JP2006505921A - 防火ウェハーキャリア - Google Patents
防火ウェハーキャリア Download PDFInfo
- Publication number
- JP2006505921A JP2006505921A JP2004519941A JP2004519941A JP2006505921A JP 2006505921 A JP2006505921 A JP 2006505921A JP 2004519941 A JP2004519941 A JP 2004519941A JP 2004519941 A JP2004519941 A JP 2004519941A JP 2006505921 A JP2006505921 A JP 2006505921A
- Authority
- JP
- Japan
- Prior art keywords
- carrier
- plastic material
- fire
- enclosure
- door
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 78
- 229920003023 plastic Polymers 0.000 claims abstract description 65
- 239000004033 plastic Substances 0.000 claims abstract description 65
- 239000004417 polycarbonate Substances 0.000 claims abstract description 33
- 229920000515 polycarbonate Polymers 0.000 claims abstract description 33
- 239000004697 Polyetherimide Substances 0.000 claims abstract description 16
- 229920001601 polyetherimide Polymers 0.000 claims abstract description 16
- 239000004696 Poly ether ether ketone Substances 0.000 claims abstract description 14
- 229920002530 polyetherether ketone Polymers 0.000 claims abstract description 14
- -1 polytetrafluoroethylene Polymers 0.000 claims abstract description 12
- 239000004642 Polyimide Substances 0.000 claims abstract description 11
- 229920001652 poly(etherketoneketone) Polymers 0.000 claims abstract description 11
- 229920001721 polyimide Polymers 0.000 claims abstract description 11
- 229920001470 polyketone Polymers 0.000 claims abstract description 11
- 239000004810 polytetrafluoroethylene Substances 0.000 claims abstract description 11
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims abstract description 11
- 229920002312 polyamide-imide Polymers 0.000 claims abstract description 10
- 239000004962 Polyamide-imide Substances 0.000 claims abstract description 9
- 229920001643 poly(ether ketone) Polymers 0.000 claims abstract description 9
- 239000004695 Polyether sulfone Substances 0.000 claims abstract description 7
- 229920006393 polyether sulfone Polymers 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 14
- 230000009970 fire resistant effect Effects 0.000 claims description 8
- 239000003063 flame retardant Substances 0.000 claims description 8
- 238000000465 moulding Methods 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 230000003111 delayed effect Effects 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 101000873785 Homo sapiens mRNA-decapping enzyme 1A Proteins 0.000 claims description 3
- 102100035856 mRNA-decapping enzyme 1A Human genes 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 claims 2
- 230000000979 retarding effect Effects 0.000 claims 1
- 239000000969 carrier Substances 0.000 abstract description 27
- 239000002861 polymer material Substances 0.000 abstract description 5
- 235000012431 wafers Nutrition 0.000 description 69
- 238000012545 processing Methods 0.000 description 12
- 230000004224 protection Effects 0.000 description 12
- 239000004065 semiconductor Substances 0.000 description 10
- 230000006378 damage Effects 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 229940058401 polytetrafluoroethylene Drugs 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 239000012876 carrier material Substances 0.000 description 4
- 238000011109 contamination Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000010408 film Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 230000001629 suppression Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000006750 UV protection Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000003466 anti-cipated effect Effects 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000001902 propagating effect Effects 0.000 description 2
- 238000000197 pyrolysis Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229920008285 Poly(ether ketone) PEK Polymers 0.000 description 1
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- 229920004747 ULTEM® 1000 Polymers 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US39421902P | 2002-07-05 | 2002-07-05 | |
