TW197531B - - Google Patents

Info

Publication number
TW197531B
TW197531B TW081103708A TW81103708A TW197531B TW 197531 B TW197531 B TW 197531B TW 081103708 A TW081103708 A TW 081103708A TW 81103708 A TW81103708 A TW 81103708A TW 197531 B TW197531 B TW 197531B
Authority
TW
Taiwan
Prior art keywords
slurry
pad
polishing
energy
embedded
Prior art date
Application number
TW081103708A
Other languages
English (en)
Chinese (zh)
Inventor
Gabriel Lorimer Miller
Eric Richard Wagner
Original Assignee
American Telephone & Telegraph
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Telephone & Telegraph filed Critical American Telephone & Telegraph
Application granted granted Critical
Publication of TW197531B publication Critical patent/TW197531B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
TW081103708A 1992-04-02 1992-05-13 TW197531B (cg-RX-API-DMAC7.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/862,044 US5245796A (en) 1992-04-02 1992-04-02 Slurry polisher using ultrasonic agitation

Publications (1)

Publication Number Publication Date
TW197531B true TW197531B (cg-RX-API-DMAC7.html) 1993-01-01

Family

ID=25337489

Family Applications (1)

Application Number Title Priority Date Filing Date
TW081103708A TW197531B (cg-RX-API-DMAC7.html) 1992-04-02 1992-05-13

Country Status (8)

Country Link
US (1) US5245796A (cg-RX-API-DMAC7.html)
EP (1) EP0566258B1 (cg-RX-API-DMAC7.html)
JP (1) JP2981079B2 (cg-RX-API-DMAC7.html)
KR (1) KR930022483A (cg-RX-API-DMAC7.html)
DE (1) DE69303109T2 (cg-RX-API-DMAC7.html)
ES (1) ES2088228T3 (cg-RX-API-DMAC7.html)
HK (1) HK180296A (cg-RX-API-DMAC7.html)
TW (1) TW197531B (cg-RX-API-DMAC7.html)

