TW200403796A - Fire retardant wafer carrier - Google Patents
Fire retardant wafer carrier Download PDFInfo
- Publication number
- TW200403796A TW200403796A TW92118305A TW92118305A TW200403796A TW 200403796 A TW200403796 A TW 200403796A TW 92118305 A TW92118305 A TW 92118305A TW 92118305 A TW92118305 A TW 92118305A TW 200403796 A TW200403796 A TW 200403796A
- Authority
- TW
- Taiwan
- Prior art keywords
- carrier
- patent application
- scope
- fire
- item
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US39421902P | 2002-07-05 | 2002-07-05 | |
US10/190,355 US20040004079A1 (en) | 2002-07-05 | 2002-07-05 | Fire retardant foup wafer carrier |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200403796A true TW200403796A (en) | 2004-03-01 |
Family
ID=30117808
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW92118305A TW200403796A (en) | 2002-07-05 | 2003-07-04 | Fire retardant wafer carrier |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1539614A1 (fr) |
JP (1) | JP2006505921A (fr) |
CN (1) | CN1681723A (fr) |
AU (1) | AU2003249731A1 (fr) |
TW (1) | TW200403796A (fr) |
WO (1) | WO2004005163A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI835102B (zh) * | 2021-04-01 | 2024-03-11 | 德商世創電子材料公司 | 晶圓輸送設備及輸送半導體晶圓的方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011100983A (ja) | 2009-10-07 | 2011-05-19 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
EP3929969B1 (fr) * | 2020-06-22 | 2023-12-06 | Siltronic AG | Procédé de fabrication d'une cuve de traitement pour pièces à semiconducteur et cuve de traitement |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4929497A (en) * | 1989-03-27 | 1990-05-29 | Albany International Corp. | Flame retardant rolling door |
US5928971A (en) * | 1996-02-01 | 1999-07-27 | Southern Mills, Inc. | Firefighter's garment |
JP3476052B2 (ja) * | 1997-09-01 | 2003-12-10 | 信越ポリマー株式会社 | 輸送容器 |
-
2003
- 2003-07-04 TW TW92118305A patent/TW200403796A/zh unknown
- 2003-07-07 JP JP2004519941A patent/JP2006505921A/ja active Pending
- 2003-07-07 AU AU2003249731A patent/AU2003249731A1/en not_active Abandoned
- 2003-07-07 EP EP03763268A patent/EP1539614A1/fr not_active Withdrawn
- 2003-07-07 CN CN 03821230 patent/CN1681723A/zh active Pending
- 2003-07-07 WO PCT/US2003/021161 patent/WO2004005163A1/fr active Application Filing
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI835102B (zh) * | 2021-04-01 | 2024-03-11 | 德商世創電子材料公司 | 晶圓輸送設備及輸送半導體晶圓的方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2006505921A (ja) | 2006-02-16 |
WO2004005163A1 (fr) | 2004-01-15 |
CN1681723A (zh) | 2005-10-12 |
EP1539614A1 (fr) | 2005-06-15 |
AU2003249731A1 (en) | 2004-01-23 |
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