JP6682895B2 - Inspection jig, inspection jig set, and board inspection device - Google Patents

Description

  The present invention relates to an inspection jig for bringing a probe into contact with a substrate, an inspection jig set, and a substrate inspection device.

  Conventionally, wiring is performed to inspect a wiring pattern formed on a substrate such as a printed wiring board or the like, the presence or absence of a short circuit defect between wiring patterns, or a wiring pattern and a resistance value between wiring patterns. A plurality of inspection points such as pads and lands formed on the pattern are brought into contact with, for example, a movable inspection contactor or a plurality of inspection contacts held in a multi-needle shape, and then on the inspection target wiring pattern. There is known a board inspecting apparatus that inspects a board by measuring an electric resistance between the inspection points.

  In such a substrate, for example, the connection between the wiring pattern and the via hole may be incomplete, and the connection may be conducted but the connection may be unstable. In such a defect, at the time of inspection, it is determined that there is continuity between the inspection points, and after being regarded as a non-defective product and incorporated into the product, the defect may become apparent due to temperature stress in the use environment. In particular, an incomplete connection failure in the embedded via hole that connects the wiring patterns inside the substrate is difficult to detect by inspection because it cannot be visually inspected from the outside of the substrate.

  Therefore, at the time of substrate inspection, the preheating chamber is used to heat the space in which the substrate to be inspected is placed, and the substrate is placed in a high temperature environment. An inspection apparatus has been proposed that detects a complete connection failure (see, for example, Patent Document 1).

JP, 2001-215257, A

  However, as described above, in the inspection apparatus that uses the preheating chamber to heat the mounting space of the substrate to be inspected to apply the temperature stress to the substrate, the inspection time is increased because it takes time to heat the substrate. There was an inconvenience.

  An object of the present invention is to provide an inspection jig, an inspection jig set, and a substrate inspection device that can reduce the inspection time while applying temperature stress to the inspection target substrate.

  An inspection jig according to the present invention is an inspection jig for inspecting a substrate on which inspection points to be inspected are set, and a probe for contacting the inspection point and a contact for contacting the substrate. A heating unit having a surface and heating the substrate by heating the contact surface.

  According to this configuration, since the substrate can be heated by heating the contact surface in contact with the substrate, it is possible to heat the substrate by heating the substrate mounting space by using the preheating chamber. Is easy to heat in a short time. Therefore, the inspection time can be shortened while applying the temperature stress to the substrate to be inspected.

  Further, the substrate has a first surface and a second surface, the inspection point is set on the first surface and the second surface, the probe, the inspection point of the first surface The contact surface is in contact with the first surface of the area of the substrate where the inspection point is set on the second surface, and is separated from the inspection point of the first surface. It is preferable.

  According to this configuration, the area where the inspection point of the substrate is set can be heated from the back side of the surface where the inspection point is set, so that the probe for contacting the inspection point may be heated. The substrate can be heated while being reduced.

  Further, the heating unit includes a metal member having the contact surface and having a thickness in a direction orthogonal to the contact surface, and a heater extending within the thickness of the metal member substantially parallel to the contact surface. Is preferred.

  According to this structure, the heat generated by the heater can be efficiently conducted to the metal member, and the heat can be heated so that the heat can be transmitted to the entire contact surface in a well-balanced manner.

  Further, further comprising a support member for supporting the probe, and a base that integrally supports the support member and the heating unit, the heating unit and the base through a heat insulating member having a heat insulating property. It is preferably linked.

  According to this structure, the heat generated in the heating unit is less likely to escape to the base, so that the substrate can be heated quickly and efficiently. Further, it is possible to reduce the risk that the probe will be heated via the base.

  An inspection jig set according to the present invention is an inspection jig set including the above-mentioned inspection jig and a second surface inspection jig for inspecting the substrate, The jig has a second surface probe for contacting an inspection point on the second surface, and a second surface contact surface for contacting the second surface of the substrate. The second surface heating unit for heating the substrate by heating the contact surface, the contact surface for the second surface, in the substrate, of the region where the inspection point is set on the first surface It has a shape that contacts the second surface and is separated from the inspection point of the second surface.

  According to this inspection jig set, it is possible to heat and inspect the substrate from both sides.

  Further, the inspection jig set according to the present invention is an inspection jig set for inspecting a substrate having a first surface and a second surface, and an inspection point of an inspection object set on the first surface. By having a probe jig having a probe for contacting the inspection point on the first surface and a contact surface for contacting the second surface of the substrate, and heating the contact surface. And a heating jig for heating the substrate.

  According to this configuration, the substrate can be inspected by the probe jig while heating the substrate by heating the contact surface brought into contact with the substrate by the heating jig, so that the substrate can be placed using the preheating chamber. It is easier to heat the substrate in a shorter time than heating the substrate by heating the space. Therefore, the inspection time can be shortened while applying the temperature stress to the substrate to be inspected. Further, since the area where the inspection point of the substrate is set can be heated from the back side of the surface where the inspection point is set, while reducing the risk of heating the probe for contacting the inspection point, The substrate can be heated.