Families Citing this family (98)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69317838T2 (de) * 1992-09-24 1998-11-12 Ebara Corp Poliergerät
US5340036A (en) * 1993-05-19 1994-08-23 Emerson Electric Co. Dry waste grinder
US5531861A (en) * 1993-09-29 1996-07-02 Motorola, Inc. Chemical-mechanical-polishing pad cleaning process for use during the fabrication of semiconductor devices
US5456627A (en) * 1993-12-20 1995-10-10 Westech Systems, Inc. Conditioner for a polishing pad and method therefor
US5551907A (en) * 1994-03-14 1996-09-03 Hughes Aircraft Company System for ultrasonic lap grinding and polishing
US5783497A (en) * 1994-08-02 1998-07-21 Sematech, Inc. Forced-flow wafer polisher
US5562530A (en) * 1994-08-02 1996-10-08 Sematech, Inc. Pulsed-force chemical mechanical polishing
US5607341A (en) 1994-08-08 1997-03-04 Leach; Michael A. Method and structure for polishing a wafer during manufacture of integrated circuits
US5522965A (en) * 1994-12-12 1996-06-04 Texas Instruments Incorporated Compact system and method for chemical-mechanical polishing utilizing energy coupled to the polishing pad/water interface
US5688364A (en) * 1994-12-22 1997-11-18 Sony Corporation Chemical-mechanical polishing method and apparatus using ultrasound applied to the carrier and platen
US5591068A (en) * 1995-03-13 1997-01-07 Regents Of The University Of California Precision non-contact polishing tool
JP2647050B2 (ja) * 1995-03-31 1997-08-27 日本電気株式会社 ウェハ研磨装置
US5672095A (en) * 1995-09-29 1997-09-30 Intel Corporation Elimination of pad conditioning in a chemical mechanical polishing process
US5709593A (en) * 1995-10-27 1998-01-20 Applied Materials, Inc. Apparatus and method for distribution of slurry in a chemical mechanical polishing system
KR100445139B1 (ko) 1996-01-23 2004-11-17 가부시키 가이샤 에바라 세이사꾸쇼 폴리싱장치
US5915915A (en) * 1996-03-07 1999-06-29 Komag, Incorporated End effector and method for loading and unloading disks at a processing station
US5954570A (en) * 1996-05-31 1999-09-21 Kabushiki Kaisha Toshiba Conditioner for a polishing tool
US5868608A (en) 1996-08-13 1999-02-09 Lsi Logic Corporation Subsonic to supersonic and ultrasonic conditioning of a polishing pad in a chemical mechanical polishing apparatus
US6210525B1 (en) 1996-08-16 2001-04-03 Rodel Holdings, Inc. Apparatus and methods for chemical-mechanical polishing of semiconductor wafers
US6245679B1 (en) 1996-08-16 2001-06-12 Rodel Holdings, Inc Apparatus and methods for chemical-mechanical polishing of semiconductor wafers
US6537137B2 (en) 1996-08-16 2003-03-25 Rodel Holdings, Inc Methods for chemical-mechanical polishing of semiconductor wafers
US5932486A (en) * 1996-08-16 1999-08-03 Rodel, Inc. Apparatus and methods for recirculating chemical-mechanical polishing of semiconductor wafers
US6769967B1 (en) 1996-10-21 2004-08-03 Micron Technology, Inc. Apparatus and method for refurbishing polishing pads used in chemical-mechanical planarization of semiconductor wafers
US5782675A (en) * 1996-10-21 1998-07-21 Micron Technology, Inc. Apparatus and method for refurbishing fixed-abrasive polishing pads used in chemical-mechanical planarization of semiconductor wafers
KR19980064179A (ko) * 1996-12-19 1998-10-07 윌리엄비.켐플러 웨이퍼 연마 공정시 실리콘 제거율을 안정화하는 방법
JPH10217149A (ja) * 1997-02-05 1998-08-18 Ebara Corp ターンテーブル用クロスの剥離治具
JP3130000B2 (ja) 1997-09-04 2001-01-31 松下電子工業株式会社 半導体ウェハ研磨装置及び研磨方法
US5968841A (en) * 1997-05-06 1999-10-19 International Business Machines Corporation Device and method for preventing settlement of particles on a chemical-mechanical polishing pad
US5967881A (en) * 1997-05-29 1999-10-19 Tucker; Thomas N. Chemical mechanical planarization tool having a linear polishing roller
US6036583A (en) * 1997-07-11 2000-03-14 Applied Materials, Inc. Conditioner head in a substrate polisher and method
US5904615A (en) * 1997-07-18 1999-05-18 Hankook Machine Tools Co., Ltd. Pad conditioner for chemical mechanical polishing apparatus
US6406364B1 (en) * 1997-08-12 2002-06-18 Ebara Corporation Polishing solution feeder
DE19737849A1 (de) * 1997-08-29 1999-03-11 Siemens Ag Vorrichtung und Verfahren zum Beheizen eines flüssigen oder zähflüssigen Poliermittels sowie Vorrichtung zum Polieren von Wafern
US5957754A (en) * 1997-08-29 1999-09-28 Applied Materials, Inc. Cavitational polishing pad conditioner
TW404876B (en) * 1997-09-26 2000-09-11 Siemens Ag Process for chemical-mechanical planarization and equipment for performing said process
US5916010A (en) * 1997-10-30 1999-06-29 International Business Machines Corporation CMP pad maintenance apparatus and method
US6083085A (en) 1997-12-22 2000-07-04 Micron Technology, Inc. Method and apparatus for planarizing microelectronic substrates and conditioning planarizing media
JPH11277434A (ja) * 1998-03-30 1999-10-12 Speedfam Co Ltd Ｃｍｐ装置のスラリリサイクルシステム及びその方法
US6200199B1 (en) 1998-03-31 2001-03-13 Applied Materials, Inc. Chemical mechanical polishing conditioner
US6024829A (en) * 1998-05-21 2000-02-15 Lucent Technologies Inc. Method of reducing agglomerate particles in a polishing slurry
KR100302482B1 (ko) * 1998-06-23 2001-11-30 윤종용 반도체씨엠피공정의슬러리공급시스템
US6106374A (en) * 1998-07-16 2000-08-22 International Business Machines Corporation Acoustically agitated delivery
US6179693B1 (en) * 1998-10-06 2001-01-30 International Business Machines Corporation In-situ/self-propelled polishing pad conditioner and cleaner
US6589105B2 (en) 1998-12-01 2003-07-08 Nutool, Inc. Pad tensioning method and system in a bi-directional linear polisher
US7425250B2 (en) * 1998-12-01 2008-09-16 Novellus Systems, Inc. Electrochemical mechanical processing apparatus
US6103628A (en) * 1998-12-01 2000-08-15 Nutool, Inc. Reverse linear polisher with loadable housing
US6468139B1 (en) 1998-12-01 2002-10-22 Nutool, Inc. Polishing apparatus and method with a refreshing polishing belt and loadable housing
US6464571B2 (en) 1998-12-01 2002-10-15 Nutool, Inc. Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein
JP4030247B2 (ja) * 1999-05-17 2008-01-09 株式会社荏原製作所 ドレッシング装置及びポリッシング装置
US6488569B1 (en) 1999-07-23 2002-12-03 Florida State University Method and apparatus for detecting micro-scratches in semiconductor wafers during polishing process
US6306008B1 (en) * 1999-08-31 2001-10-23 Micron Technology, Inc. Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
