TW201740121A - Inspection jig, inspection jig set, and substrate inspecting apparatus - Google Patents

Abstract

Provided are an inspection jig, an inspection jig set and a substrate inspection apparatus capable of subjecting temperature stress to a substrate of an inspection object as well as reducing inspection time. An inspection jig 3D is an inspection jig 3D for inspecting a substrate 100 of an inspection object, which is set with inspection points P1, the inspection jig 3D including probes Pr for contacting with the inspection points P1, and a contacting surface B1 for contacting with the substrate 100, the inspection jig 3D further including a heating block 35D for heating the substrate 100 by heating the contacting surface B1.

Description

Inspection aid, inspection aid set, and substrate inspection device

The present invention relates to an inspection aid, an inspection aid kit, and a substrate inspection apparatus for contacting a probe to a substrate.

Conventionally, there has been known a substrate inspection apparatus for inspecting conduction of a wiring pattern formed on a substrate such as a printed wiring board, and whether or not there is a defective short circuit between the wiring patterns or a resistance between the wiring pattern and the wiring pattern. For the substrate inspection such as a value, for example, a movable inspection contact, a plurality of inspection contacts held in a multi-needle shape, and the like, a plurality of pads, land, and the like formed on the wiring pattern are contacted. The inspection point is used to measure the electric resistance between the inspection points on the inspection target wiring pattern, thereby performing the substrate inspection.

In such a substrate, for example, the contact between the wiring pattern and the via hole is incomplete, but the conduction is unstable, but the contact state is unstable. Such an inconvenience may occur when the inspection is judged to be a conduction between the inspection points and is regarded as a good product and assembled into the product, and the defective condition is revealed due to the thermal stress of the use environment. In particular, in the interior of the substrate, due to incomplete connection of the buried vias between the wiring patterns The contact failure cannot be visually inspected from the outside of the substrate, so it is difficult to check by inspection.

In view of this, an inspection apparatus (for example, Patent Document 1) has been proposed which uses a preheating chamber to heat a space on which a substrate to be inspected is placed, and places the substrate in a high temperature environment. Thermal stress is applied to perform inspection to detect such incomplete contact failure.

(previous technical literature) (Patent Literature)

Patent Document 1: Japanese Laid-Open Patent Publication No. 2001-215257

However, as described above, the inspection apparatus including the preheating chamber for heating the mounting space of the substrate to be inspected to apply thermal stress to the substrate has a problem that the inspection time is greatly increased due to the time required for the heating of the substrate.

An object of the present invention is to provide an inspection aid, an inspection aid kit, and a substrate inspection apparatus that can reduce the inspection time while applying thermal stress to the substrate to be inspected.

The inspection aid of the present invention is an inspection aid for inspecting a substrate on which an inspection target is set, the inspection aid having a probe for contacting the inspection point, and a heating portion for use The substrate is heated by heating the contact surface by contacting the contact surface of the substrate.

According to this configuration, since the substrate can be heated by heating the contact surface contacting the substrate, the substrate can be heated to heat the substrate by using the preheating chamber to heat the substrate, and it is easier to heat the substrate in a short time. Therefore, it is possible to shorten the inspection time while applying thermal stress to the substrate to be inspected.

Furthermore, the substrate has a first surface and a second surface, and the inspection point is set on the first surface and the second surface, and the probe is in contact with the inspection point on the first surface, and the contact surface is in contact with The first surface of the substrate on which the inspection point is set on the second surface is formed to have a shape separated from the inspection point of the first surface.

According to this configuration, since the region where the inspection point of the substrate is set can be heated from the back side on the side where the inspection point is set, the substrate can be heated while reducing the risk of the probe for contacting the inspection point being heated.

Further, preferably, the heating unit includes a metal member having the contact surface and having a thickness in a direction orthogonal to the contact surface, and a heater extending substantially parallel to the contact surface Within the thickness of the metal member.

According to this configuration, the heat generated by the heater can be efficiently conducted to the metal member, and the entire contact surface can be heated to conduct heat with uniformity.

Furthermore, it is preferable that the inspection aid further includes: a support member that supports the probe; and a base that integrally supports the support member and the heating unit, wherein the heating unit and the base system have transmission The heat insulating member is connected to each other.

According to this configuration, since the risk of the heat generated by the heating portion being dissipated to the base can be reduced, the substrate can be heated quickly and efficiently. Furthermore, the risk of the probe being heated through the substrate can be reduced.

The inspection aid kit of the present invention includes the inspection aid and the second surface inspection aid for inspecting the substrate, and the second surface inspection aid includes a second surface probe. The second surface heating surface has a second surface contact surface for contacting the second surface of the substrate, and the second surface contact surface is heated by the contact portion contacting the second surface; The second substrate contact surface is in contact with the second surface of the substrate on the first surface where the inspection point is set, and has a shape separated from the inspection point of the second surface.

According to this inspection aid set, it is possible to heat and inspect the substrate from both sides of the substrate.

Furthermore, the inspection aid kit of the present invention is for inspecting a substrate having a first surface and a second surface and having an inspection point on the first surface of the inspection surface, the inspection aid kit having: a needle assisting device having a probe for contacting the aforementioned inspection point of the first surface; and a heating aid having a contact surface for contacting the second surface of the substrate, heated by heating the contact surface The aforementioned substrate.

