SG81225A1 - Conductive feedthrough for ceramic body and method of fabricating same - Google Patents

Conductive feedthrough for ceramic body and method of fabricating same

Info

Publication number
SG81225A1
SG81225A1 SG9800613A SG1998000613A SG81225A1 SG 81225 A1 SG81225 A1 SG 81225A1 SG 9800613 A SG9800613 A SG 9800613A SG 1998000613 A SG1998000613 A SG 1998000613A SG 81225 A1 SG81225 A1 SG 81225A1
Authority
SG
Singapore
Prior art keywords
ceramic body
fabricating same
conductive feedthrough
feedthrough
conductive
Prior art date
Application number
SG9800613A
Other languages
English (en)
Inventor
Burkhart Vince
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG81225A1 publication Critical patent/SG81225A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4857—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6616—Vertical connections, e.g. vias
    • H01L2223/6622—Coaxial feed-throughs in active or passive substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Multi-Conductor Connections (AREA)
SG9800613A 1997-04-01 1998-03-25 Conductive feedthrough for ceramic body and method of fabricating same SG81225A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/834,702 US6255601B1 (en) 1997-04-01 1997-04-01 Conductive feedthrough for a ceramic body and method of fabricating same

Publications (1)

Publication Number Publication Date
SG81225A1 true SG81225A1 (en) 2001-06-19

Family

ID=25267578

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9800613A SG81225A1 (en) 1997-04-01 1998-03-25 Conductive feedthrough for ceramic body and method of fabricating same

Country Status (6)

Country Link
US (1) US6255601B1 (fr)
EP (1) EP0869553A3 (fr)
JP (1) JP4354545B2 (fr)
KR (1) KR19980080902A (fr)
SG (1) SG81225A1 (fr)
TW (1) TW452844B (fr)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6303879B1 (en) * 1997-04-01 2001-10-16 Applied Materials, Inc. Laminated ceramic with multilayer electrodes and method of fabrication
US6267839B1 (en) * 1999-01-12 2001-07-31 Applied Materials, Inc. Electrostatic chuck with improved RF power distribution
JP3980801B2 (ja) * 1999-09-16 2007-09-26 株式会社東芝 三次元構造体およびその製造方法
EP1124256A1 (fr) 1999-11-10 2001-08-16 Ibiden Co., Ltd. Substrat en ceramique
US6603650B1 (en) * 1999-12-09 2003-08-05 Saint-Gobain Ceramics And Plastics, Inc. Electrostatic chuck susceptor and method for fabrication
US6639154B1 (en) * 2000-10-10 2003-10-28 Teradyne, Inc. Apparatus for forming a connection between a circuit board and a connector, having a signal launch
US6747217B1 (en) * 2001-11-20 2004-06-08 Unisys Corporation Alternative to through-hole-plating in a printed circuit board
KR100497953B1 (ko) * 2002-08-05 2005-06-29 한국화학연구원 전도성 세라믹 전극 및 이를 포함하는 정전척
JP4365766B2 (ja) * 2004-10-26 2009-11-18 京セラ株式会社 ウェハ支持部材とそれを用いた半導体製造装置
TW200615916A (en) * 2004-11-15 2006-05-16 Benq Corp Method of selecting recording speed and recorder thereof
JP2008108703A (ja) * 2006-09-28 2008-05-08 Covalent Materials Corp 面状ヒータ及びこのヒータを備えた半導体熱処理装置
WO2009113317A1 (fr) * 2008-03-13 2009-09-17 株式会社ニコン Porte-substrat, unité porte-substrat, appareil de transfert de substrat et appareil de liaison de substrat
JP5423621B2 (ja) * 2010-06-04 2014-02-19 株式会社デンソー 回路基板の端子接続構造
US8704104B2 (en) 2010-07-19 2014-04-22 Asml Netherlands B.V. Electrical connector, electrical connection system and lithographic apparatus
US9276504B2 (en) 2012-03-07 2016-03-01 Ngk Spark Plug Co., Ltd. Carrier device and ceramic member
US9591770B2 (en) 2013-04-26 2017-03-07 Kla-Tencor Corporation Multi-layer ceramic vacuum to atmosphere electric feed through
JP6483533B2 (ja) * 2015-06-03 2019-03-13 京セラ株式会社 試料保持具およびこれを用いたプラズマエッチング装置
US10840056B2 (en) 2017-02-03 2020-11-17 Kla Corporation Multi-column scanning electron microscopy system
EP3583980A1 (fr) * 2018-06-19 2019-12-25 Morgan Advanced Ceramics, Inc. Traversées

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5110654A (en) * 1989-07-17 1992-05-05 Nec Corporation Ceramic multilayer wiring substrate

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB753875A (en) * 1953-03-06 1956-08-01 Blaupunkt Werke Gmbh A method of contacting two dimensional printed electric circuits
US3346689A (en) * 1965-01-29 1967-10-10 Philco Ford Corp Multilayer circuit board suing epoxy cards and silver epoxy connectors
GB1138673A (en) 1967-01-09 1969-01-01 Westinghouse Brake & Signal Improvements relating to semiconductor devices
US4095866A (en) * 1977-05-19 1978-06-20 Ncr Corporation High density printed circuit board and edge connector assembly
US4320438A (en) * 1980-05-15 1982-03-16 Cts Corporation Multi-layer ceramic package
JPS6083356A (ja) 1983-10-14 1985-05-11 Hitachi Ltd 半導体装置
US4665468A (en) 1984-07-10 1987-05-12 Nec Corporation Module having a ceramic multi-layer substrate and a multi-layer circuit thereupon, and process for manufacturing the same
JPH0760849B2 (ja) 1986-06-05 1995-06-28 東陶機器株式会社 静電チャック板
JPH01207992A (ja) * 1988-02-16 1989-08-21 Hitachi Ltd 回路配線板
JPH03163849A (ja) 1990-11-07 1991-07-15 Toshiba Mach Co Ltd 静電チャック
US5136238A (en) * 1990-11-26 1992-08-04 Electro-Fix, Inc. Test fixture with diaphragm board with one or more internal grounded layers
US5191506A (en) 1991-05-02 1993-03-02 International Business Machines Corporation Ceramic electrostatic chuck
US5155652A (en) 1991-05-02 1992-10-13 International Business Machines Corporation Temperature cycling ceramic electrostatic chuck
US5450290A (en) * 1993-02-01 1995-09-12 International Business Machines Corporation Printed circuit board with aligned connections and method of making same
US5557215A (en) * 1993-05-12 1996-09-17 Tokyo Electron Limited Self-bias measuring method, apparatus thereof and electrostatic chucking apparatus
EP0628644B1 (fr) * 1993-05-27 2003-04-02 Applied Materials, Inc. Perfectionnement apportés aux suscepteurs conçus pour être utilisés dans des dispositifs pour le dépôt chimique en phase vapeur
US5886863A (en) * 1995-05-09 1999-03-23 Kyocera Corporation Wafer support member
US5730803A (en) * 1996-02-23 1998-03-24 Applied Materials, Inc. Apparatus and method for transferring heat from a hot electrostatic chuck to an underlying cold body

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5110654A (en) * 1989-07-17 1992-05-05 Nec Corporation Ceramic multilayer wiring substrate

Also Published As

Publication number Publication date
KR19980080902A (ko) 1998-11-25
JPH10326823A (ja) 1998-12-08
EP0869553A2 (fr) 1998-10-07
TW452844B (en) 2001-09-01
JP4354545B2 (ja) 2009-10-28
US6255601B1 (en) 2001-07-03
EP0869553A3 (fr) 1999-04-21

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