ES2162011T3 - Cuerpo de refrigeracion para componentes semiconductores. - Google Patents

Cuerpo de refrigeracion para componentes semiconductores.

Info

Publication number
ES2162011T3
ES2162011T3 ES96810261T ES96810261T ES2162011T3 ES 2162011 T3 ES2162011 T3 ES 2162011T3 ES 96810261 T ES96810261 T ES 96810261T ES 96810261 T ES96810261 T ES 96810261T ES 2162011 T3 ES2162011 T3 ES 2162011T3
Authority
ES
Spain
Prior art keywords
cooling
base section
grooves
section
width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES96810261T
Other languages
English (en)
Inventor
Uwe Bock
Joachim Gluck
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3A Composites International AG
Original Assignee
Alcan Technology and Management Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcan Technology and Management Ltd filed Critical Alcan Technology and Management Ltd
Application granted granted Critical
Publication of ES2162011T3 publication Critical patent/ES2162011T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Glass Compositions (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

LA INVENCION SE REFIERE A UN CUERPO DE ENFRIAMIENTO PARA ELEMENTO COMPONENTE SEMICONDUCTOR O APARATO SIMILAR. EL CUERPO DE ENFRIAMIENTO MUESTRA NERVIOS DE ENFRIAMIENTO CONECTADOS Y DISPUESTOS EN UNA APLICACION DE ALUMINIO U OTRO METAL LIGERO PRESIONADOS MEDIANTE EXTRUSION, DISPUESTOS A UNA DISTANCIA UNO DE OTRO EN UN PERFIL BASICO. SE DISPONE DE FORMA FIJA RESPECTIVA EN UNA RANURA DE APLICACION O CAVIDAD SIMILAR DEL PERFIL BASICO. LOS NERVIOS DE ENFRIAMIENTO SE CONFIGURAN DE FORMA RESPECTIVA COMO PLACAS (16,16'') DE REFRIGERACION A BASE DE TIRAS DE MATERIAL DELGADO (ESPESOR D) Y SU CORTE LONGITUDINAL SE AMPLIA AL MENOS EN LA ZONA DE SU UNION CON EL PERFIL BASICO.
ES96810261T 1995-05-04 1996-04-24 Cuerpo de refrigeracion para componentes semiconductores. Expired - Lifetime ES2162011T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE29507286U DE29507286U1 (de) 1995-05-04 1995-05-04 Kühlkörper für Halbleiterbauelemente o.dgl. Geräte

Publications (1)

Publication Number Publication Date
ES2162011T3 true ES2162011T3 (es) 2001-12-16

Family

ID=8007507

Family Applications (1)

Application Number Title Priority Date Filing Date
ES96810261T Expired - Lifetime ES2162011T3 (es) 1995-05-04 1996-04-24 Cuerpo de refrigeracion para componentes semiconductores.

Country Status (8)