US6383934B1 (en) 1999-09-02 2002-05-07 Micron Technology, Inc. Method and apparatus for chemical-mechanical planarization of microelectronic substrates with selected planarizing liquids
US6306768B1 (en) 1999-11-17 2001-10-23 Micron Technology, Inc. Method for planarizing microelectronic substrates having apertures
US6313038B1 (en) 2000-04-26 2001-11-06 Micron Technology, Inc. Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates
US6387289B1 (en) 2000-05-04 2002-05-14 Micron Technology, Inc. Planarizing machines and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies
US6612901B1 (en) * 2000-06-07 2003-09-02 Micron Technology, Inc. Apparatus for in-situ optical endpointing of web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
US6554688B2 (en) * 2001-01-04 2003-04-29 Lam Research Corporation Method and apparatus for conditioning a polishing pad with sonic energy
US6875091B2 (en) * 2001-01-04 2005-04-05 Lam Research Corporation Method and apparatus for conditioning a polishing pad with sonic energy
US6722943B2 (en) 2001-08-24 2004-04-20 Micron Technology, Inc. Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces
US6666749B2 (en) * 2001-08-30 2003-12-23 Micron Technology, Inc. Apparatus and method for enhanced processing of microelectronic workpieces
KR20030053375A (ko) * 2001-12-22 2003-06-28 동부전자 주식회사 초음파 발생장치를 구비한 패드 컨디셔닝 장치
US7131889B1 (en) 2002-03-04 2006-11-07 Micron Technology, Inc. Method for planarizing microelectronic workpieces
US6939203B2 (en) * 2002-04-18 2005-09-06 Asm Nutool, Inc. Fluid bearing slide assembly for workpiece polishing
KR20030096766A (ko) * 2002-06-17 2003-12-31 동부전자 주식회사 메가소닉 트랜스듀서를 이용한 슬러리 안정화 방법
US6869335B2 (en) * 2002-07-08 2005-03-22 Micron Technology, Inc. Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces
US7341502B2 (en) 2002-07-18 2008-03-11 Micron Technology, Inc. Methods and systems for planarizing workpieces, e.g., microelectronic workpieces
US6860798B2 (en) * 2002-08-08 2005-03-01 Micron Technology, Inc. Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces
US7094695B2 (en) 2002-08-21 2006-08-22 Micron Technology, Inc. Apparatus and method for conditioning a polishing pad used for mechanical and/or chemical-mechanical planarization
US7004817B2 (en) 2002-08-23 2006-02-28 Micron Technology, Inc. Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces
US7011566B2 (en) * 2002-08-26 2006-03-14 Micron Technology, Inc. Methods and systems for conditioning planarizing pads used in planarizing substrates
US7008299B2 (en) 2002-08-29 2006-03-07 Micron Technology, Inc. Apparatus and method for mechanical and/or chemical-mechanical planarization of micro-device workpieces
US6841991B2 (en) * 2002-08-29 2005-01-11 Micron Technology, Inc. Planarity diagnostic system, E.G., for microelectronic component test systems
US7074114B2 (en) 2003-01-16 2006-07-11 Micron Technology, Inc. Carrier assemblies, polishing machines including carrier assemblies, and methods for polishing micro-device workpieces
US6884152B2 (en) 2003-02-11 2005-04-26 Micron Technology, Inc. Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces
US6872132B2 (en) 2003-03-03 2005-03-29 Micron Technology, Inc. Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces
US6864181B2 (en) * 2003-03-27 2005-03-08 Lam Research Corporation Method and apparatus to form a planarized Cu interconnect layer using electroless membrane deposition
US7367872B2 (en) * 2003-04-08 2008-05-06 Applied Materials, Inc. Conditioner disk for use in chemical mechanical polishing
US6935929B2 (en) 2003-04-28 2005-08-30 Micron Technology, Inc. Polishing machines including under-pads and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces
US7131891B2 (en) 2003-04-28 2006-11-07 Micron Technology, Inc. Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces
US7030603B2 (en) 2003-08-21 2006-04-18 Micron Technology, Inc. Apparatuses and methods for monitoring rotation of a conductive microfeature workpiece
US7648622B2 (en) 2004-02-27 2010-01-19 Novellus Systems, Inc. System and method for electrochemical mechanical polishing
US7086927B2 (en) 2004-03-09 2006-08-08 Micron Technology, Inc. Methods and systems for planarizing workpieces, e.g., microelectronic workpieces
US7066792B2 (en) 2004-08-06 2006-06-27 Micron Technology, Inc. Shaped polishing pads for beveling microfeature workpiece edges, and associate system and methods
US7033253B2 (en) 2004-08-12 2006-04-25 Micron Technology, Inc. Polishing pad conditioners having abrasives and brush elements, and associated systems and methods
DE102004061193B3 (de) * 2004-12-20 2006-07-20 Kastriot Merlaku Elektrische Handpoliermaschine für das Polieren von Fahrzeugen
US7264539B2 (en) 2005-07-13 2007-09-04 Micron Technology, Inc. Systems and methods for removing microfeature workpiece surface defects
KR100727484B1 (ko) * 2005-07-28 2007-06-13 삼성전자주식회사 화학기계적 연마 장치 및 패드 컨디셔닝 방법
US7326105B2 (en) 2005-08-31 2008-02-05 Micron Technology, Inc. Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces
US7438626B2 (en) * 2005-08-31 2008-10-21 Micron Technology, Inc. Apparatus and method for removing material from microfeature workpieces
US7294049B2 (en) * 2005-09-01 2007-11-13 Micron Technology, Inc. Method and apparatus for removing material from microfeature workpieces
WO2007045267A1 (en) 2005-10-19 2007-04-26 Freescale Semiconductor, Inc. A system and method for cleaning a conditioning device
US7883393B2 (en) 2005-11-08 2011-02-08 Freescale Semiconductor, Inc. System and method for removing particles from a polishing pad
US7754612B2 (en) * 2007-03-14 2010-07-13 Micron Technology, Inc. Methods and apparatuses for removing polysilicon from semiconductor workpieces
JP2010179407A (ja) * 2009-02-05 2010-08-19 Elpida Memory Inc Ｃｍｐ装置
US20110169520A1 (en) * 2010-01-14 2011-07-14 Mks Instruments, Inc. Apparatus for measuring minority carrier lifetime and method for using the same
JP7134101B2 (ja) 2016-06-24 2022-09-09 アプライド マテリアルズ インコーポレイテッド 化学機械研磨用スラリー分配装置
US10391609B1 (en) * 2017-09-05 2019-08-27 Optipro Systems, LLC Modular contact assembly for rotating machine tool
US20240035192A1 (en) * 2021-03-29 2024-02-01 The 13Th Research Institute Of China Electronics Technology Group Corporation Polishing Device for Indium Phosphide Substrate, and Polishing Process