  Further, the board inspection apparatus according to the present invention, the above-mentioned inspection jig and the probe are brought into contact with the inspection point, the contact surface is brought into contact with the board, and the board of the board is made based on an electric signal obtained from the probe. An inspection processing unit that performs an inspection.

  According to this configuration, since the substrate can be inspected by the probe while heating the substrate by heating the contact surface in contact with the substrate, it is possible to heat the mounting space of the substrate by using the preheating chamber. It is easier to heat the substrate in a shorter time than to heat the substrate. Therefore, the inspection time can be shortened while applying the temperature stress to the substrate to be inspected.

  In addition, the board inspection device according to the present invention brings the above-mentioned inspection jig set and the probe into contact with the inspection point of the first surface, and the contact surface is the inspection point on the second surface of the substrate. Is brought into contact with the first surface of the area set, the second surface probe is brought into contact with the inspection point of the second surface, the second surface contact surface, in the substrate, the first surface And an inspection processing unit that makes an inspection of the substrate based on an electrical signal obtained from the probe and the probe for the second surface by bringing the inspection surface into contact with the second surface of the area.

  According to this configuration, even when the inspection points are set on both surfaces of the substrate, while heating the substrate by heating the contact surface in contact with both surfaces of the substrate and the contact surface for the second surface. Since the substrate and the probe for the second surface can be in contact with the inspection points on both sides to inspect the substrate, the substrate can be inspected rather than heating the substrate mounting space by using the preheating chamber. Easy to heat in a short time. Therefore, the inspection time can be shortened while applying the temperature stress to the substrate to be inspected. Further, since the area where the inspection point of the substrate is set can be heated from the back side of the surface where the inspection point is set, the probe for contacting the inspection point and the probe for the second surface are heated. The substrate can be heated while reducing the risk.

  Further, the board inspection device according to the present invention is obtained from the probe by bringing the above-mentioned inspection jig set and the probe into contact with an inspection point of the first surface and bringing the contact surface into contact with the second surface. An inspection processing unit that inspects the substrate based on an electric signal.

  According to this configuration, since the substrate can be inspected while heating the substrate by heating the contact surface in contact with the substrate, the substrate is heated by heating the mounting space of the substrate by using the preheating chamber. It is easier to heat the substrate in a shorter time than heating. Therefore, the inspection time can be shortened while applying the temperature stress to the substrate to be inspected. Further, since the area where the inspection point of the substrate is set can be heated from the back side of the surface where the inspection point is set, while reducing the risk of heating the probe for contacting the inspection point, The substrate can be heated.

It is a conceptual diagram which shows roughly the structure of the board | substrate inspection apparatus provided with the contact terminal and the inspection jig which concern on one Embodiment of this invention. It is a top view which shows an example of the board | substrate shown in FIG. It is explanatory drawing which shows an example of a structure of the inspection jig shown in FIG. It is explanatory drawing which shows an example of a structure of the inspection jig shown in FIG. FIG. 3 is an explanatory view showing a state in which an inspection jig is in contact with a lower surface of a substrate for inspection, with the contact surface of the inspection jig, the probe, and the substrate overlapped from the upper surface side. FIG. 3 is an explanatory view showing a state in which an inspection jig is brought into contact with the upper surface of a substrate for inspection, with the contact surface of the inspection jig, the probe, and the substrate superimposed from the upper surface side. It is explanatory drawing which shows another example of the inspection jig set shown in FIG. It is explanatory drawing for demonstrating a board | substrate inspection method. It is a flow chart for explaining an example of a substrate inspection method. It is a flow chart for explaining an example of a substrate inspection method.

  Hereinafter, embodiments according to the present invention will be described with reference to the drawings. In addition, in each of the drawings, the same reference numerals denote the same components, and the description thereof will be omitted.

  FIG. 1 is a conceptual diagram schematically showing the configuration of a board inspection device 1 including a contact terminal and an inspection jig according to an embodiment of the present invention. The board inspection apparatus 1 shown in FIG. 1 is an apparatus for inspecting a circuit pattern formed on a board 100 which is an inspection object.

  The substrate 100 may be various substrates such as a printed wiring board, a flexible substrate, a ceramic multilayer wiring board, an electrode plate for a liquid crystal display or a plasma display, a semiconductor substrate, a package substrate for a semiconductor package or a film carrier.

  The substrate inspection apparatus 1 shown in FIG. 1 includes inspection units 4U and 4D, a substrate fixing device 6, an inspection processing unit 8, and a temperature control unit 9. The board fixing device 6 is configured to fix the board 100 to be inspected at a predetermined position. The inspection units 4U and 4D include inspection jigs 3U and 3D, a connection circuit that electrically connects the probe Pr and the inspection processing unit 8 included in the inspection jigs 3U and 3D, and the like. The inspection units 4U and 4D can move the inspection jigs 3U and 3D in three axial directions of X, Y, and Z orthogonal to each other by a drive mechanism (not shown). It is rotatable about an axis.

  The inspection unit 4U is located above the substrate 100 fixed to the substrate fixing device 6. The inspection unit 4D is located below the substrate 100 fixed to the substrate fixing device 6. The inspection units 4U and 4D are configured such that inspection jigs 3U and 3D for inspecting a circuit pattern formed on the substrate 100 can be attached and detached. Hereinafter, the inspection units 4U and 4D are collectively referred to as the inspection unit 4.

