JPH08338859A - Reliability evaluation system for printed board - Google Patents
Reliability evaluation system for printed boardInfo
- Publication number
- JPH08338859A JPH08338859A JP14708695A JP14708695A JPH08338859A JP H08338859 A JPH08338859 A JP H08338859A JP 14708695 A JP14708695 A JP 14708695A JP 14708695 A JP14708695 A JP 14708695A JP H08338859 A JPH08338859 A JP H08338859A
- Authority
- JP
- Japan
- Prior art keywords
- transient
- conditions
- printed circuit
- circuit board
- varying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000011156 evaluation Methods 0.000 title claims abstract description 13
- 230000001052 transient effect Effects 0.000 claims abstract description 18
- 230000007613 environmental effect Effects 0.000 claims abstract description 13
- 239000002131 composite material Substances 0.000 claims 1
- 238000012544 monitoring process Methods 0.000 abstract description 5
- 238000011084 recovery Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 3
- 238000012360 testing method Methods 0.000 abstract description 3
- 230000010355 oscillation Effects 0.000 abstract 2
- 230000002159 abnormal effect Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000005856 abnormality Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000012806 monitoring device Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
Landscapes
- Structure Of Printed Boards (AREA)
- Management, Administration, Business Operations System, And Electronic Commerce (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明はプリント基板製造過程に
おいてプリント基板の評価を実施する装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for evaluating a printed circuit board in the printed circuit board manufacturing process.
【0002】[0002]
【従来の技術】プリント基板の信頼性評価装置は、環境
温度,供給電源電圧等を急変させプリント基板の動作を
監視しながら電気回路の動作タイミング余裕を確認する
ことによりプリント基板の評価を実施している。2. Description of the Related Art A printed circuit board reliability evaluation apparatus evaluates a printed circuit board by checking the operation timing margin of an electric circuit while monitoring the operation of the printed circuit board by suddenly changing the environmental temperature, the power supply voltage and the like. ing.
【0003】しかし、環境温度,供給電源電圧等の変化
が段階的であり実際に装置が稼働する環境のように、滑
らかに変化する過渡的な変化が得られないため、実環境
でしか発生しない不良を未然に摘出するには不十分であ
り稼働環境でのプリント基板の信頼性評価が十分にでき
ない。However, changes in environmental temperature, power supply voltage, etc. are gradual, and transitional changes that smoothly change cannot be obtained, such as in an environment in which the device actually operates, so they occur only in the actual environment. It is insufficient to identify defects in advance, and the reliability of printed circuit boards in the operating environment cannot be fully evaluated.
【0004】[0004]
【発明が解決しようとする課題】従来のプリント基板信
頼性評価装置では、環境条件を段階的に変化させるた
め、滑らかに変化する過渡状態でのプリント基板の評価
ができない。したがって実環境状況におけるプリント基
板の信頼性評価が製造過程で実施しにくい。In the conventional printed circuit board reliability evaluation device, the environmental conditions are changed stepwise, so that the printed circuit board cannot be evaluated in a transient state that changes smoothly. Therefore, it is difficult to evaluate the reliability of the printed circuit board in the actual environment in the manufacturing process.
【0005】本発明の目的は、環境条件をゆっくり滑ら
かに変化させ実稼働状態に近い条件の過渡状態でプリン
ト基板の信頼性評価を実施し、プリント基板を使用する
装置を稼働した時に不良を発生させないことにある。An object of the present invention is to perform a reliability evaluation of a printed circuit board under a transient condition of a condition close to an actual operating condition by changing environmental conditions slowly and smoothly, and generate a defect when an apparatus using the printed circuit board is operated. Not to let them do it.
【0006】[0006]
【課題を解決するための手段】上記目的を達成するため
に、本発明はプリント基板を装置稼働状態にし、動作を
監視しながら環境温度,供給電源電圧,振動周波数,停
電,復電を微小な変化幅で変化させることのできる制御
装置で滑らかな変化過程を作り出し,なおかつ任意に組
合せを行い、プリント基板の動作する実環境をシミュレ
ートすることにより、実稼働と同一条件でプリント基板
の信頼性評価を実施する。In order to achieve the above object, the present invention puts a printed circuit board into an operating state of an apparatus, and monitors the operation to minimize environmental temperature, power supply voltage, vibration frequency, power failure, and power recovery. Reliability of the printed circuit board under the same conditions as actual operation by simulating the actual environment in which the printed circuit board operates by creating a smooth change process with a control device that can change the change width, and by combining them arbitrarily Conduct an evaluation.
【0007】[0007]
【作用】本発明は、プリント基板を装置稼働状態にし、
動作を監視しながら環境温度,供給電源電圧,振動周波
数,停電,復電を任意組合せで、任意の過渡条件を作
り、プリント基板の動作する実環境をシミュレートする
ことにより、実稼働と同一条件でプリント基板の信頼性
評価を実施する。According to the present invention, the printed circuit board is brought into the operating state of the apparatus,
The same conditions as the actual operation can be obtained by simulating the actual environment in which the printed circuit board operates by creating an arbitrary transient condition by arbitrarily combining environmental temperature, power supply voltage, vibration frequency, power failure, and power recovery while monitoring the operation. Conduct the reliability evaluation of the printed circuit board.