According to this configuration, since the substrate can be heated by heating the contact surface of the substrate by the heating aid, and the substrate can be inspected by the probe aid, the pre-heating chamber is used to heat the mounting space of the substrate. By heating the substrate in a manner, it is easier to heat the substrate in a short time. Therefore, it is possible to shorten the inspection time while applying thermal stress to the substrate to be inspected. Further, since the region where the inspection point of the substrate is set can be heated from the back side on the side where the inspection point is set, the substrate can be heated while reducing the risk of the probe for contacting the inspection point being heated.

Furthermore, the substrate inspection apparatus according to the present invention includes: the inspection aid; and an inspection processing unit that causes the probe to contact the inspection point and contact the contact surface with the substrate, and is obtained from the probe The inspection of the aforementioned substrate is performed with an electrical signal.

According to this configuration, when the substrate can be heated by heating the contact surface contacting the substrate, the substrate is inspected by the probe, and the substrate is heated to heat the substrate by using the preheating chamber to heat the substrate. The substrate is heated in a short time. Therefore, it is possible to shorten the inspection time while applying thermal stress to the substrate to be inspected.

Further, the substrate inspection apparatus according to the present invention includes: the inspection aid set; and an inspection processing unit that causes the probe to contact the inspection point on the first surface, and the contact surface contacts the substrate The first surface of the region of the inspection point is set on both sides, and the second surface probe is brought into contact with the inspection point of the second surface, and the second surface contact surface is brought into contact with the substrate The second surface of the region of the inspection point is set on the first surface, and the inspection of the substrate is performed based on an electrical signal obtained from the probe and the probe for the second surface.

According to this configuration, even when the check points are set on both sides of the substrate, the contact faces on the both sides of the substrate can be heated and contacted by the second The surface contact surface is used to heat the substrate, and the probe and the second surface probe are in contact with the inspection points on both sides to inspect the substrate, and the substrate is heated in a manner that heats the substrate mounting space by using the preheating chamber, which is easier in a short time. The substrate is heated inside. Therefore, it is possible to shorten the inspection time while applying thermal stress to the substrate to be inspected. In addition, since the area where the inspection point of the substrate is set can be heated from the back side where the inspection point is set, the risk of heating the probe for contacting the inspection point and the probe for the second surface can be reduced. The substrate is heated down.

Furthermore, the substrate inspection apparatus according to the present invention includes: the inspection aid set; and an inspection processing unit that causes the probe to contact the inspection point on the first surface, and the contact surface contacts the second surface, and The inspection of the substrate is performed based on an electrical signal obtained from the probe.

According to this configuration, since the substrate can be heated by heating the contact surface contacting the substrate, the substrate can be heated to heat the substrate by using the preheating chamber to heat the substrate, and it is easier to heat the substrate in a short time. Therefore, it is possible to shorten the inspection time while applying thermal stress to the substrate to be inspected. Further, since the region where the inspection point of the substrate is set can be heated from the back side on the side where the inspection point is set, the substrate can be heated while reducing the risk of the probe for contacting the inspection point being heated.

1‧‧‧Substrate inspection device

2, 2'‧‧‧ inspection aid kit

3D‧‧‧Check aids

3D’‧‧‧heating aids

3U‧‧‧Inspection aids (second side inspection aids)

3U’‧‧‧ probe aids

4, 4D, 4U‧‧‧ Inspection Department

6‧‧‧Substrate fixing device

8‧‧‧ Inspection and Processing Department

9‧‧‧ Temperature Control Department

30D, 30U‧‧‧ probe block

31D, 31U‧‧‧ support blocks

31Da, 31Db, 31Ua, 31Ub‧‧‧ support plates

34‧‧‧Wiring

34a‧‧‧electrode

35D‧‧‧heating block (heating section)

35U‧‧・heating block (heating part for the second side)

36‧‧‧Insulation members

37‧‧‧ pillar

100‧‧‧Substrate

101‧‧‧ lower surface

102‧‧‧ upper surface

321D, 321U‧‧‧Abutment

351D, 351U‧‧‧Metal components

352‧‧‧heater

353‧‧‧temperature sensor

A‧‧‧Substrate

B1‧‧‧ contact surface

B2‧‧‧Contact surface (contact surface for the second side)

C1, C2‧‧‧ contact surface

H‧‧‧through hole

P1, P2, Px, Py‧‧‧ checkpoints

Pr‧‧‧ probe

X‧‧‧ area

Fig. 1 is a schematic view showing the configuration of a substrate inspecting apparatus having a contact terminal and an inspection aid according to an embodiment of the present invention.

Fig. 2 is a plan view showing an example of the substrate shown in Fig. 1.

Fig. 3 is an explanatory view showing an example of the configuration of the inspection aid shown in Fig. 1.

Fig. 4 is an explanatory view showing an example of the configuration of the inspection aid shown in Fig. 1.

Fig. 5 is an explanatory view showing a state in which the contact surface of the inspection aid and the probe and the substrate are displayed on the upper surface side, and the inspection aid is brought into contact with the lower surface of the substrate for inspection.

Fig. 6 is an explanatory view showing a state in which the contact surface of the inspection aid and the probe and the substrate are displayed on the upper surface side, and the inspection aid is brought into contact with the upper surface of the substrate for inspection.

Fig. 7 is an explanatory view showing another example of the inspection aid set shown in Fig. 1.

Fig. 8 is an explanatory view for explaining a substrate inspection method.

Fig. 9 is a flow chart for explaining an example of a substrate inspection method.

Fig. 10 is a flow chart for explaining an example of a substrate inspection method.

