TW200407441A - Copper alloy conductor and the manufacturing method - Google Patents

Abstract

A copper alloy conductor having both good tensile strength and conductivity and the manufacturing method is provided. The copper alloy conductor is consisted of 0.05 to 0.80 weight %, inevitable impurities, and copper. The tin exists with a simple substance of tin and tin-oxide, and the tin content of tin-oxide/ simple substance of tin is less than 0.3. The effective tin content contributing good tensile strength is increased with reducing the percent of tin-oxide. And the decrease of conductivity is restrained with reducing the total content of tin for getting the fixedness tensile strength. Therefore the conductor having both good tensile strength and conductivity can be realized.

Description

200407441 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a strength and conductivity and a manufacturing method thereof. Good-quality copper alloy conductors [Prior art] As a related art of a conventional copper alloy conductor, Japanese Unexamined Patent Publication No. 46-32333 discloses soil === wire. Toughened copper is usually a kind of smelted copper containing no less than 2 kg of copper. There is no less than 250 copper, and it contains impurities such as Ag, Ni, Sb, and As = = · 02⑷ milk. e, Pb, Bi, Si, S, etc. In addition, there is also a technique described in the Japanese Patent Publication No. 1 by using the technique of disconnection when copper 6: Khan-Special open Sho W-1 562 line. ° The elements that are fixed by the temples are used to suppress the tensile conductance: 疋, it is difficult to obtain the strength and electrical conductivity by the above-mentioned conventional techniques. When tin is added to toughened copper, etc., the oxygen content of the copper smelting is large, so Containing tin strength. However, in the case of the increase in dynamic strength and the increase in the amount of tin oxide, the tin is noisy. Miao = In order to serve the required strength, it is necessary to make a lightning operation. The electrical conductivity has a problem of decreasing the electrical conductivity and reducing the electrical lice characteristics of the V body. [Summary of the Invention] The main purpose of the electrical conductivity is to provide a copper alloy conductor that has both good strength and high electrical conductivity, and a method for manufacturing the same. The present invention achieves the above-mentioned object by limiting the tin concentration, and particularly the ratio of tin oxide and tin element b 彳 1, which is present in copper gold. Page 5! F2134pif.ptd 200407441 V. Description of the invention (2) That is, the copper alloy conductor of the present invention is characterized by containing ditin; the remaining part is composed of unavoidable impurities and copper: 里 / 锡 早 贝 （ The weight of Sn / Sn) in SnO does not exceed 0.3. In addition, when the tin component weight in the tin oxide (Sn in Sn0) and the gold conductor were dissolved in 60% nitric acid, the tin (Sn) contained in the residue was: (SnO). The tin in the residue next to the small ridges can be used as a conductor that can coexist with strength and conductivity by specifying the tin concentration and the tin component 2:? Ratio in tin oxide. In order to make the aforementioned and other aspects of the present invention easy to understand, the following is a preferred embodiment. The configuration of i: 82 :: can be more clearly explained as follows. j in conjunction with the attached drawings for detailed description [Embodiment]: The present invention will be described in more detail. Although the tin concentration is less than 0.5% by weight, it is private. In the conductor of the present invention, it is better to obtain sufficient tensile strength, more preferably 600N / Y2 or more, and the best ^ 7 elongation strength is 55 ON / _2 and vice versa, when the tin concentration is greater than 〇.: 8 Good weight is said, ^ conductivity. In the conductor of the present invention, h / ° 柃, it is difficult to obtain a predetermined more preferably 7 η 〇 / w 4dt ... and a car with a good conductivity of 5 5 0 / 〇 or more, and a horse of 70% or more, Particularly good is 80%. It is expressed in accordance with the standard specified by Erxiong International Soft Steel Standard = conductivity is expressed in UIACS at 20C. The percentage of the conductivity of the sentence 12134pif.ptd $ 6 200407441 V. Description of the invention (3) The insoluble chemical composition ′ may also contain Fe, Pb R. Miscellaneous ^. Inevitable impurities include Ag, Ni, Sb, As,

Fe Pb, Bl, P, Si, S, Se, Te, etc. In the following, the weight ratio of the tin component and the tin element in the tin oxide is 0.3 to 0.30: When the ratio is over 0: 3: tin, in order to obtain sufficient tensile strength, tin is liable to cause electrical conduction. The rate of decline. The total tin weight of Sn * Sn in Sn was measured by light emission spectrometry (Emission lpe3ct = otometric Analysis). w ^ 2 == The sample of copper alloy conductor was dissolved in 60% nitric acid and Sn0 was removed, W was separated, and the clarified part was subjected to atomic absorption analysis (Atimic

