TR199600281A2 - Yari-iletken bilesenleri sogutmaya mahsus isi mübadele edici. - Google Patents

Yari-iletken bilesenleri sogutmaya mahsus isi mübadele edici.

Info

Publication number
TR199600281A2
TR199600281A2 TR96/00281A TR9600281A TR199600281A2 TR 199600281 A2 TR199600281 A2 TR 199600281A2 TR 96/00281 A TR96/00281 A TR 96/00281A TR 9600281 A TR9600281 A TR 9600281A TR 199600281 A2 TR199600281 A2 TR 199600281A2
Authority
TR
Turkey
Prior art keywords
cooling
base section
grooves
section
width
Prior art date
Application number
TR96/00281A
Other languages
English (en)
Inventor
Uwe Bock
Joachim Gluck
Original Assignee
Alusuisse Lonza Services Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alusuisse Lonza Services Ag filed Critical Alusuisse Lonza Services Ag
Publication of TR199600281A2 publication Critical patent/TR199600281A2/tr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Glass Compositions (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
TR96/00281A 1995-05-04 1996-04-03 Yari-iletken bilesenleri sogutmaya mahsus isi mübadele edici. TR199600281A2 (tr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE29507286U DE29507286U1 (de) 1995-05-04 1995-05-04 Kühlkörper für Halbleiterbauelemente o.dgl. Geräte

Publications (1)

Publication Number Publication Date
TR199600281A2 true TR199600281A2 (tr) 1996-11-21

Family

ID=8007507

Family Applications (1)

Application Number Title Priority Date Filing Date
TR96/00281A TR199600281A2 (tr) 1995-05-04 1996-04-03 Yari-iletken bilesenleri sogutmaya mahsus isi mübadele edici.

Country Status (8)

Country Link
US (2) US6234246B1 (tr)
EP (1) EP0741409B1 (tr)
AT (1) ATE207242T1 (tr)
DE (2) DE29507286U1 (tr)
DK (1) DK0741409T3 (tr)
ES (1) ES2162011T3 (tr)
PT (1) PT741409E (tr)
TR (1) TR199600281A2 (tr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3552047B2 (ja) * 2000-10-25 2004-08-11 古河電気工業株式会社 ヒートシンク、その製造方法、および、押圧治具
WO2002070977A1 (en) 2001-03-01 2002-09-12 Norsk Hydro Asa Heat exchanger having fins
US8464781B2 (en) 2002-11-01 2013-06-18 Cooligy Inc. Cooling systems incorporating heat exchangers and thermoelectric layers
US7591302B1 (en) 2003-07-23 2009-09-22 Cooligy Inc. Pump and fan control concepts in a cooling system
US7188661B2 (en) * 2003-11-13 2007-03-13 Thermamasters, Llc Process for joining members of a heat transfer assembly and assembly formed thereby
US7077188B2 (en) * 2004-09-27 2006-07-18 Shyh-Ming Chen Heat dissipating device with heat conductive tubes
US7036566B1 (en) * 2005-10-06 2006-05-02 Tsung-Hsien Huang Heat dissipating module
FR2898668B1 (fr) * 2006-03-15 2008-06-27 Ferraz Date Ind Soc Par Action Echangeur de chaleur destine au refroidissement d'un composant electronique et son procede de fabrication
WO2008137143A1 (en) * 2007-05-02 2008-11-13 Cooligy Inc. Micro-tube/multi-port counter flow radiator design for electronic cooling applications
TWI312046B (en) * 2007-08-24 2009-07-11 Ama Precision Inc Led base with heat fins
US9297571B1 (en) 2008-03-10 2016-03-29 Liebert Corporation Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
US20100065248A1 (en) * 2008-09-17 2010-03-18 Asia Vital Components Co., Ltd. Heat sink
US20110073292A1 (en) * 2009-09-30 2011-03-31 Madhav Datta Fabrication of high surface area, high aspect ratio mini-channels and their application in liquid cooling systems
EP2894954B1 (en) * 2013-12-06 2021-08-11 Marchesi Metal Technology (Suzhou) Co., Ltd Heat dissipation housing structure connected to heat dissipation fin

