DK0741409T3 - Køleelement til halvlederkomponenter - Google Patents
Køleelement til halvlederkomponenterInfo
- Publication number
- DK0741409T3 DK0741409T3 DK96810261T DK96810261T DK0741409T3 DK 0741409 T3 DK0741409 T3 DK 0741409T3 DK 96810261 T DK96810261 T DK 96810261T DK 96810261 T DK96810261 T DK 96810261T DK 0741409 T3 DK0741409 T3 DK 0741409T3
- Authority
- DK
- Denmark
- Prior art keywords
- cooling
- base section
- grooves
- section
- width
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Glass Compositions (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE29507286U DE29507286U1 (de) | 1995-05-04 | 1995-05-04 | Kühlkörper für Halbleiterbauelemente o.dgl. Geräte |
Publications (1)
Publication Number | Publication Date |
---|---|
DK0741409T3 true DK0741409T3 (da) | 2002-02-11 |
Family
ID=8007507
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK96810261T DK0741409T3 (da) | 1995-05-04 | 1996-04-24 | Køleelement til halvlederkomponenter |
Country Status (8)
Country | Link |
---|---|
US (2) | US6234246B1 (da) |
EP (1) | EP0741409B1 (da) |
AT (1) | ATE207242T1 (da) |
DE (2) | DE29507286U1 (da) |
DK (1) | DK0741409T3 (da) |
ES (1) | ES2162011T3 (da) |
PT (1) | PT741409E (da) |
TR (1) | TR199600281A2 (da) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3552047B2 (ja) * | 2000-10-25 | 2004-08-11 | 古河電気工業株式会社 | ヒートシンク、その製造方法、および、押圧治具 |
WO2002070977A1 (en) | 2001-03-01 | 2002-09-12 | Norsk Hydro Asa | Heat exchanger having fins |
US8464781B2 (en) | 2002-11-01 | 2013-06-18 | Cooligy Inc. | Cooling systems incorporating heat exchangers and thermoelectric layers |
US7591302B1 (en) | 2003-07-23 | 2009-09-22 | Cooligy Inc. | Pump and fan control concepts in a cooling system |
US7188661B2 (en) * | 2003-11-13 | 2007-03-13 | Thermamasters, Llc | Process for joining members of a heat transfer assembly and assembly formed thereby |
US7077188B2 (en) * | 2004-09-27 | 2006-07-18 | Shyh-Ming Chen | Heat dissipating device with heat conductive tubes |
US7036566B1 (en) * | 2005-10-06 | 2006-05-02 | Tsung-Hsien Huang | Heat dissipating module |
FR2898668B1 (fr) * | 2006-03-15 | 2008-06-27 | Ferraz Date Ind Soc Par Action | Echangeur de chaleur destine au refroidissement d'un composant electronique et son procede de fabrication |
WO2008137143A1 (en) * | 2007-05-02 | 2008-11-13 | Cooligy Inc. | Micro-tube/multi-port counter flow radiator design for electronic cooling applications |
TWI312046B (en) * | 2007-08-24 | 2009-07-11 | Ama Precision Inc | Led base with heat fins |
US9297571B1 (en) | 2008-03-10 | 2016-03-29 | Liebert Corporation | Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door |
US20100065248A1 (en) * | 2008-09-17 | 2010-03-18 | Asia Vital Components Co., Ltd. | Heat sink |
US20110073292A1 (en) * | 2009-09-30 | 2011-03-31 | Madhav Datta | Fabrication of high surface area, high aspect ratio mini-channels and their application in liquid cooling systems |
EP2894954B1 (en) * | 2013-12-06 | 2021-08-11 | Marchesi Metal Technology (Suzhou) Co., Ltd | Heat dissipation housing structure connected to heat dissipation fin |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2404166A (en) * | 1943-10-02 | 1946-07-16 | Emma G Danilla | Device for use in roasting poultry and the like |
FR1462160A (fr) * | 1963-05-28 | 1966-04-15 | Chausson Usines Sa | Procédé de fabrication d'un élément échangeur de chaleur, élément obtenu par ce procédé et application de cet élément à la constitution d'échangeurs de chaleur particuliers |
DE2502472C2 (de) * | 1975-01-22 | 1982-09-02 | Siemens AG, 1000 Berlin und 8000 München | Kühlkörper für Thyristoren |
JPS5585049A (en) * | 1978-12-21 | 1980-06-26 | Toshiba Corp | Cooling fin |
JPS57196552A (en) * | 1981-05-27 | 1982-12-02 | Nec Corp | Radiator |
DE3518310A1 (de) * | 1985-05-22 | 1986-11-27 | Aluminium-Walzwerke Singen Gmbh, 7700 Singen | Kuehlkoerper fuer halbleiterbauelemente und verfahren zu seiner herstellung |
DE3814145C2 (de) * | 1988-04-27 | 1998-07-23 | Hess Joachim | Vorrichtung zum Zuführen oder Abführen von Wärme |
JPH06198383A (ja) * | 1992-09-21 | 1994-07-19 | Hideaki Serizawa | 放熱板及びその製作方法 |
US5542176A (en) * | 1992-09-21 | 1996-08-06 | Hideaki Serizawa | Radiation plate and method of producing the same |
DE4314663A1 (de) * | 1993-05-04 | 1994-11-10 | Alusuisse Lonza Services Ag | Kühlkörper für Halbleiterbauelemente |
JP2701692B2 (ja) * | 1993-05-06 | 1998-01-21 | 日本軽金属株式会社 | ヒートシンク及びその製造方法 |
US5435384A (en) * | 1994-07-20 | 1995-07-25 | Wu; Chung | Heat dissipating plate |
US5499450A (en) * | 1994-12-19 | 1996-03-19 | Jacoby; John | Method of manufacturing a multiple pin heatsink device |
US5535515A (en) * | 1995-03-13 | 1996-07-16 | Jacoby; John | Method of manufacturing a stress-free heatsink assembly |
-
1995
- 1995-05-04 DE DE29507286U patent/DE29507286U1/de not_active Expired - Lifetime
-
1996
- 1996-04-03 TR TR96/00281A patent/TR199600281A2/xx unknown
- 1996-04-05 US US08/628,805 patent/US6234246B1/en not_active Expired - Fee Related
- 1996-04-24 AT AT96810261T patent/ATE207242T1/de not_active IP Right Cessation
- 1996-04-24 EP EP96810261A patent/EP0741409B1/de not_active Expired - Lifetime
- 1996-04-24 ES ES96810261T patent/ES2162011T3/es not_active Expired - Lifetime
- 1996-04-24 DK DK96810261T patent/DK0741409T3/da active
- 1996-04-24 DE DE59607913T patent/DE59607913D1/de not_active Expired - Fee Related
- 1996-04-24 PT PT96810261T patent/PT741409E/pt unknown
-
1997
- 1997-08-20 US US08/915,187 patent/US5950721A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
ES2162011T3 (es) | 2001-12-16 |
ATE207242T1 (de) | 2001-11-15 |
DE59607913D1 (de) | 2001-11-22 |
TR199600281A2 (tr) | 1996-11-21 |
PT741409E (pt) | 2002-02-28 |
DE29507286U1 (de) | 1995-07-20 |
EP0741409A2 (de) | 1996-11-06 |
US5950721A (en) | 1999-09-14 |
EP0741409B1 (de) | 2001-10-17 |
EP0741409A3 (de) | 1997-06-11 |
US6234246B1 (en) | 2001-05-22 |
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