Absorplon Spectrometry), so as to dissolve the obtained. By subtracting the weight of the elemental Sn from the total tin weight, the weight of tin contained in SnO can be obtained. This Sn0 is mainly produced by the combination with oxygen contained in molten copper during the solidification process during casting. It is preferable that the oxygen concentration in the copper alloy conductor forming the present invention does not exceed 0.08% by weight. When the oxygen concentration exceeds 0.08% by weight, the amount of Sn0 increases, which may impede the drawability of the obtained conductor. A better oxygen concentration is less than or equal to 04% by weight. The measurement of the oxygen concentration can be performed using, for example, infrared absorption & analysis (Infrared Spectrum Absorbance).

In addition, it is preferable that the average particle diameter of tin oxide contained in the copper alloy conductor forming the present invention is not more than 10 // m. When the average particle diameter exceeds the length of // 0 m, the workability when drawing the obtained conductor to a small diameter may be hindered. Scanning electron microscopes: SEM (Scanning Electron Microscope) and energy dispersive X'top can be used for the average particle diameter of tin oxide. 34pif.ptd Page 7 200407441

Line analysis device: EDX (Energy-dispersive

Spectroscopy). A better tin oxide has an average particle diameter of 5 // m or less. The above-mentioned copper alloy conductor is suitably manufactured by the following method. That is, the method for manufacturing a copper alloy conductor of the present invention includes a process of melting and casting a raw material composed of 0.001 to 0.8 wt% of tin, and the remaining portion consisting of unavoidable impurities and copper, and the obtained ingot. The rolling process is characterized in that, during the solidification of the molten raw materials in the aforementioned casting process, the cooling rate is set to not less than 3 ° C / second. A copper alloy conductor having a tin component weight / tin element weight of not more than 0.3 can be obtained by using the above-mentioned raw material of tin content and making the cooling rate during solidification of the dissolved raw material not less than 31 / second. When the rapid cooling rate is less than 3 C / s 牯, the amount of tin oxide is increased, resulting in a decrease in conductivity. The upper limit of the cooling rate is usually about 50 t / sec. In general, copper alloy conductors can be obtained by the process of melting-casting ~ hot, and then wire drawing and processing into the diameter in the later process. Here, it is preferable that the solidified ingot is hot-rolled to a cold temperature of 2000 ° C., or the cooling rate before cold rolling after casting is not less than 丨 0 ^. By controlling the cooling rate in this way, tin oxide can be kept in an appropriate range, and high strength and electrical conductivity can be maintained. When the A to I speed is less than lire / second, the diffusion of tin in copper makes the § & cooling of tin oxide large, and leads to a decrease in conductivity. : The copper alloy conductor of the present invention has sufficient strength to be used as a thin-diameter conductor. For example, the line can be easily obtained.

r Ai34pif .ptd Page 8 200407441 V. Description of the invention (5) A conductor that passes 1, 2 mm ′ or even does not exceed 0.5 min. Embodiments of the present invention will be described below a. (Experimental example 1) 311% by weight of 311 was prepared, and the remainder was

