SG85143A1 - Polybenzoxazole resin and precursor thereof - Google Patents

Polybenzoxazole resin and precursor thereof

Info

Publication number
SG85143A1
SG85143A1 SG9905361A SG1999005361A SG85143A1 SG 85143 A1 SG85143 A1 SG 85143A1 SG 9905361 A SG9905361 A SG 9905361A SG 1999005361 A SG1999005361 A SG 1999005361A SG 85143 A1 SG85143 A1 SG 85143A1
Authority
SG
Singapore
Prior art keywords
precursor
polybenzoxazole resin
polybenzoxazole
resin
Prior art date
Application number
SG9905361A
Other languages
English (en)
Inventor
Tada Masahiro
Murayama Mitsumoto
Hatao Takuya
Yamaji Takashi
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of SG85143A1 publication Critical patent/SG85143A1/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/22Polybenzoxazoles
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0046Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/022Quinonediazides
    • G03F7/023Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0346Organic insulating material consisting of one material containing N
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/285Permanent coating compositions
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4644Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676Single layer compositions

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
SG9905361A 1998-10-28 1999-10-28 Polybenzoxazole resin and precursor thereof SG85143A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10306727A JP2000128984A (ja) 1998-10-28 1998-10-28 ポリベンゾオキサゾール前駆体及び樹脂

Publications (1)

Publication Number Publication Date
SG85143A1 true SG85143A1 (en) 2001-12-19

Family

ID=17960577

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9905361A SG85143A1 (en) 1998-10-28 1999-10-28 Polybenzoxazole resin and precursor thereof

Country Status (8)

Country Link
US (1) US6114497A (zh)
EP (1) EP0997488B1 (zh)
JP (1) JP2000128984A (zh)
KR (1) KR100580907B1 (zh)
CN (1) CN1123590C (zh)
DE (1) DE69916742D1 (zh)
MY (1) MY114858A (zh)
SG (1) SG85143A1 (zh)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6297351B1 (en) * 1998-12-17 2001-10-02 Sumitomo Bakelite Company Limited Polybenzoxazole resin and precursor thereof
DE10228769A1 (de) 2002-06-27 2004-02-05 Infineon Technologies Ag Isoliermaterial für Aluminium und Kupfermetallisierungen
KR101199664B1 (ko) * 2004-12-28 2012-11-08 스미토모 베이클리트 컴퍼니 리미티드 벤조옥사졸 수지 전구체, 폴리벤조옥사졸 수지, 수지막 및반도체 장치
US8536299B2 (en) * 2008-12-08 2013-09-17 University Of Dayton Rigid-rod copolymer compositions and the polymeric fibers fabricated from those compositions for enhanced flame resistance
CN102250117B (zh) * 2011-05-11 2013-07-24 华东理工大学 一种含噁唑环的双苯并噁嗪及其制备方法
ES2928164T3 (es) 2015-10-19 2022-11-15 Incyte Corp Compuestos heterocíclicos como inmunomoduladores
TWI763641B (zh) 2015-11-19 2022-05-11 美商英塞特公司 作為免疫調節劑之雜環化合物
KR20180100585A (ko) 2015-12-22 2018-09-11 인사이트 코포레이션 면역조절제로서의 헤테로사이클릭 화합물
MA44860A (fr) 2016-05-06 2019-03-13 Incyte Holdings Corp Composés hétérocycliques utilisés comme immunomodulateurs
US20170342060A1 (en) 2016-05-26 2017-11-30 Incyte Corporation Heterocyclic compounds as immunomodulators
MD3472167T2 (ro) 2016-06-20 2023-02-28 Incyte Corp Compuși heterociclici ca imunomodulatori
US20180016260A1 (en) 2016-07-14 2018-01-18 Incyte Corporation Heterocyclic compounds as immunomodulators
EP3504198B1 (en) 2016-08-29 2023-01-25 Incyte Corporation Heterocyclic compounds as immunomodulators
ES2874756T3 (es) 2016-12-22 2021-11-05 Incyte Corp Derivados de triazolo[1,5-A]piridina como inmunomoduladores
MY197635A (en) 2016-12-22 2023-06-29 Incyte Corp Benzooxazole derivatives as immunomodulators
CR20190317A (es) 2016-12-22 2019-09-13 Incyte Corp Compuestos inmunomodulares y métodos de uso
EP3558973B1 (en) 2016-12-22 2021-09-15 Incyte Corporation Pyridine derivatives as immunomodulators
HUE061258T2 (hu) 2018-03-30 2023-05-28 Incyte Corp Heterociklusos vegyületek mint immunmodulátorok
CR20200614A (es) 2018-05-11 2021-04-27 Incyte Corp Compuestos heterocíclicos como inmunomoduladores
CN110305332B (zh) * 2019-07-03 2022-01-28 华东理工大学 复合封装材料及其制备方法和复合薄膜
AR119624A1 (es) 2019-08-09 2021-12-29 Incyte Corp Sales de un inhibidor de pd-1 / pd-l1
CR20220190A (es) 2019-09-30 2022-06-15 Incyte Corp Compuestos de pirido [3,2-d] primidina como inmunomoduladores
KR20220101664A (ko) 2019-11-11 2022-07-19 인사이트 코포레이션 Pd-1/pd-l1 억제제의 염 및 결정질 형태
TW202233615A (zh) 2020-11-06 2022-09-01 美商英塞特公司 Pd—1/pd—l1抑制劑之結晶形式
US11780836B2 (en) 2020-11-06 2023-10-10 Incyte Corporation Process of preparing a PD-1/PD-L1 inhibitor
IL302590A (en) 2020-11-06 2023-07-01 Incyte Corp Process for preparing PD-1/PD-L1 inhibitor and salts and crystalline forms thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2188936A (en) * 1986-03-06 1987-10-14 Central Glass Co Ltd Aromatic polyamides and polybenzoxazoles having diphenylhexafluoropropane units
JPH03221527A (ja) * 1990-01-29 1991-09-30 Oki Electric Ind Co Ltd 圧電子保護膜
JPH0643464A (ja) * 1992-07-24 1994-02-18 Hitachi Chem Co Ltd 液晶配向膜、これを有する液晶挟持基板及び液晶表示素子並びに液晶配向膜用材料

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0755984B2 (ja) * 1986-06-20 1995-06-14 セントラル硝子株式会社 芳香族ポリアミドの製造方法
JPS62207332A (ja) * 1986-03-06 1987-09-11 Central Glass Co Ltd ポリベンズオキサゾ−ル及びその製造方法
US5021320A (en) * 1986-10-02 1991-06-04 Hoechst Celanese Corporation Polyamide containing the hexafluoroisopropylidene group with O-quinone diazide in positive working photoresist
DE3773110D1 (de) * 1986-10-02 1991-10-24 Hoechst Celanese Corp Polyamide mit hexafluorisopropyliden-gruppen, diese enthaltende positiv arbeitende lichtempfindliche gemische und damit hergestellte aufzeichnungsmaterialien.
DE69131529T2 (de) * 1990-05-29 2000-01-20 Sumitomo Bakelite Co Positiv arbeitende lichtempfindliche Harzzusammensetzung
US5145999A (en) * 1991-04-04 1992-09-08 E. I. Du Pont De Nemours And Company Perfluoroalkylated amines, and polymers made therefrom
US5492996A (en) * 1995-02-21 1996-02-20 The United States Of America As Represented By The Secretary Of The Air Force Alcohol soluble benzazole polymers
US5493005A (en) * 1995-02-21 1996-02-20 The United States Of America As Represented By The Secretary Of The Air Force Hydroxy-pendent benzoxazole copolymers
US5498784A (en) * 1995-02-21 1996-03-12 The United States Of America As Represented By The Secretary Of The Air Force Phosphonic acid-pendent benzoxazole copolymers

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2188936A (en) * 1986-03-06 1987-10-14 Central Glass Co Ltd Aromatic polyamides and polybenzoxazoles having diphenylhexafluoropropane units
JPH03221527A (ja) * 1990-01-29 1991-09-30 Oki Electric Ind Co Ltd 圧電子保護膜
JPH0643464A (ja) * 1992-07-24 1994-02-18 Hitachi Chem Co Ltd 液晶配向膜、これを有する液晶挟持基板及び液晶表示素子並びに液晶配向膜用材料

Also Published As

Publication number Publication date
CN1123590C (zh) 2003-10-08
KR100580907B1 (ko) 2006-05-17
EP0997488A1 (en) 2000-05-03
KR20000029334A (ko) 2000-05-25
MY114858A (en) 2003-01-31
DE69916742D1 (de) 2004-06-03
US6114497A (en) 2000-09-05
EP0997488B1 (en) 2004-04-28
CN1253961A (zh) 2000-05-24
JP2000128984A (ja) 2000-05-09

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