  The inspection jigs 3U and 3D each include a plurality of probes Pr. In FIG. 1, details of the inspection jigs 3U and 3D are omitted and simply illustrated. The inspection jigs 3U and 3D can be replaced according to the board 100 to be inspected. The inspection jigs 3U and 3D each correspond to an example of the inspection jig. Further, one of the inspection jigs 3U and 3D corresponds to an example of an inspection jig, and the other has a relationship corresponding to an example of an inspection jig for the second surface. A combination of the inspection jig 3D and the inspection jig 3U is an inspection jig set 2. Details of the inspection jigs 3U and 3D will be described later.

  The inspection processing unit 8 includes, for example, a power supply circuit, a voltmeter, an ammeter, and a microcomputer. The inspection processing unit 8 controls a drive mechanism (not shown) to move and position the inspection units 4U and 4D, and bring the tip of each probe Pr into contact with each inspection point on the substrate 100. As a result, each inspection point and the inspection processing unit 8 are electrically connected. Further, the inspection processing unit 8 controls the operation of the temperature control unit 9 to heat the substrate 100. In this state, the inspection processing unit 8 supplies an inspection current or voltage to each inspection point on the substrate 100 via each probe Pr of the inspection jigs 3U and 3D, and outputs a voltage signal or a voltage signal obtained from each probe Pr. Based on the current signal, for example, the circuit board 100 is inspected for disconnection or short circuit of the circuit pattern. Alternatively, the inspection processing unit 8 may measure the impedance of the inspection target based on the voltage signal or current signal obtained from each probe Pr by supplying an alternating current or voltage to each inspection point.

  The substrate 100 has a lower surface 101 and an upper surface 102. The lower surface 101 corresponds to an example of the first surface, and the upper surface 102 corresponds to an example of the second surface. The first surface and the second surface may be the one surface and the other surface of the substrate 100, and their directions are not limited.

  FIG. 2 is a plan view showing an example of the substrate 100 shown in FIG. The board 100 shown in FIG. 2 is, for example, a flexible board, and is a combined board in which two boards A to be inspected having the same shape and the same wiring pattern are combined. The two substrates A are combined in different directions from the viewpoint of increasing the number of substrates that can be taken from the substrate material. The substrate 100 is not limited to such an assembled substrate. Further, a plurality of sets of such assembled substrates may be combined to form the substrate 100. The substrate A may be a substrate attached to an electronic member such as a touch panel display, or incorporated in the touch panel display for use.

  A plurality of inspection points P1 are set on the lower surface 101 of the substrate 100. A plurality of inspection points P2 are set on the upper surface 102 of the substrate 100. The inspection points P1 and P2 may be electrodes for connecting to an electronic member such as a touch panel display, pads for mounting electronic components, wiring patterns, or connector terminals. May be In the example shown in FIG. 2, for example, the inspection point P1 is assumed to be a connector terminal called a so-called tab terminal for connecting an electronic member such as a touch panel display to the outside. For example, the inspection point P2 is connected to the electronic member. Electrodes, pads for attaching electronic parts, or wiring patterns are assumed.

  FIG. 3 is an explanatory diagram showing an example of the configuration of the inspection jig 3D shown in FIG. FIG. 3A is a plan view showing an example of an upper surface of the inspection jig 3D shown in FIG. 1, that is, an opposed surface of the inspection jig 3D that faces the substrate 100. FIG. 3B is an end view of the inspection jig 3D shown in FIG.

  The inspection jig 3D shown in FIG. 3 includes a probe block 30D, a heating block 35D (heating unit), and a base 321D. The base 321D has, for example, a substantially plate shape, and the probe block 30D and the heating block 35D are attached to one surface of the base 321D. As a result, the base 321D integrally holds the probe block 30D and the heating block 35D.

  The heating block 35D has, for example, a contact surface B1 for contacting the lower surface 101 of the substrate 100, a substantially rectangular parallelepiped metal member 351D having a thickness in a direction orthogonal to the contact surface B1, and a thickness of the metal member 351D. In addition, a plurality of heaters 352 embedded so as to extend substantially parallel to the contact surface B1 and a temperature sensor 353 embedded within the thickness of the metal member 351D are provided. The temperature sensor 353 detects the temperature of the metal member 351D. As the temperature sensor 353, for example, a thermocouple is used.

  The metal member 351D is made of a metal material having high thermal conductivity. Aluminum, for example, can be preferably used as the metal member 351D. The contact surface B1 has a shape that is in contact with the lower surface 101 of a region of the substrate 100 where the inspection point P2 is set on the upper surface 102 and is separated from the inspection point P1 of the lower surface 101.

  Within the thickness of the metal member 351D, a plurality of holes extending substantially parallel to the contact surface B1 are formed along the lengthwise direction of the metal member 351D, and for example, a columnar heater 352 is inserted into the holes. There is. As the heater 352, for example, a so-called cartridge heater in which a nichrome wire is wound around a ceramic core and enclosed in a stainless sheath can be used.