Hereinafter, the present invention will be described in detail based on the drawings. In the drawings, the same reference numerals are given to the same components, and the description thereof is omitted.

Fig. 1 is a schematic view showing the configuration of a substrate inspection apparatus 1 having a contact terminal and an inspection aid according to an embodiment of the present invention. The substrate inspection device 1 shown in Fig. 1 is a device for inspecting a circuit pattern formed on a substrate 100 as an object to be inspected.

The substrate 100 may be, for example, a printed wiring substrate, a flexible base Electrode plates for boards, ceramic multilayer wiring boards, liquid crystal displays, plasma displays, etc., various substrates such as semiconductor substrates, package substrates for semiconductor packages, and film roll holders.

The substrate inspection apparatus 1 shown in FIG. 1 includes inspection units 4U and 4D, a substrate fixing device 6, an inspection processing unit 8, and a temperature control unit 9. The substrate fixing device 6 is configured to fix the substrate 100 to be inspected at a predetermined position. The inspection units 4U and 4D include inspection aids 3U and 3D, and a connection circuit that electrically connects the probe Pr of the inspection aids 3U and 3D to the inspection processing unit 8. In the inspection units 4U and 4D, the inspection aids 3U and 3D can be moved in the three-axis directions of X, Y, and Z which are orthogonal to each other by a drive mechanism (not shown), and the inspection aids 3U and 3D can be Z. The shaft is centered to rotate.

The inspection unit 4U is located above the substrate 100 fixed to the substrate fixing device 6. The inspection portion 4D is located below the substrate 100 fixed to the substrate fixing device 6. The inspection units 4U and 4D are configured to detachably inspect the inspection aids 3U and 3D for inspecting the circuit patterns formed on the substrate 100. Hereinafter, the inspection units 4U and 4D are collectively referred to as an inspection unit 4.

The inspection aids 3U and 3D have a plurality of probes Pr, respectively. In the first drawing, the detailed display of the inspection aids 3U and 3D is omitted and simply described. The inspection aids 3U and 3D are provided so as to be replaceable in accordance with the substrate 100 to be inspected. The inspection aids 3U and 3D are respectively equivalent to an example of the inspection aid. Further, the relationship between the inspection aids 3U and 3D corresponds to an example of the inspection aid, and the other corresponds to an example of the second surface inspection aid. In addition, the inspection aid will be 3U The combination with the inspection aid 3D is set as the inspection aid set 2. The details of the inspection aids 3U and 3D will be described later.

The inspection processing unit 8 includes, for example, a power supply circuit, a voltmeter, an ammeter, a microcomputer, and the like. The inspection processing unit 8 controls the drive mechanism (not shown) to move and position the inspection units 4U and 4D, and the distal ends of the probes Pr are brought into contact with the respective inspection points of the substrate 100. Thereby, each inspection point can be in electrical contact with the inspection processing unit 8. Further, the inspection processing unit 8 controls the operation of the temperature control unit 9 to heat the substrate 100. In this state, the inspection processing unit 8 transmits the probe currents and voltages to the respective inspection points of the substrate 100 through the probes Pr of the inspection aids 3U and 3D, and based on the voltage signals obtained from the respective probes Pr. Or a current signal, for example, inspection of the substrate 100 such as disconnection or short circuit of the circuit pattern. Alternatively, the inspection processing unit 8 may supply an alternating current or a voltage to each of the inspection points, and measure the impedance of the inspection target based on the voltage signal or the current signal obtained from each probe Pr.

The substrate 100 has a lower surface 101 and an upper surface 102. The lower surface 101 corresponds to an example of the first surface, and the upper surface 102 corresponds to an example of the second surface. Further, the first surface and the second surface may be one surface and the other surface of the substrate 100, and the direction thereof is not limited.

Fig. 2 is a plan view showing an example of the substrate 100 shown in Fig. 1. The substrate 100 shown in FIG. 2 is, for example, a flexible substrate, and is formed as a group substrate in which two substrates A having the same shape and the same wiring are combined. The two substrates A are combined in mutually different directions from the viewpoint of increasing the number of substrates that can be obtained by increasing the substrate material. Further, the substrate 100 is not limited to such a group substrate. Furthermore, it can also be Such a grouping substrate is further combined into a plurality of groups to constitute the substrate 100. The substrate A may also be a substrate mounted on an electronic component such as a touch panel display or incorporated into a touch panel display.

A plurality of check points P1 are set on the lower surface 101 of the substrate 100. The upper surface 102 of the substrate 100 is provided with a plurality of check points P2. The inspection points P1 and P2 may be, for example, electrodes for connecting electronic components such as a touch panel display, or may be solder pads for mounting electronic components, wiring patterns, or connector terminals. In the example shown in Fig. 2, for example, the checkpoint P1 is assumed to be a connector terminal called a solder tab terminal for connecting an electronic component such as a touch panel display to the outside. For example, the checkpoint P2 is assumed to be used for connecting electronic components. The electrode, the pad used to mount the electronic component, or the wiring pattern.

Fig. 3 is an explanatory view showing an example of the configuration of the inspection aid 3D shown in Fig. 1. Fig. 3(a) is a plan view showing an example of an upper surface of the inspection aid 3D shown in Fig. 1, that is, an inspection surface of the inspection aid 3D facing the substrate 100. Fig. 3(b) is a cross-sectional view taken along line b-b of the inspection aid 3D shown in Fig. 3(a).

