 100 , the substrate 100 can be rapidly heated, and the substrate 100 can be lifted up compared to the prior art using a preheating chamber to heat the substrate. Reliability of heating to set temperature Tta. In this way, while applying thermal stress to the substrate to be inspected, the inspection time can be shortened, and the reliability of applying thermal stress to the substrate can be improved.

In addition, the shape of the contact surface B1 shown in FIG. 5 is set so that it may contact the area|region X which does not have any inspection point P1, P2. Thereby, since the wiring pattern etc. formed in the area|region X of the board|substrate 1001 can be heated, the inspection precision of the defect which arises in the area|region X can be improved.

Figure 7 shows the inspection aid set shown in Figure 1 2 is an explanatory diagram of another example. The inspection aid kit 2' shown in Fig. 7 is composed of a combination of a heating aid 3D' and a probe aid 3U'. The heating aid 3D' is constituted by a heating block 35D. The probe aid 3U' is constituted by the probe block 30U. The probes Pr of the probe aid 3U' are connected to the inspection processing unit 8 via, for example, the same electrodes 34a and wirings 34 as those of the substrate 321U. The inspection aid set 2' thus constituted can be suitably used for inspection of substrates in which inspection points are provided only on one surface side.

In addition, the board|substrate inspection apparatus 1 may have the structure which has only one of the inspection parts 4U and 4D. Even if there is only one of the inspection parts 4U and 4D, the inspection and heating of the substrate can be performed by any one of the inspection aids 3U and 3D, so that the inspection time can be shortened while applying thermal stress to the inspection target substrate.

Furthermore, although the contact surface B1 for heating the substrate 100 and the contact surface C1 for the support block 31D for supporting the probe Pr are shown as being separated, for example, the probe may be heated by heating the contact surface C1. The needle block 30D also serves as a configuration of the heating unit. Even with such a configuration, since the inspection and heating of the substrate can be performed, the inspection time can be shortened while applying thermal stress to the substrate to be inspected.

Next, an example of a board inspection method performed by the inspection processing unit 8 will be described. As described above, the temperature control unit 9 performs temperature control to heat the metal members 351D and 351U in contact with the substrate 100 so that the temperature of the substrate 100 reaches the set temperature Tta. However, since the metal members 351D and 351U are metal blocks, the heat capacity is large. Therefore, the metal members 351D and 351U of normal temperature (ambient temperature) before heating are heated to the set temperature Temperatures above Tta and above are time consuming.

Furthermore, the substrate 100 also has a thermal capacity, and the thermal conductivity of the material (eg, epoxy resin, etc.) constituting the substrate 100 is lower than that of the metal members 351D and 351U. Therefore, there is a time difference between when the temperature of the metal members 351D and 351U reaches the set temperature Tta or more, and until the substrate 100 reaches the set temperature Tta or more. Therefore, in order to perform the inspection after the substrate 100 reaches the set temperature Tta, generally, after the heating by the heater 352 is started, the inspection is performed after the substrate 100 reaches the set temperature Tta for a sufficiently long time. However, if the inspection is restarted after waiting for such a long time, it will take a long time to perform the inspection.

In contrast, the inspection processing unit 8 starts inspection when the resistance value R reaches the target resistance value Tra corresponding to the set temperature Tta by utilizing the characteristic that the resistance value R of the wiring pattern formed on the substrate 100 changes with temperature. Thereby, the inspection can be performed quickly when the temperature of the substrate 100 itself actually reaches the set temperature Tta, and the inspection time can be shortened compared with the case where the inspection is started after waiting for a very long time. Furthermore, since the inspection is performed after confirming that the temperature of the substrate 100 itself actually reaches the set temperature Tta, the accuracy of the thermal stress applied to the substrate 100 during inspection is improved.

In addition, using the predicted substrate 100, the time from the start of heating of the heater 352 until the resistance value R reaches the target resistance value Tra may be experimentally measured in advance as a waiting time, and the waiting time may be stored in the memory device in advance, In the actual inspection of the substrate 100 , after the waiting time measured in advance elapses from the start of heating by the heater 352 , according to the The electrical signal obtained by each probe of each inspection point is used to perform the inspection.

Furthermore, when a plurality of substrates 100 are continuously inspected, for example, when an arrayed substrate in which a plurality of substrates 100 are connected is inspected, in the second and subsequent inspections, since the inspection aids 3U and 3D have already been heated, the inspection aids 3U and 3D are heated from the beginning. The time from heating (from bringing the inspection aids 3U and 3D into contact with the substrate 100 ) until the temperature of the substrate 100 reaches the set temperature Tta is shortened. In this way, the waiting time for the second and subsequent inspections may be measured experimentally in advance, and the waiting time may be set as the waiting time as described above, and the waiting time of the second and subsequent inspections may be changed according to each waiting time.