Country Link
US (2) US6234246B1 (es)
EP (1) EP0741409B1 (es)
AT (1) ATE207242T1 (es)
DE (2) DE29507286U1 (es)
DK (1) DK0741409T3 (es)
ES (1) ES2162011T3 (es)
PT (1) PT741409E (es)
TR (1) TR199600281A2 (es)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3552047B2 (ja) * 2000-10-25 2004-08-11 古河電気工業株式会社 ヒートシンク、その製造方法、および、押圧治具
WO2002070977A1 (en) 2001-03-01 2002-09-12 Norsk Hydro Asa Heat exchanger having fins
US8464781B2 (en) 2002-11-01 2013-06-18 Cooligy Inc. Cooling systems incorporating heat exchangers and thermoelectric layers
US7591302B1 (en) 2003-07-23 2009-09-22 Cooligy Inc. Pump and fan control concepts in a cooling system
US7188661B2 (en) * 2003-11-13 2007-03-13 Thermamasters, Llc Process for joining members of a heat transfer assembly and assembly formed thereby
US7077188B2 (en) * 2004-09-27 2006-07-18 Shyh-Ming Chen Heat dissipating device with heat conductive tubes
US7036566B1 (en) * 2005-10-06 2006-05-02 Tsung-Hsien Huang Heat dissipating module
FR2898668B1 (fr) * 2006-03-15 2008-06-27 Ferraz Date Ind Soc Par Action Echangeur de chaleur destine au refroidissement d'un composant electronique et son procede de fabrication
CN101715536A (zh) * 2007-05-02 2010-05-26 固利吉股份有限公司 用于电子冷却应用的微管/多端口逆流散热器设计
TWI312046B (en) * 2007-08-24 2009-07-11 Ama Precision Inc Led base with heat fins
US9297571B1 (en) 2008-03-10 2016-03-29 Liebert Corporation Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
US20100065248A1 (en) * 2008-09-17 2010-03-18 Asia Vital Components Co., Ltd. Heat sink
US20110073292A1 (en) * 2009-09-30 2011-03-31 Madhav Datta Fabrication of high surface area, high aspect ratio mini-channels and their application in liquid cooling systems
US20160265853A1 (en) * 2013-12-06 2016-09-15 Marchesi Metal Technology (Suzhou) Co., Ltd A heat dissipating enclosure with integrated cooling fins

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2404166A (en) * 1943-10-02 1946-07-16 Emma G Danilla Device for use in roasting poultry and the like
FR1462160A (fr) * 1963-05-28 1966-04-15 Chausson Usines Sa Procédé de fabrication d'un élément échangeur de chaleur, élément obtenu par ce procédé et application de cet élément à la constitution d'échangeurs de chaleur particuliers
DE2502472C2 (de) * 1975-01-22 1982-09-02 Siemens AG, 1000 Berlin und 8000 München Kühlkörper für Thyristoren
JPS5585049A (en) * 1978-12-21 1980-06-26 Toshiba Corp Cooling fin
JPS57196552A (en) * 1981-05-27 1982-12-02 Nec Corp Radiator
DE3518310A1 (de) * 1985-05-22 1986-11-27 Aluminium-Walzwerke Singen Gmbh, 7700 Singen Kuehlkoerper fuer halbleiterbauelemente und verfahren zu seiner herstellung
DE3814145C2 (de) * 1988-04-27 1998-07-23 Hess Joachim Vorrichtung zum Zuführen oder Abführen von Wärme
US5542176A (en) * 1992-09-21 1996-08-06 Hideaki Serizawa Radiation plate and method of producing the same
JPH06198383A (ja) * 1992-09-21 1994-07-19 Hideaki Serizawa 放熱板及びその製作方法
DE4314663A1 (de) * 1993-05-04 1994-11-10 Alusuisse Lonza Services Ag Kühlkörper für Halbleiterbauelemente
JP2701692B2 (ja) * 1993-05-06 1998-01-21 日本軽金属株式会社 ヒートシンク及びその製造方法
US5435384A (en) * 1994-07-20 1995-07-25 Wu; Chung Heat dissipating plate
US5499450A (en) * 1994-12-19 1996-03-19 Jacoby; John Method of manufacturing a multiple pin heatsink device
US5535515A (en) * 1995-03-13 1996-07-16 Jacoby; John Method of manufacturing a stress-free heatsink assembly

Also Published As

Publication number Publication date
PT741409E (pt) 2002-02-28
EP0741409A2 (de) 1996-11-06
US6234246B1 (en) 2001-05-22
DE59607913D1 (de) 2001-11-22
EP0741409B1 (de) 2001-10-17
DK0741409T3 (da) 2002-02-11
DE29507286U1 (de) 1995-07-20
ATE207242T1 (de) 2001-11-15
EP0741409A3 (de) 1997-06-11
US5950721A (en) 1999-09-14
TR199600281A2 (tr) 1996-11-21

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