The inspection aid 3D shown in Fig. 3 includes a probe block 30D, a heating block 35D (heating portion), and a base 321D. The base 321D has, for example, a substantially plate shape, and the probe block 30D and the heating block 35D are attached to one surface of the base 321D. In this way, the base 321D is constructed to maintain the probe block 30D and the heating block 35D integrally.

The heating block 35D includes, for example, a substantially rectangular parallelepiped metal member 351D having a contact surface B1 for contacting the lower surface 101 of the substrate 100, and having a thickness in a direction orthogonal to the contact surface B1. The plurality of heaters 352 are embedded in the thickness of the metal member 351D and the temperature sensor 353 embedded in the thickness of the metal member 351D so as to extend substantially parallel to the contact surface B1. The temperature sensor 353 detects the temperature of the metal member 351D. For example, a thermocouple can be used as the temperature sensor 353.

The metal member 351D is made of a metal material having high thermal conductivity. For example, aluminum can be suitably used as the metal member 351D. The contact surface B1 is in contact with the lower surface 101 of the substrate 100 on the upper surface 102 where the inspection point P2 is set, and has a shape separated from the inspection point P1 of the lower surface 101.

Within the thickness of the metal member 351D, a plurality of holes extending substantially in parallel with the contact surface B1 are formed along the longitudinal direction of the metal member 351D, and a heater 352 having a cylindrical shape, for example, is inserted into the hole. As the heater 352, a so-called helium heater formed by winding a nichrome wire with a ceramic core and sealing it in a stainless steel sheath can be used.

The heater 352 and the temperature sensor 353 are connected to the temperature control unit 9. The temperature control unit 9 can use a so-called temperature regulator. The temperature control unit 9 starts heating of the metal members 351D and 351U in accordance with, for example, a control signal from the inspection processing unit 8. The temperature control unit 9 feedback-controls the heating of the heater 352 based on the temperature of the metal members 351D and 351U detected by the temperature sensor 353, thereby heating the metal members 351D and 351U to a predetermined set temperature Tta. For example, a temperature in the range of 60 ° C to 130 ° C can be suitably used as the set temperature Tta. By heating the metal members 351D, 351U that have been in contact with the substrate 100 to the set temperature Tta The plate 100 is heated to a set temperature Tta. Further, in order to quickly and surely heat the substrate 100 to the set temperature Tta, the temperature control unit 9 may be configured to heat the metal members 351D and 351U to a temperature higher than the set temperature Tta.

The metal member 351D is coupled to the base 321D by, for example, a plurality of pillars 37. A sheet-shaped heat insulating member 36 is interposed between the metal member 351D and the plurality of pillars 37, for example. That is, the heating block 35D and the base 321D are connected to each other through the heat insulating member 36.

For the heat insulating member 36, for example, a member having heat conductivity of 0.1 W/(m.K) or less of thermal conductivity can be suitably used. In this manner, since the heat generated by the heater 352 can be suppressed from being transmitted to the base 321D and the probe block 30D, the positional deviation of the base 321D and the probe block 30D due to thermal expansion, and the probe Pr can be reduced. The temperature rises and the resistance value of the probe Pr increases.

Further, since the heat of the metal member 351D heated by the heater 352 is dissipated by heat conduction by the heat insulating member 36, the temperature of the metal member 351D can be easily made by the heater 352. It is also easy to raise the temperature of the metal member 351D at a fixed set temperature Tta.

The probe block 30D is provided, for example, in such a manner as to surround the periphery of the heating block 35D. The probe block 30D includes a plurality of probes Pr and a support block 31D that holds the tips of the plurality of probes Pr toward the substrate 100.

The probe Pr has a rod shape or a needle shape. The probe Pr is made of a material having high conductivity, and for example, various materials such as nickel, a nickel alloy, and a palladium alloy can be used.

A plurality of through holes H supporting the probe Pr are formed in the support block 31D. Each of the through holes H is disposed so as to correspond to the position of the inspection point P1 of the lower surface 101 of the substrate 100 to be inspected. Thereby, the front end portion of the probe Pr is brought into contact with the inspection point P1. The base 321D is provided with an electrode 34a that is in contact with the rear end of each probe Pr to be electrically connected. The inspection unit 4D includes a connection circuit (not shown) that transmits the respective ends of the probes Pr to the inspection processing unit 8 and switches the connection thereof, etc., through the respective electrodes of the base 321D.

The support block 31D is configured by, for example, a plate-shaped support plates 31Da and 31Db that are connected to each other so as to be separated from each other by a column (not shown). The support plate 31Db is a front end side of the support block 31D, that is, a side facing the substrate 100, and the support plate 31Da is a rear side of the support block 31D, that is, a side attached to the base 321D. The upper surface of the support plate 31Db is provided as a contact surface C1 for contacting the substrate 100. The contact surface C1 and the contact surface B1 are flush with each other, and a space is provided between the contact surface B1 and the contact surface B1. Further, a plurality of through holes H are formed to penetrate the support plates 31Da and 31Db.

A base 321D made of, for example, an insulating resin material is attached to the rear end side of the support plate 31Da. The end opening is closed after the through hole H is closed by the base 321D. Where the base 321D faces each of the rear end side openings, the wiring 34 is provided so as to penetrate the base 321D. The surface of the base 321D facing the side of the support plate 31Da is flush with the end surface of the wiring 34 exposing the surface. The end face of the wiring 34 is referred to as an electrode 34a. A probe Pr is inserted into each of the through holes H. Wiring 34 series and inspection processing Part 8 is connected. In this manner, the inspection processing unit 8 is connected to the probe Pr through the wiring 34 and the electrode 34a.