Specifically, the inspection processing unit 8 performs inspection of the substrate 100 as follows. FIG. 8 is an explanatory diagram for explaining a board inspection method. First, a pair of specific inspection points Px and Py electrically connected to each other in the wiring pattern are selected in advance from the plurality of inspection points P1 or P2 set on the substrate 100 , and the specific inspection points Px and Py are preset.

FIGS. 9 and 10 are flowcharts for explaining an example of a substrate inspection method. The inspection processing unit 8 brings the contact surfaces B1 , B2 , C1 , and C2 of the inspection aids 3U, 3D into contact with the substrate 100 , and brings the probes Pr into contact with the inspection points P1 , P2 (step S1 ).

Next, the inspection processing unit 8 acquires the detected temperature t of the temperature sensor 353 as the low temperature temperature TLo (step S2). At this time, any one of the temperature sensors 353 may be used to detect the temperature, or the average value of the detected temperatures of the temperature sensors 353 may be used.

Next, the inspection processing unit 8 acquires the resistance value R between the specific inspection points Px and Py as the low temperature resistance value RLo (step S3 ). resistance The value R is obtained by dividing the voltage value by the current value by measuring the voltage between the pair of probes Pr generated by passing a current between the pair of probes Pr in contact with the specific inspection point Px, Py. have to.

In addition, in the measurement of the resistance value R, it is preferable to perform the resistance measurement by the so-called four-terminal method because the resistance measurement can be performed with good accuracy. Specifically, the current supply probe Pr and the voltage measurement probe Pr are brought into contact with the specific inspection point Px, and the current supply probe Pr and the voltage measurement probe Pr are also brought into contact with the specific inspection point Py. A current flows between the pair of current supply probes Pr, and the voltage generated between the pair of voltage measurement probes Pr is measured, and the resistance value R is preferably obtained by dividing the voltage value by the current value.

Next, the inspection processing unit 8 outputs a control signal to the temperature control unit 9 to heat the heater 352 to heat the substrate 100 by heating the metal members 351D and 351U (step S4 ).

Next, the inspection processing unit 8 operates in the same manner as in steps S2 and S3, acquires the detected temperature t of the temperature sensor 353 as the high temperature temperature THi (step S5), and acquires the resistance value R between the specific inspection points Px and Py As the high temperature resistance RHi (step S6).

Next, the inspection processing unit 8 calculates the temperature coefficient Tc based on the low temperature temperature TLo, the low temperature resistance RLo, the high temperature temperature THi, and the high temperature resistance RHi (step S7). Specifically, the inspection processing unit 8 can calculate the temperature coefficient Tc according to the following formula (1).

Temperature coefficient Tc=[(RHi-RLo)/RLo]/(THi-TLo)…(1)

Next, the inspection processing unit 8 is based on the low temperature TLo, the resistance at low temperature RLo, and the temperature coefficient Tc, and the target resistance value Rta when the substrate 100 reaches the set temperature Tta is calculated (step S8 ). Specifically, the inspection processing unit 8 can calculate the target resistance value Rta based on the following formula (2).

Target resistance value Rta=RLo{[(Tta-TLo)/Tc]+1}…(2)

Next, the inspection processing unit 8 measures the resistance value R between the specific inspection points Px and Py in the same manner as described above (step S11 : resistance measurement step).

Next, the inspection processing unit 8 compares the resistance value R measured in step S11 with the resistance judgment value Rj (step S12 ). The resistance judgment value Rj is a resistance value for judging whether the wiring pattern between the specific inspection points Px and Py is good or not, and the specific inspection point Px is set in the case where the resistance value increases, for example, in the case of disconnection or thinning of the wire. The resistance value between , Py, and a value much larger than the target resistance value Rta is preset as the resistance judgment value Rj.

If the resistance value R exceeds the resistance determination value Rj (YES in step S12 ), the inspection processing unit 8 determines that the wiring pattern between the specific inspection points Px and Py is defective, that is, the substrate 100 is defective (step S13 ) , and end processing. In this way, when the wiring pattern between the specific inspection points Px and Py is defective and the resistance value is equal to or higher than the target resistance value Rta, even if the temperature of the substrate 100 has not reached the set temperature Tta or higher, the quality of the execution of step S15 can be reduced. Uncertainty of judgment.

Next, the inspection processing unit 8 compares the resistance value R measured in step S11 with the target resistance value Rta (step S14). If the resistance value R does not reach the target resistance value Rta (NO in step S14 ), steps S11 to S14 are repeated again, and wait until the resistance value R reaches the target resistance value Rta or more superior.

On the other hand, if the resistance value R becomes equal to or higher than the target resistance value Rta (YES in step S14: the inspection start determination step), since the temperature of the substrate 100 becomes equal to or higher than the set temperature Tta, the electrical signals obtained from the probes The quality of the substrate 100 is judged, and the inspection of the substrate 100 is started (step S15).

In addition, even if steps S12 and S13 are not executed, if a defect such as disconnection occurs in the wiring between the specific check points Px and Py, since the defect should be detected in step S15, step S12 may not be executed. , The composition of S13.