US10/190,355 | 2002-07-05 | ||
US10/190,355 US20040004079A1 (en) | 2002-07-05 | 2002-07-05 | Fire retardant foup wafer carrier |
US60/394,219 | 2002-07-05 | ||
PCT/US2003/021161 WO2004005163A1 (fr) | 2002-07-05 | 2003-07-07 | Porte-plaquette ignifuge |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006505921A true JP2006505921A (ja) | 2006-02-16 |
JP2006505921A5 JP2006505921A5 (fr) | 2006-08-17 |
Family
ID=30117808
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004519941A Pending JP2006505921A (ja) | 2002-07-05 | 2003-07-07 | 防火ウェハーキャリア |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1539614A1 (fr) |
JP (1) | JP2006505921A (fr) |
CN (1) | CN1681723A (fr) |
AU (1) | AU2003249731A1 (fr) |
TW (1) | TW200403796A (fr) |
WO (1) | WO2004005163A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011100983A (ja) * | 2009-10-07 | 2011-05-19 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3929969B1 (fr) * | 2020-06-22 | 2023-12-06 | Siltronic AG | Procédé de fabrication d'une cuve de traitement pour pièces à semiconducteur et cuve de traitement |
EP4068343A1 (fr) * | 2021-04-01 | 2022-10-05 | Siltronic AG | Dispositif de transport des vitres à semi-conducteur |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4929497A (en) * | 1989-03-27 | 1990-05-29 | Albany International Corp. | Flame retardant rolling door |
US5928971A (en) * | 1996-02-01 | 1999-07-27 | Southern Mills, Inc. | Firefighter's garment |
JP3476052B2 (ja) * | 1997-09-01 | 2003-12-10 | 信越ポリマー株式会社 | 輸送容器 |
-
2003
- 2003-07-04 TW TW92118305A patent/TW200403796A/zh unknown
- 2003-07-07 EP EP03763268A patent/EP1539614A1/fr not_active Withdrawn
- 2003-07-07 AU AU2003249731A patent/AU2003249731A1/en not_active Abandoned
- 2003-07-07 WO PCT/US2003/021161 patent/WO2004005163A1/fr active Application Filing
- 2003-07-07 CN CN 03821230 patent/CN1681723A/zh active Pending
- 2003-07-07 JP JP2004519941A patent/JP2006505921A/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011100983A (ja) * | 2009-10-07 | 2011-05-19 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
US8317029B2 (en) | 2009-10-07 | 2012-11-27 | Shin-Etsu Polymer Co., Ltd. | Wafer storage container |
Also Published As
Publication number | Publication date |
---|---|
CN1681723A (zh) | 2005-10-12 |
AU2003249731A1 (en) | 2004-01-23 |
TW200403796A (en) | 2004-03-01 |
WO2004005163A1 (fr) | 2004-01-15 |
EP1539614A1 (fr) | 2005-06-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4150465B2 (ja) | ウェハーキャリヤ及びその製造方法 | |
US8734698B2 (en) | Composite substrate carrier | |
KR20170048429A (ko) | 기판 컨테이너 | |
KR100516863B1 (ko) | 기판 처리 장치의 로드 포트 시스템 및 기판의 처리 방법 | |
US7316325B2 (en) | Substrate container | |
KR102088753B1 (ko) | 장비 전방 단부 모듈을 위한 유동 수정 고정구 | |
TW201514073A (zh) | 晶圓容置箱及其製造方法 | |
JP2009543374A (ja) | ウエハカセット | |
US7325698B2 (en) | Wafer container door with particulate collecting structure | |
US20040074808A1 (en) | Fire retardant wafer carrier | |
JP2014513442A (ja) | パーティクルシールドを有するウェハ容器 | |
EP1682431A2 (fr) | Porte-substrat | |
CN109720799A (zh) | 运输容器 | |
JP2006505921A (ja) | 防火ウェハーキャリア | |
US8292077B2 (en) | Shock absorbing substrate container | |
JP3938233B2 (ja) | 密封容器 | |
US10043695B1 (en) | Apparatus for carrying and shielding wafers | |
KR20050018946A (ko) | 방화성 웨이퍼 캐리어 | |
TW202036764A (zh) | 基板收納容器 | |
US20040004079A1 (en) | Fire retardant foup wafer carrier | |
KR200414793Y1 (ko) | 웨이퍼 지지용 선반 | |
TWI333924B (en) | Substrate container,method of dissipating static electricity therefrom, and method of making the same | |
JP2014500616A (ja) | 扉のたわみを最小化した前面開放式ウエハ容器 | |
KR20150093372A (ko) | 웨이퍼 수납 용기 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A59 | Written plea |
Free format text: JAPANESE INTERMEDIATE CODE: A59 Effective date: 20051012 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060629 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060629 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090127 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20090623 |