Fig. 4 is an explanatory view showing an example of the configuration of the inspection aid 3U shown in Fig. 1. Fig. 4(a) is a plan view showing an example of the lower surface of the inspection aid 3U shown in Fig. 1, that is, the opposing surface of the inspection aid 3U facing the substrate 100. Fig. 4(b) is a cross-sectional view taken along line b-b of the inspection aid 3U shown in Fig. 4(a). The inspection aid 3U is an example of an inspection aid for the second surface.

The inspection aid 3U shown in Fig. 4 includes a probe block 30U, two heating blocks 35U (a heating unit for the second surface), and a base 321U. The base 321U has, for example, a substantially plate shape, and the probe block 30U and the heating block 35U are attached to one surface of the base 321U. Thereby, the base 321U holds the probe block 30U and the heating block 35U integrally. The probe Pr supported by the probe block 30U corresponds to an example of the probe for the second surface.

The heating block 35U includes, for example, two metal members 351U having an "L" shape, each having a contact surface B2 (contact surface for the second surface) for contacting the upper surface 102 of the substrate 100, and being positive with the contact surface B2. The heater 352 has a thickness and a heater 352, and is embedded in the thickness of each metal member 351U and a temperature sensor 353 attached to the side surface of each metal member 351U so as to extend substantially parallel to the contact surface B2. Each temperature sensor 353 detects the temperature of each metal member 351U.

The metal member 351U is made of the same material as the metal member 351D. The contact surface B2 is in contact with the upper surface 102 of the substrate 100 on the lower surface 101 where the inspection point P1 is set, and has an upper surface 102 The checkpoint P2 separates the shape.

A hole extending substantially in parallel with the contact surface B2 is formed along the longitudinal direction of the metal member 351U in the thickness of the metal member 351U, and the heater 352 is inserted into the hole. The temperature control unit 9 feedback-controls the heat generation of the heater 352 based on the temperature of the metal member 351U detected by the temperature sensor 353, thereby heating the metal member 351U to the set temperature Tta.

The heater 352 has a shape that extends in a strip shape in one direction, such as a rod shape. The heating blocks 35D and 35U are embedded in the metal members 351D and 351U having a thickness of a block, and the heater 352 is embedded in the longitudinal direction of the metal members 351D and 351U substantially in parallel with the contact faces B1 and B2. . As a result, the heat generated by the heater 352 can be efficiently conducted to the metal members 351D and 351U, and the contact faces B1 and B2 can be heated to conduct heat with uniformity.

Further, the heating blocks 35D and 35U may be configured such that the contact faces B1 and B2 are in contact with the substrate 100 and heated, and it is not necessary to embed the heater in the metal member, or the heater may be extended in parallel with the contact faces B1 and B2. The composition of the setting.

The metal member 351U is coupled to the base 321U by, for example, a plurality of pillars 37. A sheet-shaped heat insulating member 36 is interposed between the metal member 351U and the plurality of pillars 37, for example. That is, the heating block 35U and the base 321U are connected to each other through the heat insulating member 36. Thereby, since the heat generated by the heater 352 can be suppressed from being transmitted to the base 321U and the probe block 30U, the position of the base 321U and the probe block 30U due to thermal expansion can be reduced. There is a concern that the temperature of the probe Pr rises and the resistance value of the probe Pr increases, such as an offset.

Further, since the heat of the metal member 351U heated by the heater 352 is dissipated by heat conduction by the heat insulating member 36, the temperature of the metal member 351U can be easily made by the heater 352. It is also easy to raise the temperature of the metal member 351U at a fixed set temperature Tta.

Further, the heat insulating member 36 may not be in the form of a sheet. For example, the pillar 37 may be formed of a material having a heat insulating property, and the pillar 37 may be configured to function as a heat insulating member instead of the sheet-shaped heat insulating member 36. Alternatively, the inspection aids 3U and 3D may have a configuration without a heat insulating member.

One of the probe blocks 30U is disposed, for example, with a portion vacating and facing the continuous sides of the heating block 35U, and the other portion is vacant and disposed facing the other two sides of the heating block 35U. The probe block 30U includes a plurality of probes Pr and a support block 31U that holds the tips of the plurality of probes Pr toward the substrate 100.

A plurality of through holes H supporting the probe Pr are formed in the support block 31U. Each of the through holes H is disposed so as to correspond to the position of the inspection point P2 of the upper surface 102 of the substrate 100 to be inspected. Thereby, the front end portion of the probe Pr is brought into contact with the inspection point P2. The base 321U is provided with an electrode 34a that is in contact with the rear end of each probe Pr to be electrically connected. The inspection unit 4U includes a connection circuit (not shown) that transmits the electrodes at the rear end of each probe Pr to the inspection processing unit 8 and switches the connection thereof, etc., through the respective electrodes of the base 321U.

The support block 31U is configured by, for example, a plate-shaped support plates 31Ua and 31Ub that are connected to each other so as to be separated from each other by a column (not shown). The support plate 31Ub is a front end side of the support block 31U, that is, a side facing the substrate 100, and the support plate 31Da is a rear side of the support block 31U, that is, a side attached to the base 321U. The lower surface (the upper surface in FIG. 4(b)) of the support plate 31Ub is set as the contact surface C2 for contacting the substrate 100. The contact surface C2 and the contact surface B2 are flush with each other, and a space is provided between the contact surface B2 and the contact surface B2. Further, a plurality of through holes H are formed to penetrate the support plates 31Ua and 31Ub.