  The heater 352 and the temperature sensor 353 are connected to the temperature controller 9. A so-called temperature controller can be used as the temperature control unit 9. The temperature control unit 9 starts heating the metal members 351D and 351U in response to a control signal from the inspection processing unit 8, for example. The temperature controller 9 controls the heat generation of the heater 352 by feedback control based on the temperature of the metal members 351D and 351U detected by the temperature sensor 353, thereby heating the metal members 351D and 351U to the preset temperature Tta. . As the set temperature Tta, for example, a temperature of about 60 ° C. to 130 ° C. can be suitably used. By heating the metal members 351D and 351U in contact with the substrate 100 to the set temperature Tta, the substrate 100 is heated to the set temperature Tta. In order to quickly and surely set the temperature of the substrate 100 to the set temperature Tta, the temperature control unit 9 may heat the metal members 351D and 351U to a temperature higher than the set temperature Tta.

  The metal member 351D is connected to the base 321D by a plurality of columns 37, for example. A sheet-shaped heat insulating member 36 is interposed between the metal member 351D and the plurality of columns 37, for example. That is, the heating block 35D and the base 321D are connected via the heat insulating member 36.

  As the heat insulating member 36, for example, a member having a heat conductivity of 0.1 W / (m · K) or less and having a heat insulating property can be preferably used. This suppresses the heat generated by the heater 352 from being conducted to the base 321D and the probe block 30D, so that the base 321D and the probe block 30D are displaced due to thermal expansion, and the temperature of the probe Pr is reduced. The risk that the resistance value of the probe Pr rises and increases may be reduced.

  Further, the heat of the metal member 351D heated by the heater 352 is prevented from escaping due to heat conduction by the heat insulating member 36, so that the temperature of the metal member 351D can be easily increased quickly by the heater 352, and It becomes easy to maintain the temperature of the metal member 351D at the constant set temperature Tta.

  The probe block 30D is provided so as to surround the heating block 35D, for example. The probe block 30D includes a plurality of probes Pr and a support block 31D that holds the plurality of probes Pr with their tips facing the substrate 100.

  The probe Pr has a rod shape or a needle shape. The probe Pr is made of a material having high conductivity, and various materials such as nickel, nickel alloy, and palladium alloy can be used.

  The support block 31D is formed with a plurality of through holes H that support the probe Pr. Each through hole H is arranged so as to correspond to the position of the inspection point P1 on the lower surface 101 of the substrate 100 to be inspected. As a result, the tip of the probe Pr comes into contact with the inspection point P1. The base 321D is provided with an electrode 34a that is in contact with the rear end of each probe Pr and is conductive. The inspection unit 4D includes a connection circuit (not shown) that electrically connects the rear end of each probe Pr to the inspection processing unit 8 via each electrode of the base 321D and switches the connection.

  The support block 31D is configured such that, for example, plate-shaped support plates 31Da and 31Db are coupled and supported so as to be spaced apart and opposed to each other by columns (not shown). The support plate 31Db is on the front end side of the support block 31D, that is, the side facing the substrate 100, and the support plate 31Da is on the rear end side of the support block 31D, that is, the side attached to the base 321D. The upper surface of the support plate 31Db is a contact surface C1 for contacting the substrate 100. The contact surface C1 is flush with the contact surface B1 and a space is provided between the contact surface C1 and the contact surface B1. A plurality of through holes H are formed so as to penetrate the support plates 31Da and 31Db.

  A base 321D made of, for example, an insulating resin material is attached to the rear end side of the support plate 31Da. The rear end side opening of the through hole H is closed by the base 321D. The wiring 34 is attached to the base 321D at a position facing each rear end side opening so as to penetrate the base 321D. The surface of the base 321D on the side facing the support plate 31Da and the end surface of the wiring 34 exposed on the surface are flush with each other. The end surface of the wiring 34 is an electrode 34a. A probe Pr is inserted into each through hole H. The wiring 34 is connected to the inspection processing unit 8. As a result, the inspection processing unit 8 is connected to the probe Pr via the wiring 34 and the electrode 34a.

  FIG. 4 is an explanatory diagram showing an example of the configuration of the inspection jig 3U shown in FIG. FIG. 4A is a plan view showing an example of a lower surface of the inspection jig 3U shown in FIG. 1, that is, an opposed surface of the inspection jig 3U that faces the substrate 100. FIG. 4B is an end view of the inspection jig 3U shown in FIG. The inspection jig 3U corresponds to an example of an inspection jig for the second surface.

  The inspection jig 3U shown in FIG. 4 includes a probe block 30U, two heating blocks 35U (second surface heating unit), and a base 321U. The base 321U has, for example, a substantially plate shape, and the probe block 30U and the heating block 35U are attached to one surface of the base 321U. As a result, the base 321U is configured to integrally hold the probe block 30U and the heating block 35U. The probe Pr supported by the probe block 30U corresponds to an example of the second surface probe.

  The heating block 35U has, for example, a contact surface B2 (contact surface for the second surface) for contacting the upper surface 102 of the substrate 100, and has a thickness in the direction orthogonal to the contact surface B2 and has an “L” shape. One metal member 351U, a heater 352 embedded in the thickness of each metal member 351U so as to extend substantially parallel to the contact surface B2, and a temperature sensor 353 attached to the side surface of each metal member 351U. . Each temperature sensor 353 detects the temperature of each metal member 351U.