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2404166A (en) * 1943-10-02 1946-07-16 Emma G Danilla Device for use in roasting poultry and the like
FR1462160A (fr) * 1963-05-28 1966-04-15 Chausson Usines Sa Procédé de fabrication d'un élément échangeur de chaleur, élément obtenu par ce procédé et application de cet élément à la constitution d'échangeurs de chaleur particuliers
DE2502472C2 (de) * 1975-01-22 1982-09-02 Siemens AG, 1000 Berlin und 8000 München Kühlkörper für Thyristoren
JPS5585049A (en) * 1978-12-21 1980-06-26 Toshiba Corp Cooling fin
JPS57196552A (en) * 1981-05-27 1982-12-02 Nec Corp Radiator
DE3518310A1 (de) * 1985-05-22 1986-11-27 Aluminium-Walzwerke Singen Gmbh, 7700 Singen Kuehlkoerper fuer halbleiterbauelemente und verfahren zu seiner herstellung
DE3814145C2 (de) * 1988-04-27 1998-07-23 Hess Joachim Vorrichtung zum Zuführen oder Abführen von Wärme
JPH06198383A (ja) * 1992-09-21 1994-07-19 Hideaki Serizawa 放熱板及びその製作方法
US5542176A (en) * 1992-09-21 1996-08-06 Hideaki Serizawa Radiation plate and method of producing the same
DE4314663A1 (de) * 1993-05-04 1994-11-10 Alusuisse Lonza Services Ag Kühlkörper für Halbleiterbauelemente
JP2701692B2 (ja) * 1993-05-06 1998-01-21 日本軽金属株式会社 ヒートシンク及びその製造方法
US5435384A (en) * 1994-07-20 1995-07-25 Wu; Chung Heat dissipating plate
US5499450A (en) * 1994-12-19 1996-03-19 Jacoby; John Method of manufacturing a multiple pin heatsink device
US5535515A (en) * 1995-03-13 1996-07-16 Jacoby; John Method of manufacturing a stress-free heatsink assembly

Also Published As

Publication number Publication date
PT741409E (pt) 2002-02-28
EP0741409A3 (de) 1997-06-11
ES2162011T3 (es) 2001-12-16
DE59607913D1 (de) 2001-11-22
ATE207242T1 (de) 2001-11-15
US5950721A (en) 1999-09-14
EP0741409A2 (de) 1996-11-06
US6234246B1 (en) 2001-05-22
DK0741409T3 (da) 2002-02-11
DE29507286U1 (de) 1995-07-20
EP0741409B1 (de) 2001-10-17

Similar Documents

Publication Publication Date Title
TR199600281A2 (tr) Yari-iletken bilesenleri sogutmaya mahsus isi mübadele edici.
US5014776A (en) Heat emitting unit in form of a heater or cooler
EP1398593A3 (en) Plate-fin exchangers with textured surfaces
DE69702180D1 (de) Plattenwärmetauscher mit Rippen
ES2027359T3 (es) Metodo de fabricar un intercambiador de calor, y forma hueca para dicho intercambiador.
SE9900052L (sv) Värmeväxlarplatta
KR100503407B1 (ko) 핀 튜브형 열교환기
FR2718836B1 (fr) Echangeur de chaleur perfectionné à plaques brasées.
DE29622191U1 (de) Plattenwärmetauscher, insbesondere Ölkühler
KR930020137A (ko) 열교환기 및 그 제조방법
EP1327846A3 (de) Wärmetauscher sowie Verfahren zur Herstellung eines Wärmetauschers
MY118553A (en) Heat exchanger
ATE181594T1 (de) Wärmetauscherelement aus einem aluminium- strangpressprofil
ATE230100T1 (de) Wärmetauscher mit verbeulten rippenplatten
EP0795905A3 (de) Kühlkörper für Halbleiterbauelemente od. dgl. Einrichtungen
DE59407877D1 (de) Wärmetauscher, insbesondere Kältemittelverdampfer
NO950385L (no) Varmeisolerende laminatprofil
ATE340351T1 (de) Wärmeübertrager-flachrohrblock mit umgeformten flachrohrenden
SE8605420D0 (sv) Profilerade vermeoverforingsplattor
DK0890687T3 (da) Fremgangsmåde til fremstilling af mønning- og gratafdækningsstrimler
ATE39283T1 (de) Waermeaustauscher mit entlastungsanker fuer die waermeaustauscherrohre.
RU93036378A (ru) Теплообменник
IT1298316B1 (it) Dispositivo per l'avanzamento controllato di nastri metallici, in particolare nella produzione di alette per scambiatori termici
RU96110492A (ru) Отражательная дифракционная решетка
DE69911835D1 (de) Kühlanlage mit einem am Wärmetauscher befestigtem Motorlüfter