A base 321U is attached to the rear end side of the support plate 31Ua. The end opening is closed after the through hole H is closed by the base 321U. Where the base 321U faces each of the rear end side openings, the wiring 34 is provided so as to penetrate the base 321U. The surface of the base 321U facing the side of the support plate 31Ua is flush with the end surface of the wiring 34 exposing the surface. The end face of the wiring 34 is referred to as an electrode 34a. A probe Pr is inserted into each of the through holes H. The wiring 34 is connected to the inspection processing unit 8. In this manner, the inspection processing unit 8 is connected to the probe Pr of the inspection aid 3U through the wiring 34 and the electrode 34a.

5 is an explanatory view showing a state in which the contact surface of the inspection aid 3D and the probe Pr and the substrate 100 are displayed on the upper surface 102 side, and the inspection aid 3D is brought into contact with the lower surface 101 of the substrate 100 for inspection. Fig. 6 is an explanatory view showing a state in which the contact surface of the inspection aid 3U and the probe Pr and the substrate 100 are displayed on the upper surface 102 side, and the inspection aid 3U is brought into contact with the upper surface 102 of the substrate 100 for inspection.

As shown in Fig. 5, the inspection aid 3D is brought into contact with the base At the lower surface 101 of the board 100, the contact surface B1 is in contact with the lower surface 101 of the substrate 100 on the upper surface 102 where the inspection point P2 is set, and is separated from the inspection point P1 of the lower surface 101 of the substrate 100. On the other hand, as shown in FIG. 6, when the inspection aid 3U is brought into contact with the upper surface 102 of the substrate 100, the contact surface B2 contacts the upper surface of the substrate 100 on the lower surface 101 where the inspection point P1 is set. 102 and separated from the inspection point P2 of the upper surface 102.

According to the inspection aids 3D and 3U, the probe Pr can be brought into contact with the inspection points P1 and P2 while heating the probe including the inspection points P1 and P2 from the back side of the inspection points P1 and P2 without heating the probe Pr. Therefore, the influence of the inspection by the heating of the probe can be reduced, and the inspection of the substrate 100 can be performed while heating the substrate 100 to apply thermal stress. In this way, it is possible to detect a substrate defect that is hard to appear in the inspection at normal temperature. Furthermore, since the substrate 100 can be heated by directly contacting the contact faces B1, B2 with the substrate 100, the substrate 100 can be quickly heated and the substrate 100 can be lifted as compared with the case where the preheating cavity is used to heat the substrate in the prior art. Heating to the certainty of the set temperature Tta. As a result, it is possible to reduce the inspection time while applying thermal stress to the substrate to be inspected, and to improve the reliability of applying thermal stress to the substrate.

Further, the contact surface B1 shown in Fig. 5 is set in such a manner as to be in contact with the region X where no inspection points P1 and P2 are provided. Thereby, the wiring pattern or the like formed in the region X of the substrate 1001 can be heated, so that the inspection accuracy of the defect occurring in the region X is improved.

Figure 7 shows the inspection aid set shown in Figure 1. An illustration of another example of 2. The inspection aid set 2' shown in Fig. 7 is composed of a combination heating aid 3D' and a probe assisting device 3U'. The heating aid 3D' is composed of a heating block 35D. The probe aid 3U' is composed of a probe block 30U. The probe Pr of the probe assistant 3U' is connected to the inspection processing unit 8 by, for example, the electrode 34a and the wiring 34 similar to the substrate 321U. The inspection aid set 2' thus configured can be suitably used for inspection of a substrate on which the inspection point is provided only on one side.

Further, the substrate inspection apparatus 1 may have only one of the inspection units 4U and 4D. Even if only one of the inspection units 4U and 4D is provided, the inspection and heating of the substrate can be performed by any one of the inspection aids 3U and 3D. Therefore, it is possible to reduce the inspection time while applying thermal stress to the substrate to be inspected.

Furthermore, although the configuration in which the contact surface B1 for heating the substrate 100 and the contact surface C1 of the support block 31D for supporting the probe Pr are separated is shown, it may be, for example, by heating the contact surface C1. The needle block 30D also serves as a configuration of the heating portion. Even in such a configuration, since inspection and heating of the substrate can be performed, it is possible to reduce the inspection time while applying thermal stress to the substrate to be inspected.

Next, an example of the substrate inspection method executed by the inspection processing unit 8 will be described. As described above, the temperature control unit 9 performs temperature control to heat the metal members 351D and 351U that are in contact with the substrate 100 so that the temperature of the substrate 100 reaches the set temperature Tta. However, since the metal members 351D and 351U are metal blocks, the heat capacity is large. Therefore, it is necessary to heat the metal members 351D and 351U at normal temperature (ambient temperature) before heating to the set temperature. Temperatures of Tta or above are time consuming.

Further, the substrate 100 also has a heat capacity, and the material constituting the substrate 100 (for example, an epoxy resin or the like) has a lower thermal conductivity than the metal members 351D and 351U. Therefore, when the temperature of the metal members 351D and 351U reaches the set temperature Tta or higher, the time difference is generated until the substrate 100 reaches the set temperature Tta or higher. Therefore, in order to perform inspection after the substrate 100 reaches the set temperature Tta, generally, after the heating by the heater 352 is started, it is necessary to wait for the substrate 100 to reach the set temperature Tta for a sufficiently long time before performing the inspection. However, if you wait for such a long time to start checking again, it takes a long time to perform the inspection.