In addition, steps S1-S8 are not limited to the example performed at the time of board|substrate inspection. For example, steps S1 to S8 may be performed experimentally using the predicted substrate 100 to obtain the target resistance value Rta. In addition, the target resistance value Rta obtained in this way can also be stored in the memory device first, and when the substrate 100 is actually inspected, the structures of steps S1 , S4 , S11 to S15 are executed according to the target resistance value Rta stored in the memory device. .

3D‧‧‧Inspection Aids

30D‧‧‧Probe Block

31D‧‧‧Support block

31Da, 31Db‧‧‧Support Plate

34‧‧‧Wiring

34a‧‧‧electrode

35D‧‧‧heating block (heating part)

36‧‧‧Insulation components

37‧‧‧Pillar

321D‧‧‧Abutment

351D‧‧‧Metal components

352‧‧‧Heater

353‧‧‧Temperature sensor

B1‧‧‧contact surface

C1‧‧‧contact surface

H‧‧‧Through Hole

Pr‧‧‧Probe

Claims (9)

An inspection aid is used for inspecting a substrate on which an inspection point of an inspection object is set, the inspection aid is provided with: a probe for contacting the inspection point; a heating part having a contact surface for contacting the substrate the substrate is heated by heating the contact surface; the supporting member supports the probe; and the base supports the supporting member and the heating part integrally; connected to thermal components. The inspection aid according to claim 1, wherein the substrate has a first surface and a second surface, the inspection points are set on the first surface and the second surface, and the probes are formed from the first surface and the second surface. A contact surface protrudes and contacts the inspection point of the first surface, the first contact surface is the same surface as the contact surface and there is a space between the first contact surface and the contact surface, and the contact surface is in contact with one of the substrates The first surface in the region where the inspection points are set on the second surface has a shape separated from all inspection points on the first surface in the surface direction of the contact surface. The inspection aid according to claim 1 or 2, wherein the heating portion includes: a metal member having the contact surface and having a thickness in a direction orthogonal to the contact surface; and The heater extends within the thickness of the metal member substantially parallel to the contact surface. An inspection aid kit comprising the inspection aid as described in item 2 of the scope of application, and an inspection aid for the second surface of the substrate, wherein the second surface inspection aid is provided with: a first Two-sided probes for contacting the inspection points of the second surface; and a second-surface heating section having a second-surface contact surface for contacting the second surface of the substrate, by heating the second surface The second surface uses the contact surface to heat the substrate; the probe for the second surface protrudes from the second contact surface to contact the inspection point of the second surface, the second contact surface is the contact surface for the second surface It is the same surface and there is a space between it and the contact surface for the second surface, and the contact surface for the second surface is in contact with the second surface of the substrate in the region where the inspection point is set on the first surface. , and has a shape separated from all the inspection points of the second surface in the surface direction of the contact surface for the second surface. An inspection aid kit is used for inspecting a substrate having a first surface and a second surface and an inspection point of an inspection object is set on the first surface, the inspection aid kit is provided with: a probe aid, having a probe for contacting the aforementioned inspection point on the aforementioned first face; and A heating aid has: a contact surface for contacting the second surface of the substrate, a heating part for heating the substrate by heating the contact surface, and a base for supporting the heating part; the heating part and the base The platforms are connected by a heat insulating member having heat insulating properties. A substrate inspection apparatus, comprising: the inspection aid according to any one of claims 1 to 3; and an inspection processing unit for bringing the probe into contact with the inspection point and the contact surface in contact with the inspection point The substrate is inspected according to the electrical signal obtained from the probe. A substrate inspection apparatus, comprising: the inspection aid set according to claim 4; and an inspection processing unit for bringing the probe into contact with the inspection point of the first surface, and bringing the contact surface into contact with the inspection point of the first surface. In the first surface of the substrate in the region where the inspection points are set on the second surface, the probes of the second surface are brought into contact with the inspection points of the second surface, and the contact surfaces of the second surface are brought into contact with the inspection points of the second surface. In the second surface of the substrate in the region where the inspection point is set on the first surface, the inspection of the substrate is performed based on electrical signals obtained from the probe and the probe for the second surface. A substrate inspection device is provided with: the inspection aid set as described in item 5 of the patent application scope; and an inspection processing unit that makes the probes come into contact with the inspection points of the first surface and makes the contact surfaces come into contact with the second surface, and performs inspection of the substrate based on electrical signals obtained from the probes. The substrate inspection apparatus according to any one of claims 6 to 8, wherein the substrate is formed with a wiring pattern, and a pair of specific inspection points that are connected to each other with the wiring patterns is preset as the inspection point, and the The inspection processing unit performs the following steps: a resistance measurement step of measuring the resistance value between the pair of specific inspection points based on electrical signals obtained from the probes contacted with the specific inspection points; and an inspection start determination step of using When the resistance value measured in the above-mentioned resistance measurement step becomes equal to or greater than a predetermined target resistance value, the above-mentioned inspection is started.

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