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3123951A (en) * 1964-03-10 Ultrasonic cleaning of grinding wheels
US3093937A (en) * 1962-11-30 1963-06-18 Cavitron Ultrasonics Inc Ultrasonic lapping machines
US3855441A (en) * 1974-04-08 1974-12-17 Braelow D Method and apparatus for activation of an abrasive slurry by an electric arc
DE2435848C3 (de) * 1974-07-25 1979-07-26 Supfina Maschinenfabrik Hentzen Kg, 5630 Remscheid Vorrichtung zur Sauberhaltung der Kontaktfläche eines Honsteins
US4069805A (en) * 1977-01-25 1978-01-24 Philip Sherman Wire apparatus for abrasive powder machining
US4927432A (en) * 1986-03-25 1990-05-22 Rodel, Inc. Pad material for grinding, lapping and polishing
DE3625286A1 (de) * 1986-07-25 1988-02-04 Flier Gustav Schleifscheibenreinigung durch beaufschlagung des kuehlwassers mit ultraschall, insbesondere in anwendung fuer schleifmaschinen
JPS6362673A (ja) * 1986-09-01 1988-03-18 Speedfam Co Ltd 定寸機構付き平面研磨装置
JPS63185556A (ja) * 1987-01-28 1988-08-01 Toshiba Corp 研磨装置
AU619263B2 (en) * 1988-03-10 1992-01-23 Extrude Hone Corporation Ultrasonic polishing
US5104828A (en) * 1990-03-01 1992-04-14 Intel Corporation Method of planarizing a dielectric formed over a semiconductor substrate
US5055158A (en) * 1990-09-25 1991-10-08 International Business Machines Corporation Planarization of Josephson integrated circuit
US5154021A (en) * 1991-06-26 1992-10-13 International Business Machines Corporation Pneumatic pad conditioner
US5245790A (en) * 1992-02-14 1993-09-21 Lsi Logic Corporation Ultrasonic energy enhanced chemi-mechanical polishing of silicon wafers

Also Published As

Publication number Publication date
US5245796A (en) 1993-09-21
DE69303109T2 (de) 1996-10-10
EP0566258A1 (en) 1993-10-20
HK180296A (en) 1996-10-04
DE69303109D1 (de) 1996-07-18
JP2981079B2 (ja) 1999-11-22
KR930022483A (ko) 1993-11-24
JPH068134A (ja) 1994-01-18
EP0566258B1 (en) 1996-06-12
ES2088228T3 (es) 1996-08-01

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