On the other hand, the inspection processing unit 8 starts the inspection when the resistance value R reaches the target resistance value Tra corresponding to the set temperature Tta by the characteristic that the resistance value R of the wiring pattern formed on the substrate 100 changes with temperature. Thereby, it is possible to quickly perform inspection when the temperature of the substrate 100 itself actually reaches the set temperature Tta, and it is possible to shorten the inspection time as compared with the case where the inspection is started after waiting for a very long time. In addition, since it is confirmed after the substrate 100 itself has actually reached the set temperature Tta, the accuracy of the thermal stress applied to the substrate 100 at the time of inspection is improved.

Further, the predicted substrate 100 may be used to measure the time from the start of heating of the heater 352 until the resistance value R reaches the target resistance value Tra, and set the waiting time, and the waiting time is previously stored in the memory device. In the inspection of the actual substrate 100, after the waiting time of the pre-measurement from the start of the heating of the heater 352, the contact is based on The electrical signals obtained by the probes of each checkpoint are used to perform the inspection.

Further, when a plurality of substrates 100 are continuously inspected, for example, when a plurality of substrates 100 are connected to each other, the inspection aids 3U and 3D are heated in the second and subsequent inspections, so that the inspection is started. The time from the heating (the inspection aids 3U, 3D are brought into contact with the substrate 100) until the temperature of the substrate 100 reaches the set temperature Tta becomes shorter. In this way, the waiting time at the time of the second and subsequent inspections can be experimentally measured in advance, and the waiting time is set in the same manner as described above, and the waiting time of the second and subsequent inspections is changed in response to each waiting time.

Specifically, the inspection processing unit 8 performs inspection of the substrate 100 in the following manner. Fig. 8 is an explanatory view for explaining a substrate inspection method. First, the specific inspection points Px and Py in which one pair of wiring patterns are electrically connected to each other are selected from a plurality of inspection points P1 or P2 set on the substrate 100 in advance, and the specific inspection points Px and Py are set in advance.

Figs. 9 and 10 are flowcharts for explaining an example of the substrate inspection method. The inspection processing unit 8 brings the contact faces B1, B2, C1, and C2 of the inspection aids 3U and 3D into contact with the substrate 100, and brings the probes Pr into contact with the respective inspection points P1 and P2 (step S1).

Next, the inspection processing unit 8 acquires the detected temperature t of the temperature sensor 353 as the low temperature temperature TLo (step S2). At this time, the temperature of any one of the temperature sensors 353 may be used, or the average value of the detected temperatures of the respective temperature sensors 353 may be used.

Next, the inspection processing unit 8 acquires the resistance value R between the specific inspection points Px and Py as the low-temperature resistance value RLo (step S3). resistance The value R is obtained by measuring a voltage generated between the pair of probes Pr by a current flowing between one of the specific inspection points Px and Py and the probe Pr, and dividing the voltage value by the current value. Got it.

Further, in the measurement of the resistance value R, the resistance measurement is performed by a so-called four-terminal method, and it is preferable to perform resistance measurement with good precision. Specifically, the current supply probe Pr and the voltage measurement probe Pr are brought into contact with the specific inspection point Px, and the current supply probe Pr and the voltage measurement probe Pr are also brought into contact with the specific inspection point Py. A current flows between the pair of current supply probes Pr, and a voltage generated between the pair of probes for voltage measurement Pr is measured. It is preferable to obtain the resistance value R by dividing the voltage value by the current value.

Next, the inspection processing unit 8 outputs a control signal to the temperature control unit 9, causes the heater 352 to generate heat, and heats the metal members 351D and 351U to heat the substrate 100 (step S4).

Then, the inspection processing unit 8 operates in the same manner as steps S2 and S3, and acquires the detected temperature t of the temperature sensor 353 as the high temperature temperature THi (step S5), and acquires the resistance value R between the specific inspection points Px and Py. The resistor RHi is used as a high temperature (step S6).

Next, the inspection processing unit 8 calculates the temperature coefficient Tc based on the low temperature temperature TLO, the low temperature resistance RLo, the high temperature temperature THi, and the high temperature resistance RHi (step S7). Specifically, the inspection processing unit 8 can calculate the temperature coefficient Tc based on the following formula (1).

Temperature coefficient Tc=[(RHi-RLo)/RLo]/(THi-TLo)...(1)

Next, the inspection processing unit 8 is based on the temperature at a low temperature. TLo, the low-temperature resistance RLo, and the temperature coefficient Tc are calculated as the target resistance value Rta when the substrate 100 reaches the set temperature Tta (step S8). Specifically, the inspection processing unit 8 can calculate the target resistance value Rta based on the following formula (2).

Target resistance value Rta=RLo{[(Tta-TLo)/Tc]+1}...(2)

Next, the inspection processing unit 8 measures the resistance value R between the specific inspection points Px and Py in the same manner as described above (step S11: resistance measurement step).

Next, the inspection processing unit 8 compares the resistance value R measured in step S11 with the resistance determination value Rj (step S12). The resistance determination value Rj is a resistance value for determining whether or not the wiring pattern between the specific inspection points Px and Py is good, and a specific inspection point Px in the case where the line is thinned and the resistance value is increased, for example, is set. The resistance value between Py and Py is set to a value far larger than the target resistance value Rta as the resistance determination value Rj.