  The metal member 351U is made of the same material as the metal member 351D. The contact surface B2 has a shape that is in contact with the upper surface 102 of a region of the substrate 100 where the inspection point P1 is set on the lower surface 101 and is separated from the inspection point P2 of the upper surface 102.

  A hole extending substantially parallel to the contact surface B2 is formed in the thickness of the metal member 351U along the longitudinal direction of the metal member 351U, and the heater 352 is inserted into this hole. The temperature control unit 9 heats the metal member 351U to the set temperature Tta by feedback-controlling the heat generation of the heater 352 based on the temperature of the metal member 351U detected by the temperature sensor 353, for example.

  The heater 352 has a shape elongated in one direction, for example, a rod shape. In the heating blocks 35D and 35U, the heater 352 is embedded in the block-shaped metal members 351D and 351U having a thickness, and the heaters 352 extend along the longitudinal direction of the metal members 351D and 351U and contact surfaces B1 and B2. Is extended substantially parallel to. As a result, it is possible to efficiently conduct the heat generated by the heater 352 to the metal members 351D and 351U and heat the contact surfaces B1 and B2 in a well-balanced manner.

  The heating blocks 35D and 35U need only be capable of bringing the contact surfaces B1 and B2 into contact with the substrate 100 to heat the heating blocks 35D and 35U, and may not necessarily have a structure in which a heater is embedded in a metal member. The configuration does not have to extend parallel to B2.

  The metal member 351U is connected to the base 321U by a plurality of columns 37, for example. A sheet-shaped heat insulating member 36 is provided between the metal member 351U and the plurality of columns 37, for example. That is, the heating block 35U and the base 321U are connected via the heat insulating member 36. As a result, the heat generated by the heater 352 is suppressed from being conducted to the base 321U and the probe block 30U, so that the base 321U and the probe block 30U are displaced due to thermal expansion, and the temperature of the probe Pr is reduced. The risk that the resistance value of the probe Pr rises and increases may be reduced.

  Further, the heat of the metal member 351U heated by the heater 352 is prevented from escaping due to heat conduction by the heat insulating member 36, so that the temperature of the metal member 351U can be quickly increased by the heater 352, and It becomes easy to maintain the temperature of the metal member 351U at the constant set temperature Tta.

  The heat insulating member 36 does not necessarily have to be in the form of a sheet. For example, instead of providing the sheet-shaped heat insulating member 36, the pillar 37 may be made of a material having a heat insulating property, and the pillar 37 may function as a heat insulating member. Alternatively, the inspection jigs 3U and 3D may be configured without a heat insulating member.

  For example, one of the probe blocks 30U is opposed to each other while leaving part of two continuous side surfaces of the heating block 35U, and the other is opposed to each other while leaving part of the other two side surfaces of the heating block 35U. The probe block 30U includes a plurality of probes Pr and a support block 31U that holds the plurality of probes Pr with their tips facing the substrate 100.

  A plurality of through holes H that support the probe Pr are formed in the support block 31U. Each through hole H is arranged so as to correspond to the position of the inspection point P2 on the upper surface 102 of the substrate 100 to be inspected. As a result, the tip of the probe Pr comes into contact with the inspection point P2. The base 321U is provided with an electrode 34a that is in contact with the rear end of each probe Pr and is conductive. The inspection unit 4D includes a connection circuit (not shown) that electrically connects the rear end of each probe Pr to the inspection processing unit 8 via each electrode of the base 321U and switches the connection.

  The support block 31U is configured such that, for example, plate-shaped support plates 31Ua and 31Ub are connected and supported so as to be spaced apart and opposed to each other by columns (not shown). The support plate 31Ub is on the front end side of the support block 31U, that is, the side facing the substrate 100, and the support plate 31Da is on the rear end side of the support block 31U, that is, the side attached to the base 321U. The lower surface (upper surface in FIG. 4B) of the support plate 31Ub is a contact surface C2 for contacting the substrate 100. The contact surface C2 is flush with the contact surface B2, and a space is provided between the contact surface C2 and the contact surface B2. A plurality of through holes H are formed so as to penetrate the support plates 31Ua and 31Ub.

  A base 321U is attached to the rear end side of the support plate 31Ua. The rear end side opening of the through hole H is closed by the base 321U. The wiring 34 is attached to the base 321U at a position facing each rear end side opening so as to penetrate the base 321U. The surface of the base 321U facing the support plate 31Ua and the end surface of the wiring 34 exposed on the surface are flush with each other. The end surface of the wiring 34 is an electrode 34a. A probe Pr is inserted into each through hole H. The wiring 34 is connected to the inspection processing unit 8. As a result, the inspection processing unit 8 is connected to the probe Pr of the inspection jig 3U via the wiring 34 and the electrode 34a.

  FIG. 5 shows a state in which the inspection jig 3D is brought into contact with the lower surface 101 of the substrate 100 for inspection, with the contact surface of the inspection jig 3D and the probe Pr and the substrate 100 superimposed from the upper surface 102 side. It is a figure. FIG. 6 shows a state in which the inspection jig 3U is brought into contact with the upper surface 102 of the substrate 100 for inspection, with the contact surface of the inspection jig 3U, the probe Pr, and the substrate 100 superimposed from the upper surface 102 side. It is a figure.