【0008】[0008]
【実施例】以下、本発明の実施例を図1により説明す
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG.
【0009】プリント基板評価装置として、基板の動作
異常監視を行う監視装置、また微小な変化幅で連続的な
制御ができる過渡的な変化を発生させる装置、およびそ
れらを制御する制御装置からなる。The printed circuit board evaluation device includes a monitoring device for monitoring the operation abnormality of the substrate, a device for generating a transient change capable of continuous control with a minute change width, and a control device for controlling them.
【0010】以上のような装置において、評価を実施す
るプリント基板6を装置組込状態と同一の条件とし監視
装置1で動作異常の監視ができる状態とする。この状態
で環境温度,供給電源電圧,振動周波数等を段階的では
なく,過渡的温度変化装置2,過渡的電源電圧変化装置
3,過渡的振動周波数発生装置5を使用し、このような
要素を過渡条件制御装置7で制御することにより微小な
変化幅で変化させこの処理を連続して行うことにより環
境要素をなめらかに変化させる。この処理に加え停電,
復電発生装置4を使用することにより実稼働状態と非常
に近い環境をつくることができる。この環境でプリント
基板を動作させることにより、実動作と同じ環境で評価
試験ができるようになる。In the above apparatus, the printed circuit board 6 to be evaluated is set to the same condition as the built-in state of the apparatus so that the monitoring apparatus 1 can monitor the operation abnormality. In this state, the environmental temperature, the power supply voltage, the vibration frequency, etc. are not changed stepwise, but the transient temperature changing device 2, the transient power supply voltage changing device 3, and the transient vibration frequency generating device 5 are used. By controlling by the transient condition control device 7, the change is made with a minute change width, and by continuously performing this processing, the environmental element is changed smoothly. In addition to this process, a power failure,
By using the power recovery generator 4, it is possible to create an environment very close to the actual operating state. By operating the printed circuit board in this environment, the evaluation test can be performed in the same environment as the actual operation.
【0011】また、過渡条件制御装置7を使用し、変化
時間の任意設定、および変化要素の任意組合せを実施す
ることにより、稼働状態より厳しい状態をシミュレート
することが可能となり、より深い信頼性評価で実施でき
る。Further, by using the transient condition control device 7 and performing arbitrary setting of change time and arbitrary combination of changing elements, it becomes possible to simulate a severer condition than the operating condition, and to realize deeper reliability. Can be implemented by evaluation.
【0012】[0012]
【発明の効果】本発明によれば、製造過程で実施する評
価試験において、稼働状態と同じ環境をシミュレートで
きプリント基板の高度スクリーニングにより信頼性が向
上する。According to the present invention, in the evaluation test conducted in the manufacturing process, the same environment as the operating state can be simulated, and the reliability is improved by the advanced screening of the printed circuit board.
【図1】本発明を示すブロック図。FIG. 1 is a block diagram showing the present invention.
1…監視装置、2…過渡的温度変化装置、3…過渡的電
源電圧変化装置、4…停電,復電発生装置、5…過渡的
振動周波数発生装置、6…プリント基板、7…過渡条件
制御装置。DESCRIPTION OF SYMBOLS 1 ... Monitoring device, 2 ... Transient temperature change device, 3 ... Transient power supply voltage change device, 4 ... Power failure, power recovery generator, 5 ... Transient vibration frequency generator, 6 ... Printed circuit board, 7 ... Transient condition control apparatus.
Claims (1)
るため、前記プリント基板を装置に組み込む時と同じ状
態にした組合せ複合動作状態で、環境要素を滑らかに変
化させる過渡的な環境要素の任意組合せを意図的に発生
させることにより、実稼働状況をシミュレートすること
を特徴とするプリント基板の信頼性評価装置。1. Since the evaluation of the printed circuit board alone is insufficient, a transient environmental element that smoothly changes the environmental element in the combined and composite operation state in which the printed circuit board is in the same state as when it is installed in the apparatus. A printed circuit board reliability evaluation device characterized by simulating an actual operating condition by intentionally generating an arbitrary combination.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14708695A JPH08338859A (en) | 1995-06-14 | 1995-06-14 | Reliability evaluation system for printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14708695A JPH08338859A (en) | 1995-06-14 | 1995-06-14 | Reliability evaluation system for printed board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH08338859A true JPH08338859A (en) | 1996-12-24 |
Family
ID=15422157
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14708695A Pending JPH08338859A (en) | 1995-06-14 | 1995-06-14 | Reliability evaluation system for printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH08338859A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004038435A1 (en) * | 2002-10-22 | 2004-05-06 | Sony Chemicals Corp. | Wiring board inspection device, and wiring board inspection method |
KR100486023B1 (en) * | 1999-09-16 | 2005-05-03 | 현대중공업 주식회사 | Apparatus for self-diagnosis of printed circuit board |
-
1995
- 1995-06-14 JP JP14708695A patent/JPH08338859A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100486023B1 (en) * | 1999-09-16 | 2005-05-03 | 현대중공업 주식회사 | Apparatus for self-diagnosis of printed circuit board |
WO2004038435A1 (en) * | 2002-10-22 | 2004-05-06 | Sony Chemicals Corp. | Wiring board inspection device, and wiring board inspection method |
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