SG96266A1 - Method of fabricating a poly-poly capacitor with a sige bicmos integration scheme - Google Patents
Method of fabricating a poly-poly capacitor with a sige bicmos integration schemeInfo
- Publication number
- SG96266A1 SG96266A1 SG200107801A SG200107801A SG96266A1 SG 96266 A1 SG96266 A1 SG 96266A1 SG 200107801 A SG200107801 A SG 200107801A SG 200107801 A SG200107801 A SG 200107801A SG 96266 A1 SG96266 A1 SG 96266A1
- Authority
- SG
- Singapore
- Prior art keywords
- poly
- fabricating
- capacitor
- integration scheme
- sige bicmos
- Prior art date
Links
- 239000003990 capacitor Substances 0.000 title abstract 3
- 230000010354 integration Effects 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 abstract 2
- 230000008021 deposition Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
- H01L27/0617—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type
- H01L27/0635—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type in combination with bipolar transistors and diodes, or resistors, or capacitors
Landscapes
- Power Engineering (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Bipolar Integrated Circuits (AREA)
- Bipolar Transistors (AREA)
- Control Of Electrical Variables (AREA)
- Networks Using Active Elements (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/745,361 US6440811B1 (en) | 2000-12-21 | 2000-12-21 | Method of fabricating a poly-poly capacitor with a SiGe BiCMOS integration scheme |
Publications (1)
Publication Number | Publication Date |
---|---|
SG96266A1 true SG96266A1 (en) | 2003-05-23 |
Family
ID=24996373
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200107801A SG96266A1 (en) | 2000-12-21 | 2001-12-13 | Method of fabricating a poly-poly capacitor with a sige bicmos integration scheme |
Country Status (8)
Country | Link |
---|---|
US (1) | US6440811B1 (ja) |
EP (1) | EP1225628B1 (ja) |
JP (1) | JP3782962B2 (ja) |
KR (1) | KR100407538B1 (ja) |
AT (1) | ATE331299T1 (ja) |
DE (1) | DE60120897T2 (ja) |
SG (1) | SG96266A1 (ja) |
TW (1) | TW543155B (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6426265B1 (en) * | 2001-01-30 | 2002-07-30 | International Business Machines Corporation | Incorporation of carbon in silicon/silicon germanium epitaxial layer to enhance yield for Si-Ge bipolar technology |
US6911964B2 (en) * | 2002-11-07 | 2005-06-28 | Duke University | Frame buffer pixel circuit for liquid crystal display |
JP4789421B2 (ja) * | 2003-03-12 | 2011-10-12 | 三星電子株式会社 | フォトン吸収膜を有する半導体素子及びその製造方法 |
TWI233689B (en) * | 2003-04-14 | 2005-06-01 | Samsung Electronics Co Ltd | Capacitors of semiconductor devices including silicon-germanium and metallic electrodes and methods of fabricating the same |
KR100618869B1 (ko) * | 2004-10-22 | 2006-09-13 | 삼성전자주식회사 | 커패시터를 포함하는 반도체 소자 및 그 제조방법 |
KR100617057B1 (ko) * | 2004-12-30 | 2006-08-30 | 동부일렉트로닉스 주식회사 | 커패시터 구조 및 그 제조방법 |
KR100634241B1 (ko) * | 2005-05-30 | 2006-10-13 | 삼성전자주식회사 | 반도체 커패시터 및 그 제조 방법 |
KR100731087B1 (ko) * | 2005-10-28 | 2007-06-22 | 동부일렉트로닉스 주식회사 | 바이씨모스 소자 및 그의 제조방법 |
US11355617B2 (en) * | 2019-10-01 | 2022-06-07 | Qualcomm Incorporated | Self-aligned collector heterojunction bipolar transistor (HBT) |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5823470A (ja) * | 1981-08-06 | 1983-02-12 | Oki Electric Ind Co Ltd | 半導体装置 |
US4914546A (en) * | 1989-02-03 | 1990-04-03 | Micrel Incorporated | Stacked multi-polysilicon layer capacitor |