A copper alloy composed of Cu and unavoidable impurities, and a copper alloy conductor is produced by a process of "melting ~ scale report-hot stamping-cold rolling". During casting J = Belt Caster. According to the operation results, the cooling rate during solidification was 5 · 7 7 ° C / sec, and the cooling rate after cooling to 2 0 c (the cooling rate during processing) was 21. 〇 /, in the process of the process, after the end of rolling to remove the sample and facilitate luminescence spectroscopic analysis (dry analysis) to determine the total amount of Sn in the alloy. Then, the sample was dissolved in 60% nitric acid, insoluble matter was precipitated, and the clarified part and atomic absorption spectrometry were performed to obtain the dissolved Sn single mass. From 2 tfnt mass' is the amount in-. As a result, "Sn / Sn" in SN0 was stained. In addition, when the cross-section of the sample was observed with a scanning electron microscope (SEM) and the average particle diameter was determined, it was 4 #claw. When another sample was taken and the oxygen content was measured by infrared absorption analysis, it was 0.023 0% by weight. The processing degree of J 疋 Mi 3 Lila wire and mouth bundle is 75% (section reduction rate), and the final wire diameter is 0.4 mm. In addition, when the comprehensive judgment of the f-th row of this experimental example is taken as the workability, and the processing difficulty is further improved to a 5 Λ score, the experimental example 1 receives an evaluation of 5. When using this copper alloy to guide bass this h αf 1 shell J. The tensile strength and electrical conductivity of the Bangladeshi conductor are determined by the tensile strength. Page 9 4Pif.ptd 200407441 V. Description of the invention (6) The degree is 552N / πι2, and the conductivity is 88.3% IACS. (Experimental Example 2) A copper alloy conductor was produced by the same process as in Experimental Example 1 except that a copper alloy having a Sn content of 0.624% by weight was used. The cooling rate during solidification was 3 · 2 ° C / s, and the cooling rate during processing was 2 3 ° C / s. After the wire drawing was finished, the degree of processing was 99.75% (reduction in section area), and a final wire diameter of 0.4 mm was obtained. When the sample was taken and the Sn / Sn in SnO was measured after rolling in progress as in Experimental Example 1, it was 0.28, and the average particle diameter of SnO was 12 // m. The oxygen content was 0.0298% by weight. The obtained copper alloy conductor had a tensile strength of 720 N / mm2 and a conductivity of 62 · 5% I ACS. The evaluation of the processability was 2 because the grain size of SnO was increased. Moreover, although the experimental example 2 contains more Sn than the experimental examples 5 and 6, the tensile strength will not be a high value. This is also because the particle diameter of SnO becomes larger. (Experimental example 3) A copper alloy conductor was produced by the same process as in Experimental example 1 except that a copper alloy having a Sn content of 187.7% by weight was used. The cooling rate during solidification was 3 · 9 ° C / s, and the cooling rate during processing was 18 ° c / s. The processing degree after the end of the wire drawing was 99.75% (section reduction rate), and a final wire diameter of 0.4 mm was obtained. When the sample was taken and the Sn / Sn in SnO was measured after rolling in the same manner as in Experimental Example 1, it was 0.81 and the average particle diameter of SnO was 6 // m. The oxygen content was 0.0820% by weight. The tensile strength of the obtained copper alloy conductor was 5 9 5 N / mm2, and the electrical conductivity was

:: HB4pif.ptd Page 10 200407441 V. Description of the invention (7) is 8 2 · 6% I A C S. Evaluation of workability was 4. Experimental Example 3 contains more Sn than Experimental Example 4, but since the oxygen 3 is more than that of the Examination Example 4, the amount of g n 0 is increased, and the value of tensile strength is also smaller than that of Example 4. (Experimental Example 4) A copper alloy conductor was produced in the same process as in Experimental Example 1 except that a copper alloy having a Sn content of 0.177% by weight was used. The cooling rate during solidification is 5 · 4 7 ° C / s, and the cooling rate during processing is 丨 8. 〇 / s. The processing degree after the end of the wire drawing was 99.75% (section reduction rate), and a final wire diameter of 0.4 mm was obtained. As in Experimental Example 1, after rolling in progress, a sample was taken and Sn / Sn in SnO was measured to be 0.07, and the average particle diameter of Sn0 was 6 // m. The oxygen content was 0.305 wt%. The tensile strength of the obtained copper alloy conductor was 61.0 N / mm2, and the electrical conductivity was 82.8% I ACS. Forms a very balanced material. In addition, the processability was very good, and 5 evaluations were obtained. (Test Example 5) A copper alloy conductor was produced by the same process as in Test Example 1 except that a copper alloy having a Sn content of 0.315% by weight was used. The cooling rate during solidification was 5.47 ° c / s, and the cooling rate during processing was 8. 〇 / s. The degree of processing after the wire drawing was 99.75% (reduction in section area), and a final wire diameter of 0.4 mm was obtained. · As in Experimental Example 1, after rolling in progress, a sample was taken and Sn / Sn in SnO was measured, and the average particle diameter of Sn0 was 5 // m. The oxygen content was 0.401% by weight. The tensile strength of the obtained copper alloy conductor was 700 N / mm2, and the electrical conductivity was