When the resistance value R exceeds the resistance determination value Rj (YES in step S12), the inspection processing unit 8 determines that the wiring pattern between the specific inspection points Px and Py is defective, that is, the substrate 100 is defective (step S13). And end the process. In this case, when the wiring pattern between the specific inspection points Px and Py is defective and becomes a resistance value equal to or higher than the target resistance value Rta, even if the temperature of the substrate 100 has not reached the set temperature Tta or more, the execution of the step S15 can be reduced. The uncertainty of the decision.

Next, the inspection processing unit 8 compares the resistance value R measured in step S11 with the target resistance value Rta (step S14). If the resistance value R does not reach the target resistance value Rta (NO in step S14), the steps S11 to S14 are repeated again, and the standby value R reaches the target resistance value Rta. on.

On the other hand, when the resistance value R reaches the target resistance value Rta or more (YES in step S14: the inspection start determination step), the electrical signal obtained from each probe is obtained based on the temperature of the substrate 100 reaching the set temperature Tta or more. The quality of the substrate 100 is determined, and the inspection of the substrate 100 is started (step S15).

Further, even if steps S12 and S13 are not performed, if the wiring between the specific inspection points Px and Py is defective such as disconnection, since the failure can be detected in step S15, step S12 may not be performed. The composition of S13.

Further, steps S1 to S8 are not limited to the examples executed at the time of substrate inspection. For example, the predicted substrate 100 may be used, and steps S1 to S8 may be experimentally performed to obtain a target resistance value Rta. Further, the target resistance value Rta obtained in this manner can be first memorized to the memory device, and when the substrate 100 is actually inspected, the steps S1, S4, and S11 to S15 are performed in accordance with the target resistance value Rta stored in the memory device. .

3D‧‧‧Check aids

30D‧‧‧ probe block

31D‧‧‧Support block

31Da, 31Db‧‧‧ support plate

34‧‧‧Wiring

34a‧‧‧electrode

35D‧‧‧heating block (heating section)

36‧‧‧Insulation members

37‧‧‧ pillar

321D‧‧‧Abutment

351D‧‧‧Metal components

352‧‧‧heater

353‧‧‧temperature sensor

B1‧‧‧ contact surface

C1‧‧‧ contact surface

H‧‧‧through hole

Pr‧‧‧ probe

Claims (10)

An inspection aid for inspecting a substrate on which an inspection object is set, the inspection aid having: a probe for contacting the inspection point; and a heating portion having a contact for contacting the substrate The surface is heated by heating the contact surface. The inspection aid according to claim 1, wherein the substrate has a first surface and a second surface, and the inspection point is set on the first surface and the second surface, and the probe is in contact with In the inspection point on the first surface, the contact surface is in contact with the first surface of the substrate on the second surface where the inspection point is set, and has a shape separated from the inspection point of the first surface. The inspection aid according to claim 1 or 2, wherein the heating unit includes: a metal member having the contact surface and having a thickness in a direction orthogonal to the contact surface; and a heater Extending substantially parallel to the aforementioned contact surface within the thickness of the aforementioned metal member. The inspection aid according to any one of claims 1 to 3, further comprising: a support member that supports the probe; and a base that integrally supports the support member and the heating portion, the heating portion and The aforementioned abutment is insulated by heat insulation Connected by components. An inspection aid kit comprising the inspection aid according to item 2 of the application patent and the inspection aid for the second surface for inspecting the substrate, wherein the inspection aid for the second surface includes: a probe for the two sides for contacting the inspection point of the second surface; and a heating portion for the second surface having a contact surface for contacting the second surface of the substrate, by heating the foregoing The second surface is heated by the contact surface; the second surface contact surface is in contact with the second surface of the substrate on the first surface where the inspection point is set, and has the second surface The shape of the checkpoint is separated. An inspection aid kit for inspecting a substrate having a first surface and a second surface and having an inspection object set on the first surface, the inspection aid kit having: a probe aid having a probe for contacting the inspection point on the first surface; and a heating aid having a contact surface for contacting the second surface of the substrate, and heating the substrate by heating the contact surface. A substrate inspection device comprising: the inspection aid according to any one of claims 1 to 4; and an inspection processing unit that causes the probe to contact the inspection point and The contact surface is in contact with the substrate, and the inspection of the substrate is performed based on an electrical signal obtained from the probe. A substrate inspection device comprising: the inspection aid set according to claim 5; and an inspection processing unit, wherein the probe is in contact with the inspection point on the first surface, and the contact surface is in contact with the aforementioned The first surface of the substrate on which the inspection point is set on the second surface, and the second surface probe is in contact with the inspection point of the second surface, and the second surface contact surface is contacted The second surface of the substrate on which the inspection point is set on the first surface, and the inspection of the substrate based on an electrical signal obtained from the probe and the probe for the second surface. A substrate inspection device comprising: the inspection aid set according to claim 6; and an inspection processing unit that contacts the probe to the inspection point of the first surface and contacts the contact surface with the aforementioned On the second side, the inspection of the substrate is performed based on an electrical signal obtained from the probe. The substrate inspection device according to any one of the seventh aspect of the present invention, wherein the substrate has a wiring pattern formed thereon, and one of the connection patterns is connected to the specific inspection point as the inspection point. The inspection processing unit performs the following steps: a resistance measuring step of measuring a resistance value between the pair of specific inspection points based on an electrical signal obtained from a probe contacting the respective specific inspection points; and an inspection start determination step, When the resistance value measured by the resistance measuring step becomes equal to or higher than a predetermined target resistance value, the aforementioned inspection is started.