US5195017A (en) | 1989-12-13 | 1993-03-16 | Texas Instruments Incorporated | Method for forming a polysilicon to polysilicon capacitor and apparatus formed therefrom |
US5104822A (en) * | 1990-07-30 | 1992-04-14 | Ramtron Corporation | Method for creating self-aligned, non-patterned contact areas and stacked capacitors using the method |
WO1992014262A1 (en) | 1991-02-01 | 1992-08-20 | Sierra Semiconductor Corporation | Semiconductor structure and method for making same |
US5130885A (en) * | 1991-07-10 | 1992-07-14 | Micron Technology, Inc. | Dram cell in which a silicon-germanium alloy layer having a rough surface morphology is utilized for a capacitive surface |
JP2630874B2 (ja) * | 1991-07-29 | 1997-07-16 | 三洋電機株式会社 | 半導体集積回路の製造方法 |
US5173437A (en) | 1991-08-01 | 1992-12-22 | Chartered Semiconductor Manufacturing Pte Ltd | Double polysilicon capacitor formation compatable with submicron processing |
US5286991A (en) | 1992-08-26 | 1994-02-15 | Pioneer Semiconductor Corporation | Capacitor for a BiCMOS device |
JP2616569B2 (ja) | 1994-09-29 | 1997-06-04 | 日本電気株式会社 | 半導体集積回路装置の製造方法 |
JP2621821B2 (ja) | 1995-03-06 | 1997-06-18 | 日本電気株式会社 | 半導体記憶装置の容量素子の製造方法 |
FR2756103B1 (fr) * | 1996-11-19 | 1999-05-14 | Sgs Thomson Microelectronics | Fabrication de circuits integres bipolaires/cmos et d'un condensateur |
JP2953425B2 (ja) * | 1997-03-31 | 1999-09-27 | 日本電気株式会社 | 半導体装置の製造方法 |
US5939753A (en) | 1997-04-02 | 1999-08-17 | Motorola, Inc. | Monolithic RF mixed signal IC with power amplification |
CN1112731C (zh) | 1997-04-30 | 2003-06-25 | 三星电子株式会社 | 制造用于模拟功能的电容器的方法 |
US5930635A (en) * | 1997-05-02 | 1999-07-27 | National Semiconductor Corporation | Complementary Si/SiGe heterojunction bipolar technology |
US6150706A (en) * | 1998-02-27 | 2000-11-21 | Micron Technology, Inc. | Capacitor/antifuse structure having a barrier-layer electrode and improved barrier layer |
US6218315B1 (en) * | 2000-02-24 | 2001-04-17 | International Business Machines Corporation | HTO (high temperature oxide) deposition for capacitor dielectrics |
US6507063B2 (en) * | 2000-04-17 | 2003-01-14 | International Business Machines Corporation | Poly-poly/MOS capacitor having a gate encapsulating first electrode layer |
-
2000
- 2000-12-21 US US09/745,361 patent/US6440811B1/en not_active Expired - Lifetime
-
2001
- 2001-09-24 AT AT01308085T patent/ATE331299T1/de not_active IP Right Cessation
- 2001-09-24 EP EP01308085A patent/EP1225628B1/en not_active Expired - Lifetime
- 2001-09-24 DE DE60120897T patent/DE60120897T2/de not_active Expired - Lifetime
- 2001-12-04 JP JP2001369481A patent/JP3782962B2/ja not_active Expired - Fee Related
- 2001-12-11 KR KR10-2001-0078343A patent/KR100407538B1/ko not_active IP Right Cessation
- 2001-12-13 SG SG200107801A patent/SG96266A1/en unknown
- 2001-12-14 TW TW090131170A patent/TW543155B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE60120897T2 (de) | 2006-12-21 |
DE60120897D1 (de) | 2006-08-03 |
JP2002237541A (ja) | 2002-08-23 |
ATE331299T1 (de) | 2006-07-15 |
EP1225628A2 (en) | 2002-07-24 |
TW543155B (en) | 2003-07-21 |
US6440811B1 (en) | 2002-08-27 |
KR20020050702A (ko) | 2002-06-27 |
KR100407538B1 (ko) | 2003-11-28 |
JP3782962B2 (ja) | 2006-06-07 |
EP1225628B1 (en) | 2006-06-21 |
EP1225628A3 (en) | 2004-11-10 |
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