  As shown in FIG. 5, when the inspection jig 3D is brought into contact with the lower surface 101 of the substrate 100, the contact surface B1 comes into contact with the lower surface 101 of the area of the substrate 100 where the inspection point P2 is set, Moreover, the lower surface 101 is separated from the inspection point P1. On the other hand, as shown in FIG. 6, when the inspection jig 3U is brought into contact with the upper surface 102 of the substrate 100, the contact surface B2 comes into contact with the upper surface 102 of the region of the substrate 100 where the inspection point P1 is set on the lower surface 101. And is separated from the inspection point P2 on the upper surface 102.

  According to the inspection jigs 3D and 3U, the probe Pr is brought into contact with the inspection points P1 and P2 while heating the area of the substrate including the inspection points P1 and P2 from the back side of the inspection points P1 and P2 without heating the probe Pr. Therefore, it is possible to reduce the influence of the inspection due to the heating of the probe Pr, and to inspect the substrate 100 while heating the substrate 100 and applying thermal stress. As a result, it becomes possible to detect a substrate defect that is difficult to be revealed by inspection at room temperature. Furthermore, since the substrate 100 can be heated by directly contacting the contact surfaces B1 and B2 with the substrate 100, the substrate 100 can be heated more quickly than in the case where the substrate is heated using the preheating chamber as in the background art. And the reliability of heating the substrate 100 to the set temperature Tta is improved. As a result, the inspection time can be shortened while applying the temperature stress to the inspection target substrate, and the reliability of applying the temperature stress to the substrate is improved.

  Further, the shape of the contact surface B1 shown in FIG. 5 is determined so as to contact the area X where neither the inspection points P1 nor P2 are provided. As a result, the wiring pattern and the like formed in the region X of the substrate 100 can be heated, so that the accuracy of inspection of defects in the region X is improved.

  FIG. 7 is an explanatory diagram showing another example of the inspection jig set 2 shown in FIG. The inspection jig set 2'shown in FIG. 7 is configured by combining a heating jig 3D 'and a probe jig 3U'. The heating jig 3D 'is composed of a heating block 35D. The probe jig 3U 'is composed of a probe block 30U. The probe Pr of the probe jig 3U 'is connected to the inspection processing unit 8 by the same electrode 34a and wiring 34 as the base 321U, for example. The inspection jig set 2'constructed in this way can be suitably used for inspecting a substrate having inspection points set on only one surface side.

  The board inspection apparatus 1 may be configured to include only one of the inspection units 4U and 4D. Even if only one of the inspection units 4U and 4D is used, the inspection and heating of the substrate can be performed by either one of the inspection jigs 3U and 3D, so that temperature stress is applied to the substrate to be inspected. The inspection time can be shortened while being applied.

  Further, although the contact surface B1 for heating the substrate 100 and the contact surface C1 of the support block 31D for supporting the probe Pr are separated, the probe is formed by heating the contact surface C1. The block 30D may double as a heating unit. Even with such a configuration, the substrate can be inspected and heated, so that the inspection time can be shortened while applying temperature stress to the inspection target substrate.

  Next, an example of the board inspection method executed by the inspection processing unit 8 will be described. As described above, the temperature control unit 9 controls the temperature of the metal members 351D and 351U that are in contact with the substrate 100 so that the temperature of the substrate 100 reaches the set temperature Tta. However, since the metal members 351D and 351U are lumps of metal, they have a large heat capacity. Therefore, it takes time to heat the metal members 351D and 351U at room temperature (environmental temperature) before heating to the set temperature Tta or higher.

  The substrate 100 also has a heat capacity, and the material (eg, epoxy resin) forming the substrate 100 has a lower thermal conductivity than the metal members 351D and 351U. Therefore, there is a time lag between the temperature of the metal members 351D and 351U reaching the set temperature Tta or higher until the temperature of the substrate 100 reaches the set temperature Tta. Therefore, in order to execute the inspection after the substrate 100 reaches the set temperature Tta, a sufficiently long time necessary for the substrate 100 to reach the set temperature Tta elapses after the heating by the heater 352 is started. It is conceivable to wait for and execute the inspection. However, if the inspection is started after waiting such a long time, the inspection takes a long time.

  Therefore, the inspection processing unit 8 utilizes that the resistance value R of the wiring pattern formed on the substrate 100 changes according to the temperature, and when the resistance value R reaches the target resistance value Tra corresponding to the set temperature Tta. Start the inspection. As a result, the inspection can be performed promptly when the temperature of the substrate 100 itself actually reaches the set temperature Tta, so that the inspection time can be shortened as compared with the case where the inspection is started after waiting for a sufficiently long time. You can Moreover, since the inspection is performed after it is confirmed that the temperature of the substrate 100 itself has actually reached the set temperature Tta, the accuracy of the temperature stress applied to the substrate 100 during the inspection is improved.

