GB0025595D0 - Semiconductor device manufacturing method - Google Patents
Semiconductor device manufacturing methodInfo
- Publication number
- GB0025595D0 GB0025595D0 GB0025595A GB0025595A GB0025595D0 GB 0025595 D0 GB0025595 D0 GB 0025595D0 GB 0025595 A GB0025595 A GB 0025595A GB 0025595 A GB0025595 A GB 0025595A GB 0025595 D0 GB0025595 D0 GB 0025595D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- semiconductor device
- device manufacturing
- manufacturing
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
- H01L21/76232—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials of trenches having a shape other than rectangular or V-shape, e.g. rounded corners, oblique or rounded trench walls
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Element Separation (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29748099A JP2001118921A (en) | 1999-10-19 | 1999-10-19 | Method for manufacturing semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
GB0025595D0 true GB0025595D0 (en) | 2000-12-06 |
GB2361582A GB2361582A (en) | 2001-10-24 |
Family
ID=17847055
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0025595A Withdrawn GB2361582A (en) | 1999-10-19 | 2000-10-18 | Semiconductor device manufactoring method |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2001118921A (en) |
GB (1) | GB2361582A (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100426487B1 (en) * | 2001-12-28 | 2004-04-14 | 주식회사 하이닉스반도체 | Method of forming a floating gate in flash memory device |
JP2003243662A (en) * | 2002-02-14 | 2003-08-29 | Mitsubishi Electric Corp | Semiconductor device and method of manufacturing the same, and semiconductor wafer |
US7101785B2 (en) * | 2003-07-22 | 2006-09-05 | Infineon Technologies Ag | Formation of a contact in a device, and the device including the contact |
US7393738B1 (en) | 2007-01-16 | 2008-07-01 | International Business Machines Corporation | Subground rule STI fill for hot structure |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10214888A (en) * | 1997-01-30 | 1998-08-11 | Nec Yamagata Ltd | Manufacture of semiconductor device |
US5786262A (en) * | 1997-04-09 | 1998-07-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Self-planarized gapfilling for shallow trench isolation |
US6180490B1 (en) * | 1999-05-25 | 2001-01-30 | Chartered Semiconductor Manufacturing Ltd. | Method of filling shallow trenches |
-
1999
- 1999-10-19 JP JP29748099A patent/JP2001118921A/en active Pending
-
2000
- 2000-10-18 GB GB0025595A patent/GB2361582A/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
GB2361582A (en) | 2001-10-24 |
JP2001118921A (en) | 2001-04-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB2353404B (en) | Semiconductor device and method for manufacturing the same | |
SG106591A1 (en) | Semiconductor wafer dividing method | |
SG100696A1 (en) | Semiconductor device and method for manufacturing same | |
EP1164595A4 (en) | Semiconductor device | |
SG97903A1 (en) | Semiconductor device | |
EP1146555A4 (en) | Semiconductor device and production method therefor | |
SG85171A1 (en) | Method of manufacturing semiconductor device | |
HK1037425A1 (en) | Method for manufacturing semiconductor device. | |
TW576544U (en) | Semiconductor device | |
GB0000106D0 (en) | Semiconductor device | |
GB9907184D0 (en) | A method of manufacturing a semiconductor device | |
EP1179851A4 (en) | Semiconductor device | |
GB2364825B (en) | Method for fabricating semiconductor device capacitors | |
SG91266A1 (en) | A method of manufacturing a semiconductor device | |
GB9927693D0 (en) | Semiconductor device production method | |
GB2347014B (en) | Semiconductor device | |
GB2356489B (en) | Semiconductor device | |
SG78391A1 (en) | Semiconductor device manufacturing method | |
EP1229591A4 (en) | Semiconductor device | |
GB2368456B (en) | Semiconductor device and method for manufacturing the same | |
EP1220071A4 (en) | Semiconductor device | |
HK1047655A1 (en) | Semiconductor and manufacturing method for semiconductor | |
EP1191582A4 (en) | Production method for semiconductor device | |
EP1170784A4 (en) | Semiconductor device and its production method | |
GB2336243B (en) | Method for manufacturing semiconductor device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |