SG93234A1 - Improved semiconductor manufacturing system - Google Patents

Improved semiconductor manufacturing system

Info

Publication number
SG93234A1
SG93234A1 SG200001829A SG200001829A SG93234A1 SG 93234 A1 SG93234 A1 SG 93234A1 SG 200001829 A SG200001829 A SG 200001829A SG 200001829 A SG200001829 A SG 200001829A SG 93234 A1 SG93234 A1 SG 93234A1
Authority
SG
Singapore
Prior art keywords
processing stations
manufacturing system
processing
semiconductor manufacturing
tunnel
Prior art date
Application number
SG200001829A
Other languages
English (en)
Inventor
Pan Yang
Original Assignee
Chartered Semiconductor Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chartered Semiconductor Mfg filed Critical Chartered Semiconductor Mfg
Publication of SG93234A1 publication Critical patent/SG93234A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67733—Overhead conveying
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Glass Compositions (AREA)
  • Noodles (AREA)
  • Superconductor Devices And Manufacturing Methods Thereof (AREA)
  • Ventilation (AREA)
SG200001829A 1999-11-01 2000-03-30 Improved semiconductor manufacturing system SG93234A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/431,151 US6354781B1 (en) 1999-11-01 1999-11-01 Semiconductor manufacturing system

Publications (1)

Publication Number Publication Date
SG93234A1 true SG93234A1 (en) 2002-12-17

Family

ID=23710706

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200001829A SG93234A1 (en) 1999-11-01 2000-03-30 Improved semiconductor manufacturing system

Country Status (6)

Country Link
US (1) US6354781B1 (ja)
EP (1) EP1096550B1 (ja)
JP (1) JP2001144160A (ja)
AT (1) ATE381776T1 (ja)
DE (1) DE60037492T2 (ja)
SG (1) SG93234A1 (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000051921A1 (en) 1999-03-05 2000-09-08 Pri Automation, Inc. Material handling and transport system and process
US6491451B1 (en) * 2000-11-03 2002-12-10 Motorola, Inc. Wafer processing equipment and method for processing wafers
CN1996553A (zh) * 2001-08-31 2007-07-11 阿赛斯特技术公司 用于半导体材料处理系统的一体化机架
US6821082B2 (en) * 2001-10-30 2004-11-23 Freescale Semiconductor, Inc. Wafer management system and methods for managing wafers
JP4648190B2 (ja) * 2003-03-28 2011-03-09 平田機工株式会社 基板搬送システム
ATE527690T1 (de) * 2004-08-23 2011-10-15 Murata Machinery Ltd Werkzeuglade- und pufferungssystem auf liftbasis
CN109661366B (zh) 2016-09-09 2022-01-14 宝洁公司 用于独立地引导载具并且将容器和闭合件递送到单元操作站的系统和方法
EP3509954B1 (en) 2016-09-09 2021-10-20 The Procter & Gamble Company System and method for simultaneously filling containers with different fluent compositions
EP3509972B1 (en) 2016-09-09 2023-11-15 The Procter & Gamble Company Track system for creating finished products
EP3510457A1 (en) 2016-09-09 2019-07-17 The Procter and Gamble Company Methods for simultaneously producing different products on a single production line
CN109661624B (zh) 2016-09-09 2022-10-25 宝洁公司 用于独立地引导装载容器的载具以创建不同成品的系统和方法
US10221017B2 (en) 2016-09-09 2019-03-05 The Procter & Gamble Company Vacuum holder with extensible skirt gasket
US10558201B2 (en) 2016-09-09 2020-02-11 The Procter & Gamble Company System and method for producing products based upon demand
EP3509953A1 (en) 2016-09-09 2019-07-17 The Procter and Gamble Company System and method for simultaneously filling containers of different shapes and/or sizes

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6280134B1 (en) * 1997-06-17 2001-08-28 Applied Materials, Inc. Apparatus and method for automated cassette handling

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US3845286A (en) 1973-02-05 1974-10-29 Ibm Manufacturing control system for processing workpieces
US4540326A (en) 1982-09-17 1985-09-10 Nacom Industries, Inc. Semiconductor wafer transport system
US4682927A (en) * 1982-09-17 1987-07-28 Nacom Industries, Incorporated Conveyor system
JPS6162739A (ja) * 1984-09-03 1986-03-31 Sanki Eng Co Ltd クリ−ントンネル
US4826360A (en) * 1986-03-10 1989-05-02 Shimizu Construction Co., Ltd. Transfer system in a clean room
US5536128A (en) 1988-10-21 1996-07-16 Hitachi, Ltd. Method and apparatus for carrying a variety of products
JP2565786B2 (ja) * 1990-03-09 1996-12-18 三菱電機株式会社 自動搬送装置及び方法
US5058491A (en) 1990-08-27 1991-10-22 Taiwan Semiconductor Manufacturing Company, Ltd. Building and method for manufacture of integrated circuits
US5401212A (en) 1990-08-29 1995-03-28 Intelligent Enclosures Corporation Environmental control system
US5169272A (en) 1990-11-01 1992-12-08 Asyst Technologies, Inc. Method and apparatus for transferring articles between two controlled environments
US5399531A (en) 1990-12-17 1995-03-21 United Micrpelectronics Corporation Single semiconductor wafer transfer method and plural processing station manufacturing system
JP2873761B2 (ja) * 1992-01-10 1999-03-24 東京エレクトロン株式会社 半導体製造装置
FR2697003B1 (fr) * 1992-10-16 1994-11-18 Commissariat Energie Atomique Système de manipulation et de confinement d'objets plats dans des boîtes individuelles.
DE4210960C2 (de) 1992-04-02 1994-03-31 Ibm Reinrauminsel und Verfahren zur reinraumgerechten Handhabung von in Behältern gelagerten Gegenständen
JP3544208B2 (ja) 1992-07-07 2004-07-21 株式会社荏原製作所 磁気浮上搬送装置
JPH06104326A (ja) * 1992-09-18 1994-04-15 Tokyo Electron Ltd 処理システム
US5417537A (en) * 1993-05-07 1995-05-23 Miller; Kenneth C. Wafer transport device
US5544421A (en) 1994-04-28 1996-08-13 Semitool, Inc. Semiconductor wafer processing system
JPH09321120A (ja) * 1996-03-04 1997-12-12 Applied Materials Inc 半導体加工部材を処理するシステムおよび方法
US5810062A (en) 1996-07-12 1998-09-22 Asyst Technologies, Inc. Two stage valve for charging and/or vacuum relief of pods
JPH1070055A (ja) * 1996-08-28 1998-03-10 Sony Corp 半導体装置生産用クリーンルーム
US5957648A (en) * 1996-12-11 1999-09-28 Applied Materials, Inc. Factory automation apparatus and method for handling, moving and storing semiconductor wafer carriers
US5964561A (en) 1996-12-11 1999-10-12 Applied Materials, Inc. Compact apparatus and method for storing and loading semiconductor wafer carriers
DE19737839C2 (de) 1997-08-29 2001-03-08 Siemens Ag Transportsystem
US6183358B1 (en) * 1997-11-17 2001-02-06 Texas Instruments Incorporated Isolated multilevel fabricating facility with two way clean tunnel transport system with each tool having adjacent support skid

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6280134B1 (en) * 1997-06-17 2001-08-28 Applied Materials, Inc. Apparatus and method for automated cassette handling

Also Published As

Publication number Publication date
EP1096550A1 (en) 2001-05-02
US6354781B1 (en) 2002-03-12
JP2001144160A (ja) 2001-05-25
EP1096550B1 (en) 2007-12-19
DE60037492T2 (de) 2008-05-21
DE60037492D1 (de) 2008-01-31
ATE381776T1 (de) 2008-01-15

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