  It should be noted that the substrate 100 is used in advance to experimentally measure the time from the start of heating by the heater 352 until the resistance value R reaches the target resistance value Tra as the waiting time, and the waiting time is stored in the storage device. Incidentally, in the actual inspection of the substrate 100, based on the electric signal obtained from each probe contacted with each inspection point after the waiting time measured in advance after the heating by the heater 352 is started has elapsed. The inspection may be performed.

  In addition, when a plurality of substrates 100 are continuously inspected, for example, when an assembled substrate in which a plurality of substrates 100 are connected is inspected, the inspection jigs 3U and 3D have already been heated in the second and subsequent inspections. The time for the temperature of the substrate 100 to reach the set temperature Tta after the heating is started (after the inspection jigs 3U and 3D are brought into contact with the substrate 100) becomes shorter. In this way, the waiting time for the second and subsequent inspections is experimentally measured in advance as the waiting time in the same manner as described above, and the waiting time for the second and subsequent inspections is changed according to each waiting time. Good.

  The inspection processing unit 8 specifically inspects the substrate 100 as follows, for example. FIG. 8 is an explanatory diagram for explaining the board inspection method. First, from the plurality of inspection points P1 or P2 set on the substrate 100, a pair of specific inspection points Px and Py electrically connected to each other in a wiring pattern are selected in advance, and the specific inspection points Px and Py are selected in advance. It is set.

  9 and 10 are flowcharts for explaining an example of the board inspection method. The inspection processing unit 8 makes the contact surfaces B1, B2, C1, C2 of the inspection jigs 3U, 3D contact the substrate 100, and makes each probe Pr contact each inspection point P1, P2 (step S1).

  Next, the inspection processing unit 8 acquires the detected temperature t of the temperature sensor 353 as the low temperature temperature TLo (step S2). In this case, one of the temperatures detected by the temperature sensors 353 may be used, or the average value of the temperatures detected by the temperature sensors 353 may be used.

  Next, the inspection processing unit 8 acquires the resistance value R between the specific inspection points Px and Py as the low temperature resistance RLo (step S3). As for the resistance value R, a current is caused to flow between a pair of probes Pr which are in contact with the specific inspection points Px and Py, a voltage generated between the pair of probes Pr is measured, and the voltage value is divided by the current value. Required by

  In the measurement of the resistance value R, it is preferable to measure the resistance by the so-called four-terminal method in terms of accurate resistance measurement. Specifically, the probe Pr for current supply and the probe Pr for voltage measurement are brought into contact with the specific inspection point Px, and the probe Pr for current supply and the probe Pr for voltage measurement are also brought into contact with the specific inspection point Py. Then, a current is caused to flow between the pair of current supply probes Pr, the voltage generated between the pair of voltage measurement probes Pr is measured, and the resistance value R is obtained by dividing the voltage value by the current value. It is preferable.

  Next, the inspection processing unit 8 outputs a control signal to the temperature control unit 9 to cause the heater 352 to generate heat and heat the metal members 351D and 351U to heat the substrate 100 (step S4).

  Next, the inspection processing unit 8 acquires the detected temperature t of the temperature sensor 353 as the high temperature temperature THi (step S5) in the same manner as in steps S2 and S3, and determines the resistance value R between the specific inspection points Px and Py. It is acquired as the high temperature resistance RHi (step S6).

Next, the inspection processing unit 8 calculates the temperature coefficient Tc based on the low temperature temperature TLo, the low temperature resistance RLo, the high temperature temperature THi, and the high temperature resistance RHi (step S7). Specifically, the inspection processing unit 8 can calculate the temperature coefficient Tc based on the following equation (1).
Temperature coefficient Tc = {(RHi-RLo) / RLo} / (THi-TLo) (1)

Next, the inspection processing unit 8 calculates the target resistance value Rta when the substrate 100 reaches the set temperature Tta, based on the low temperature temperature TLo, the low temperature resistance RLo, and the temperature coefficient Tc (step S8). Specifically, the inspection processing unit 8 can calculate the target resistance value Rta based on the following equation (2).
Target resistance value Rta = RLo [{(Tta-TLo) / Tc} +1] (2)

  Next, the inspection processing unit 8 measures the resistance value R between the specific inspection points Px and Py by the same method as described above (step S11: resistance measurement step).

  Next, the inspection processing unit 8 compares the resistance value R measured in step S11 with the resistance determination value Rj (step S12). The resistance determination value Rj is a resistance value for determining the quality of the wiring pattern between the specific inspection points Px and Py, and is assumed to be, for example, a broken wire or a thinned wire and an increased resistance value. A resistance value between the specific inspection points Px and Py is set, and a value sufficiently larger than the target resistance value Rta is preset as the resistance determination value Rj.

  If the resistance value R exceeds the resistance determination value Rj (YES in step S12), the inspection processing unit 8 determines that the wiring pattern between the specific inspection points Px and Py is defective, that is, the substrate 100 is defective. Then (step S13), the process ends. As a result, when the wiring pattern between the specific inspection points Px and Py has a defect value equal to or higher than the target resistance value Rta due to a defect, the temperature of the substrate 100 may not exceed the set temperature Tta. Instead, the risk that the quality determination in step S15 is executed is reduced.