rl2134pif.ptd page 11 200407441 V. Description of the invention (8) is 7 6 · 8% I A C S. Evaluation of workability was 3. This is due to the cooling rate during processing. Moreover, in the conventional test example 5, although the content of s η is slightly smaller than that in the next test example 6, the conductivity is not larger than that in the sixth example. The reason Λ is because the cooling rate during processing does not exceed 10 ° C / sec, and Sn diffuses into Cu ^ Sn0 in Cu, thereby reducing the conductivity. (Experimental Example 6) A copper alloy conductor was produced by the same process as in Experimental Example 1 except that a copper alloy having a Sn content of 0.338% by weight was used. The cooling rate during solidification was 5 · 4 7 C / sec. 'The cooling rate during processing was 2 3 / sec. After the wire drawing was finished, the processing degree was 99.75% (section reduction rate), and a final wire diameter of 0.4 mm was obtained. As in Experimental Example 1, after rolling in progress, a sample was taken and Sn / Sη in Sη0 was measured to be 0.07, and the average particle diameter of Sη0 was 4 // m. The oxygen content was 0.0215% by weight. The obtained copper alloy conductor had a tensile strength of 71 ON / mm2 and a conductivity of 78.0% I ACS. Evaluation of workability was 4. (Comparative Example 1) A copper alloy conductor was produced by the same process as in Experimental Example 1 except that a copper alloy having a Sn content of 0.30% by weight was used. The cooling rate during solidification is 5.4 7 ° C / s, and the cooling rate during processing is 18 ° C / s. After the wire drawing was finished, the degree of processing was 99.75% (section reduction rate), and a final wire diameter of 0.4 mm was obtained. As in Experimental Example 1, after rolling in progress, a sample was taken and Sn / Sn in SnO was measured, and it was 0.30, and the average particle diameter of SnO was 3 // m. The oxygen content was 0.0240% by weight.

_34pif.ptd Page 12 200407441 V. Description of the invention (9) The copper b " gold conductor paid has a tensile strength of 535N / mm2, and the conductivity is poor. ACS uses raw materials close to pure steel, and the conductivity table is conductive. Larger values, but 疋 tensile strength does not get sufficient strength. Plus question, rating is 5. There are also (Comparative Example p) a copper alloy conductor was produced from the same system and system a ^ ',, 0 and 丨 J as those of Experimental Example 1 except that the copper content of the Sn content was 0.5% by weight. The cooling rate at the time is 1 C / s. The cooling rate during processing is 23 seconds, and the degree of processing after the wire drawing is 9 9.75% (section reduction rate), resulting in a final wire diameter of 4 mm. Similarly to Test Example 1, after rolling in progress, when a sample was taken and Sn / Sn in Sn0 was measured, it was 0.37, and the average particle diameter of Sn0 was large, reaching 20 // m. Furthermore, oxygen The content is 0085% by weight. 的 The tensile strength of the copper alloy conductor paid is ^ ⑽ "^ 2, but the conductivity is low, which is 52., 5% IACS. This raw material has a high Sn content, so The tensile strength is high, but the conductivity is slightly different. Also, the processability was evaluated as 1. due to the increased disconnection rate in the later process. It is considered that the diameter of the SnO particles became larger. As shown in the comparative example, any of the experimental examples has both high tensile strength and electrical conductivity. Moreover, as shown in the comparative example, when the raw material itself When the Sn content is not in a preferable range, the tensile strength and electrical conductivity cannot coexist regardless of processing conditions. Even if Sn / Sn in Sn0 exceeds 3 · 3 ', the tensile strength and electrical conductivity cannot coexist. As described above, forming the copper alloy conductor of the present invention reduces the proportion of tin oxide and increases the effective tin amount that contributes to the increase in tensile strength.

200407441 > ^ n V. Description of the invention (10) The reduction of the conductivity is suppressed by reducing the total amount of tin required to obtain a predetermined tensile strength. Therefore, it is possible to realize a conductor in which high strength and electrical conductivity coexist. Moreover, the manufacturing method of forming the copper alloy conductor of the present invention is a manufacturing method suitable for manufacturing the copper alloy conductor of the present invention. Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications and retouching without departing from the spirit and scope of the present invention. The scope of protection shall be determined by the scope of the attached patent application.

-T; 2134pif.ptd Page 14 200407441 Simple illustration of the diagram None 111111 Page 15

Claims (1)

200407441 VI. The amount of tin in the patent application scope is%, the remaining L = body ', which is characterized by the inevitable that it contains 0.05 ~ 0.80 weight of tin element and tin oxide, and the weight of the substance and steel / tin element does not exceed "exist 'The weight of the tin component in the emulsified tin lies in the oxygen guide of the copper alloy as described in item 2: oxygen specific range / characteristics, which is characterized by no more than 0.08% by weight. Patent / Copper alloy guide 4 described in item 1 or item 2; • The average particle diameter of the emulsified tin does not exceed 10 // m .: The manufacturing method of the ethnographic copper alloy conductor, which will contain 0. 05 ~ 〇 · A process of melting and casting 80% by weight of tin, the rest of the material consisting of miscellaneous materials and copper; and a process of rolling the obtained ingot; its special feature is that in the aforementioned casting process The solidification of the melted raw material has a cooling rate of not less than 3 / sec. Method 5 · The manufacturer of the copper alloy conductor described in item 4 of the scope of patent application is characterized by making the solidified ingot to 200 ° C. The cooling rate at this time is not less than 10 ° c / sec. J -i: 2134pif .ptd Page 16