SG91266A1 - A method of manufacturing a semiconductor device - Google Patents

A method of manufacturing a semiconductor device

Info

Publication number
SG91266A1
SG91266A1 SG200001613A SG200001613A SG91266A1 SG 91266 A1 SG91266 A1 SG 91266A1 SG 200001613 A SG200001613 A SG 200001613A SG 200001613 A SG200001613 A SG 200001613A SG 91266 A1 SG91266 A1 SG 91266A1
Authority
SG
Singapore
Prior art keywords
manufacturing
semiconductor device
semiconductor
Prior art date
Application number
SG200001613A
Inventor
Miyamoto Toshio
Tanaka Hideki
Nishimura Asao
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of SG91266A1 publication Critical patent/SG91266A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H01L2224/0237—Disposition of the redistribution layers
    • H01L2224/02379—Fan-out arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/03—Manufacturing methods
    • H01L2224/039—Methods of manufacturing bonding areas involving a specific sequence of method steps
    • H01L2224/0392—Methods of manufacturing bonding areas involving a specific sequence of method steps specifically adapted to include a probing step
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
SG200001613A 1999-04-08 2000-03-21 A method of manufacturing a semiconductor device SG91266A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11101346A JP2000294607A (en) 1999-04-08 1999-04-08 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
SG91266A1 true SG91266A1 (en) 2002-09-17

Family

ID=14298286

Family Applications (2)

Application Number Title Priority Date Filing Date
SG200303598A SG105578A1 (en) 1999-04-08 2000-03-21 A method of manufacturing a semiconductor device
SG200001613A SG91266A1 (en) 1999-04-08 2000-03-21 A method of manufacturing a semiconductor device

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG200303598A SG105578A1 (en) 1999-04-08 2000-03-21 A method of manufacturing a semiconductor device

Country Status (5)

Country Link
JP (1) JP2000294607A (en)
KR (1) KR100590639B1 (en)
CN (1) CN1161832C (en)
SG (2) SG105578A1 (en)
TW (1) TW497189B (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002164264A (en) * 2000-11-27 2002-06-07 Shin Etsu Handotai Co Ltd Soft laser marking method and apparatus
JP4330821B2 (en) * 2001-07-04 2009-09-16 株式会社東芝 Manufacturing method of semiconductor device
US20050009298A1 (en) * 2001-09-20 2005-01-13 Shuichi Suzuki Method for manufacturing semiconductor device
KR100445974B1 (en) * 2001-12-01 2004-08-25 주식회사 이오테크닉스 Method and apparatus for calibrating the marking position with chip-scale marker
JP4260405B2 (en) 2002-02-08 2009-04-30 株式会社ルネサステクノロジ Manufacturing method of semiconductor integrated circuit device
JP3759909B2 (en) 2002-02-22 2006-03-29 松下電器産業株式会社 Semiconductor device and manufacturing method thereof
JP4537702B2 (en) 2003-12-26 2010-09-08 ルネサスエレクトロニクス株式会社 Semiconductor device and manufacturing method thereof
JP2005203696A (en) * 2004-01-19 2005-07-28 Casio Micronics Co Ltd Semiconductor device, apparatus for manufacturing the same, and marking method thereof
US8247773B2 (en) 2007-06-26 2012-08-21 Yamaha Corporation Method and apparatus for reading identification mark on surface of wafer
CN101807511B (en) * 2009-02-13 2012-03-28 万国半导体股份有限公司 method for horizontal chip-level package of laser marking wafer
US8604600B2 (en) * 2011-12-30 2013-12-10 Deca Technologies Inc. Fully molded fan-out
CN102385028B (en) * 2010-09-01 2014-01-22 无锡华润上华半导体有限公司 Defect point locating method of semiconductor device
CN102097414B (en) * 2010-11-24 2013-03-27 日月光半导体制造股份有限公司 Semiconductor device with marked conduction columns
JP5733791B2 (en) * 2011-03-18 2015-06-10 日本電波工業株式会社 Piezoelectric device and manufacturing method thereof
CN105097481A (en) * 2014-04-24 2015-11-25 中芯国际集成电路制造(上海)有限公司 Packaging method of semiconductor device
CN105304585A (en) * 2015-10-23 2016-02-03 宁波芯健半导体有限公司 Chip packaging structure with insulation protection on side wall and back surface and method
CN106653955B (en) * 2015-11-02 2019-02-01 上海博恩世通光电股份有限公司 A kind of identification chip and preparation method thereof
US10600748B2 (en) 2016-06-20 2020-03-24 Samsung Electronics Co., Ltd. Fan-out semiconductor package
CN111095479B (en) * 2017-09-20 2023-10-03 三菱电机株式会社 Semiconductor device and method for manufacturing semiconductor device
CN107749395B (en) * 2017-10-30 2020-06-26 武汉新芯集成电路制造有限公司 Wafer marking method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4510673A (en) * 1983-06-23 1985-04-16 International Business Machines Corporation Laser written chip identification method
US5843831A (en) * 1997-01-13 1998-12-01 Taiwan Semiconductor Manufacturing Company, Ltd. Process independent alignment system