  Next, the inspection processing unit 8 compares the resistance value R measured in step S11 with the target resistance value Rta (step S14). If the resistance value R does not reach the target resistance value Rta (NO in step S14), steps S11 to S14 are repeated again, and the process waits until the resistance value R becomes equal to or higher than the target resistance value Rta.

  On the other hand, if the resistance value R is equal to or higher than the target resistance value Rta (YES in step S14: inspection start determination step), it means that the temperature of the substrate 100 is equal to or higher than the set temperature Tta, and therefore an electric signal obtained from each probe. The inspection of the substrate 100 is started by determining the quality of the substrate 100 based on (step S15).

  Even if steps S12 and S13 are not executed, if a defect such as a disconnection occurs in the wiring between the specific inspection points Px and Py, the defect should be detected in step S15. The configuration may be such that S13 is not executed.

  Note that steps S1 to S8 are not limited to the example executed every time the board inspection is performed. For example, the target resistance value Rta may be obtained by experimentally executing steps S1 to S8 using the substrate 100 in advance. Then, the target resistance value Rta thus obtained is stored in a storage device, and when actually inspecting the substrate 100, a step based on the target resistance value Rta stored in the storage unit is used. It may be configured to execute S1, S4, S11 to S15.

1 Substrate inspection device 2, 2'inspection jig set 3D inspection jig 3D 'heating jig 3U inspection jig (inspection jig for second surface)
3U 'Probe jig 4, 4D Inspection part 6 Substrate fixing device 8 Inspection processing part 9 Temperature control part 30D, 30U Probe block 31D, 31U Support block 31Da, 31Db, 31Ua, 31Ub Support plate 34 Wiring 34a Electrode 35D Heating block (heating) Part)
35U heating block (second side heating part)
36 Heat-insulating member 37 Support 100 Base plate 101 Lower surface 102 Upper surface 321D, 321U Bases 351D, 351U Metal member 352 Heater 353 Temperature sensor A Substrate B1 Contact surface B2 Contact surface (second surface contact surface)
C1, C2 contact surface H through hole P1, P2 inspection point Pr probe X region

Claims (7)

An inspection jig for inspecting a board in which inspection points of an inspection target are set,
A probe for contacting the inspection point,
A heating unit having a contact surface for contacting the substrate, and heating the substrate by heating the contact surface ;
A support member for supporting the probe,
A base that integrally supports the support member and the heating unit,
An inspection jig in which the heating unit and the base are connected via a heat insulating member having heat insulating properties . An inspection jig for inspecting a board in which inspection points of an inspection target are set,
A probe for contacting the inspection point,
A heating unit having a contact surface for contacting the substrate, and heating the substrate by heating the contact surface;
The substrate has a first surface and a second surface, the inspection point is set on the first surface and the second surface,
The probe is made flush with the contact surface, and protrudes from a first contact surface provided with a space between the contact surface and contacts an inspection point of the first surface,
The contact surface is in contact with the first surface of the area where the inspection points are set on the second surface of the substrate, and the surface direction of the contact surface from all the inspection points of the first surface. An inspection jig that has a shape that is separated from each other. The heating unit is
A metal member having the contact surface and having a thickness in a direction orthogonal to the contact surface,
The inspection jig according to claim 1, further comprising a heater extending substantially parallel to the contact surface within the thickness of the metal member. An inspection jig set comprising the inspection jig according to claim 2 and an inspection jig for a second surface for inspecting the substrate,
The inspection jig for the second surface is
A second surface probe for contacting the inspection point on the second surface,
Having a second surface contact surface for contacting the second surface of the substrate, comprising a second surface heating unit for heating the substrate by heating the second surface contact surface,
The probe for the second surface is flush with the contact surface for the second surface, and protrudes from the second contact surface in which a space is provided between the contact surface for the second surface and the second surface. Touch the inspection point,
The contact surface for the second surface is in contact with the second surface of the area in which the inspection point is set on the first surface of the substrate, and is the first from all the inspection points of the second surface . An inspection jig set having a shape in which the contact surface for two surfaces is separated in the surface direction . An inspection jig according to any one of claims 1 to 5 ,
A substrate inspection apparatus, comprising: an inspection processing unit configured to bring the probe into contact with the inspection point, bring the contact surface into contact with the substrate, and inspect the substrate based on an electric signal obtained from the probe. An inspection jig set according to claim 4 ,
The probe is brought into contact with an inspection point on the first surface, the contact surface is brought into contact with the first surface of a region of the substrate where the inspection point is set on the second surface, and the second surface The probe for contacting the inspection point of the second surface, the contact surface for the second surface, in the substrate, contact the second surface of the region in which the inspection point is set on the first surface, A substrate inspection apparatus comprising: an inspection processing unit that inspects the substrate based on an electric signal obtained from the probe and the second surface probe. A wiring pattern is formed on the substrate,
As the inspection point, a pair of specific inspection points connected to each other in the wiring pattern is preset.
The inspection processing unit,
A resistance measuring step of measuring a resistance value between the pair of specific inspection points based on an electric signal obtained from a probe in contact with each specific inspection point,
The board inspection device according to claim 5 or 6 , which executes an inspection start determination step of starting the inspection when the resistance value measured in the resistance measurement step becomes equal to or higher than a predetermined target resistance value.

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