SG86988A1 - Resin molding machine - Google Patents

Resin molding machine

Info

Publication number
SG86988A1
SG86988A1 SG9611535A SG1996011535A SG86988A1 SG 86988 A1 SG86988 A1 SG 86988A1 SG 9611535 A SG9611535 A SG 9611535A SG 1996011535 A SG1996011535 A SG 1996011535A SG 86988 A1 SG86988 A1 SG 86988A1
Authority
SG
Singapore
Prior art keywords
molding machine
resin molding
resin
machine
molding
Prior art date
Application number
SG9611535A
Other languages
English (en)
Inventor
Oya Hidetoshi
Hirano Junji
Yanagisawa Makoto
Original Assignee
Apic Yamada Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP7316396A external-priority patent/JPH09155910A/ja
Priority claimed from JP7316409A external-priority patent/JPH09155911A/ja
Application filed by Apic Yamada Corp filed Critical Apic Yamada Corp
Publication of SG86988A1 publication Critical patent/SG86988A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B29C45/021—Plunger drives; Pressure equalizing means for a plurality of transfer plungers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/03—Injection moulding apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
SG9611535A 1995-12-05 1996-12-05 Resin molding machine SG86988A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP7316396A JPH09155910A (ja) 1995-12-05 1995-12-05 電動プレス機構を用いた樹脂モールド装置
JP7316409A JPH09155911A (ja) 1995-12-05 1995-12-05 樹脂モールド装置の等圧ユニット交換構造

Publications (1)

Publication Number Publication Date
SG86988A1 true SG86988A1 (en) 2002-03-19

Family

ID=26568640

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9611535A SG86988A1 (en) 1995-12-05 1996-12-05 Resin molding machine

Country Status (3)

Country Link
EP (1) EP0778116B1 (ko)
KR (1) KR100195848B1 (ko)
SG (1) SG86988A1 (ko)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0633111A2 (en) * 1989-11-24 1995-01-11 Fico B.V. Single-strip moulding apparatus with movable mould halves
US5413471A (en) * 1992-05-12 1995-05-09 Mitsubishi Denki Kabushiki Kaisha Resin-sealing apparatus including a gas spring

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4755124A (en) * 1985-02-13 1988-07-05 Mitsubishi Denki Kabushiki Kaisha Plastic molding device for a semiconductor element
US4793785A (en) * 1986-04-11 1988-12-27 Michio Osada Apparatus of multiplunger type for enclosing semiconductor elements with resin
JPH0622346Y2 (ja) 1987-09-14 1994-06-15 松下電工株式会社 エアーマット
JPH0422975Y2 (ko) 1987-09-17 1992-05-27
JPH05261753A (ja) * 1992-03-19 1993-10-12 Matsushita Electric Ind Co Ltd マルチプランジャー式樹脂射出機構とその樹脂タブレット挿入ミス検出方法及び射出成形圧力制御方法
JPH05285978A (ja) * 1992-04-15 1993-11-02 Apic Yamada Kk 樹脂モールド装置
JP2591082Y2 (ja) 1992-04-20 1999-02-24 日本電気精器株式会社 可動式受座装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0633111A2 (en) * 1989-11-24 1995-01-11 Fico B.V. Single-strip moulding apparatus with movable mould halves
US5413471A (en) * 1992-05-12 1995-05-09 Mitsubishi Denki Kabushiki Kaisha Resin-sealing apparatus including a gas spring

Also Published As

Publication number Publication date
KR100195848B1 (ko) 1999-06-15
EP0778116A1 (en) 1997-06-11
KR970033708A (ko) 1997-07-22
EP0778116B1 (en) 2002-04-03

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