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56169344A (en) * 1980-05-30 1981-12-26 Citizen Watch Co Ltd Manufacture of ic
JPH1140522A (en) * 1997-07-17 1999-02-12 Rohm Co Ltd Semiconductor wafer and manufacture thereof, semiconductor chip and manufacture thereof, and ic card with the semiconductor chip
JP3065309B1 (en) * 1999-03-11 2000-07-17 沖電気工業株式会社 Method for manufacturing semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4510673A (en) * 1983-06-23 1985-04-16 International Business Machines Corporation Laser written chip identification method
US5843831A (en) * 1997-01-13 1998-12-01 Taiwan Semiconductor Manufacturing Company, Ltd. Process independent alignment system

Also Published As

Publication number Publication date
KR20010014700A (en) 2001-02-26
SG105578A1 (en) 2004-08-27
CN1161832C (en) 2004-08-11
KR100590639B1 (en) 2006-06-19
JP2000294607A (en) 2000-10-20
TW497189B (en) 2002-08-01
CN1270416A (en) 2000-10-18

Similar Documents

Publication Publication Date Title
GB9907184D0 (en) A method of manufacturing a semiconductor device
GB0203784D0 (en) Method of manufacturing a semiconductor device
SG103846A1 (en) A method of manufacturing a semiconductor device
IL181060A0 (en) Method for manufacturing a semiconductor device
SG85171A1 (en) Method of manufacturing semiconductor device
SG84609A1 (en) Method for forming a semiconductor device
GB0024398D0 (en) Methods of manufacturing semiconductor devices
SG91266A1 (en) A method of manufacturing a semiconductor device
SG114530A1 (en) Method of manufacturing a semiconductor device
EP1120822A4 (en) Method of manufacturing semiconductor device
GB9929614D0 (en) Method of manufacturing a transistor
SG114529A1 (en) Method of manufacturing a semiconductor device
GB2334621B (en) Method of manufacturing semiconductor device
GB2374458B (en) Method of manufacturing a semiconductor device
GB2344436B (en) Method of manufacture of a semiconductor device
GB2331594B (en) A method of manufacturing a semiconductor device
SG78391A1 (en) Semiconductor device manufacturing method
GB2344218B (en) Method of manufacturing a semiconductor device
GB9909490D0 (en) Method of fabricating a semiconductor device
GB2365211B (en) Method of manufacturing capacitor of semiconductor device
GB2348540B (en) Manufacturing method of semiconductor device
GB2344460B (en) Method of manufacturing a semiconductor device
GB9704055D0 (en) Method of manufacturing a semiconductor device
GB0025595D0 (en) Semiconductor device manufacturing method
GB2358286B (en) Method for fabricating a semiconductor device