JP2006505921A - 防火ウェハーキャリア - Google Patents

防火ウェハーキャリア Download PDF

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Publication number
JP2006505921A
JP2006505921A JP2004519941A JP2004519941A JP2006505921A JP 2006505921 A JP2006505921 A JP 2006505921A JP 2004519941 A JP2004519941 A JP 2004519941A JP 2004519941 A JP2004519941 A JP 2004519941A JP 2006505921 A JP2006505921 A JP 2006505921A
Authority
JP
Japan
Prior art keywords
carrier
plastic material
fire
enclosure
door
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004519941A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006505921A5 (fr
Inventor
バート，サンジブ，エム
Original Assignee
エンテグリス・インコーポレーテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/190,355 external-priority patent/US20040004079A1/en
Application filed by エンテグリス・インコーポレーテッド filed Critical エンテグリス・インコーポレーテッド
Publication of JP2006505921A publication Critical patent/JP2006505921A/ja
Publication of JP2006505921A5 publication Critical patent/JP2006505921A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2004519941A 2002-07-05 2003-07-07 防火ウェハーキャリア Pending JP2006505921A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US39421902P 2002-07-05 2002-07-05
US10/190,355 2002-07-05
US10/190,355 US20040004079A1 (en) 2002-07-05 2002-07-05 Fire retardant foup wafer carrier
US60/394,219 2002-07-05
PCT/US2003/021161 WO2004005163A1 (fr) 2002-07-05 2003-07-07 Porte-plaquette ignifuge

Publications (2)

Publication Number Publication Date
JP2006505921A true JP2006505921A (ja) 2006-02-16
JP2006505921A5 JP2006505921A5 (fr) 2006-08-17

Family

ID=30117808

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004519941A Pending JP2006505921A (ja) 2002-07-05 2003-07-07 防火ウェハーキャリア

Country Status (6)

Country Link
EP (1) EP1539614A1 (fr)
JP (1) JP2006505921A (fr)
CN (1) CN1681723A (fr)
AU (1) AU2003249731A1 (fr)
TW (1) TW200403796A (fr)
WO (1) WO2004005163A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011100983A (ja) * 2009-10-07 2011-05-19 Shin Etsu Polymer Co Ltd 基板収納容器

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3929969B1 (fr) * 2020-06-22 2023-12-06 Siltronic AG Procédé de fabrication d'une cuve de traitement pour pièces à semiconducteur et cuve de traitement
EP4068343A1 (fr) * 2021-04-01 2022-10-05 Siltronic AG Dispositif de transport des vitres à semi-conducteur

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4929497A (en) * 1989-03-27 1990-05-29 Albany International Corp. Flame retardant rolling door
US5928971A (en) * 1996-02-01 1999-07-27 Southern Mills, Inc. Firefighter's garment
JP3476052B2 (ja) * 1997-09-01 2003-12-10 信越ポリマー株式会社 輸送容器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011100983A (ja) * 2009-10-07 2011-05-19 Shin Etsu Polymer Co Ltd 基板収納容器
US8317029B2 (en) 2009-10-07 2012-11-27 Shin-Etsu Polymer Co., Ltd. Wafer storage container

Also Published As

Publication number Publication date
CN1681723A (zh) 2005-10-12
AU2003249731A1 (en) 2004-01-23
TW200403796A (en) 2004-03-01
WO2004005163A1 (fr) 2004-01-15
EP1539614A1 (fr) 2005-06-15

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