JPH0422975Y2 - - Google Patents
Info
- Publication number
- JPH0422975Y2 JPH0422975Y2 JP1987142770U JP14277087U JPH0422975Y2 JP H0422975 Y2 JPH0422975 Y2 JP H0422975Y2 JP 1987142770 U JP1987142770 U JP 1987142770U JP 14277087 U JP14277087 U JP 14277087U JP H0422975 Y2 JPH0422975 Y2 JP H0422975Y2
- Authority
- JP
- Japan
- Prior art keywords
- plunger
- resin material
- resin
- mold
- servo motor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 89
- 239000011347 resin Substances 0.000 claims description 89
- 239000000463 material Substances 0.000 claims description 54
- 230000007246 mechanism Effects 0.000 claims description 52
- 239000004065 semiconductor Substances 0.000 claims description 24
- 238000007789 sealing Methods 0.000 claims description 16
- 238000003825 pressing Methods 0.000 claims description 15
- 238000001514 detection method Methods 0.000 claims description 13
- 238000000465 moulding Methods 0.000 description 25
- 238000002347 injection Methods 0.000 description 24
- 239000007924 injection Substances 0.000 description 24
- 238000000034 method Methods 0.000 description 14
- 238000005538 encapsulation Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 4
- 238000001879 gelation Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987142770U JPH0422975Y2 (ko) | 1987-09-17 | 1987-09-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987142770U JPH0422975Y2 (ko) | 1987-09-17 | 1987-09-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6446208U JPS6446208U (ko) | 1989-03-22 |
JPH0422975Y2 true JPH0422975Y2 (ko) | 1992-05-27 |
Family
ID=31408998
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987142770U Expired JPH0422975Y2 (ko) | 1987-09-17 | 1987-09-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0422975Y2 (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0736726Y2 (ja) * | 1989-12-15 | 1995-08-23 | 三菱マテリアル株式会社 | トランスファー成形機 |
EP0778116B1 (en) | 1995-12-05 | 2002-04-03 | Apic Yamada Corporation | Resin molding machine |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61185943A (ja) * | 1985-02-13 | 1986-08-19 | Mitsubishi Electric Corp | 半導体素子用樹脂封止装置 |
JPS6244417A (ja) * | 1985-08-23 | 1987-02-26 | Toyoda Autom Loom Works Ltd | 射出成形機のスクリュ−推力制御方法 |
JPS6278839A (ja) * | 1985-09-30 | 1987-04-11 | Mitsubishi Electric Corp | 半導体素子用樹脂封止装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS647040Y2 (ko) * | 1981-05-18 | 1989-02-23 | ||
JPS61148610U (ko) * | 1985-03-08 | 1986-09-13 |
-
1987
- 1987-09-17 JP JP1987142770U patent/JPH0422975Y2/ja not_active Expired
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61185943A (ja) * | 1985-02-13 | 1986-08-19 | Mitsubishi Electric Corp | 半導体素子用樹脂封止装置 |
JPS6244417A (ja) * | 1985-08-23 | 1987-02-26 | Toyoda Autom Loom Works Ltd | 射出成形機のスクリュ−推力制御方法 |
JPS6278839A (ja) * | 1985-09-30 | 1987-04-11 | Mitsubishi Electric Corp | 半導体素子用樹脂封止装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS6446208U (ko) | 1989-03-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4950144A (en) | Nozzle touch apparatus in an injection molding machine | |
US5297897A (en) | Single-strip molding apparatus | |
US3278992A (en) | Molding apparatus | |
EP0633111A2 (en) | Single-strip moulding apparatus with movable mould halves | |
JPH0523575B2 (ko) | ||
JPH0422975Y2 (ko) | ||
JP2001047458A (ja) | 樹脂封止装置 | |
JPH0422976Y2 (ko) | ||
KR100645898B1 (ko) | 틀니제작용 레진주입장치 | |
JP2630451B2 (ja) | 電子部品の樹脂封止成形方法及び装置 | |
US5328347A (en) | Device for introducing a plastic material into a mould cavity | |
JPH0622831B2 (ja) | 射出圧縮成形方法 | |
JP3144699B2 (ja) | 樹脂モールド製品の樹脂モールド方法及び樹脂モールド装置 | |
JPH0474169B2 (ko) | ||
JP4443373B2 (ja) | 射出成形機 | |
JP4240450B2 (ja) | 射出成形機の制御方法 | |
CN218701021U (zh) | 一种液压隐形义齿压铸机 | |
JPH0446214B2 (ko) | ||
JP3090884B2 (ja) | 竪型射出装置 | |
JP2004014936A (ja) | 封止成形装置 | |
JP2601647Y2 (ja) | 竪形射出成形機 | |
JPH0435144Y2 (ko) | ||
JPH11150140A (ja) | 樹脂封止方法及びこれに使用する樹脂封止金型装置 | |
JPH08332655A (ja) | インモールドコーティング成形方法および装置 | |
JP4391383B2 (ja) | 縦型射出成形機 |