GB1138673A - Improvements relating to semiconductor devices - Google Patents

Improvements relating to semiconductor devices

Info

Publication number
GB1138673A
GB1138673A GB109967A GB109967A GB1138673A GB 1138673 A GB1138673 A GB 1138673A GB 109967 A GB109967 A GB 109967A GB 109967 A GB109967 A GB 109967A GB 1138673 A GB1138673 A GB 1138673A
Authority
GB
United Kingdom
Prior art keywords
semi
connector
mass
contact areas
semiconductor devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB109967A
Inventor
Neil Stuart Purdom
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Mobility Ltd
Original Assignee
Westinghouse Brake and Signal Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Brake and Signal Co Ltd filed Critical Westinghouse Brake and Signal Co Ltd
Priority to GB109967A priority Critical patent/GB1138673A/en
Publication of GB1138673A publication Critical patent/GB1138673A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

1,138,673. Semi-conductor device. WESTINGHOUSE BRAKE & SIGNAL CO. Ltd. 17 Nov., 1967 [9 Jan., 1967], No. 1099/67. Heading H1K. A connector of a semi-conductor device 1 comprises a plurality of independent electrically-conductive connections 4 extending through and bonded to a mass of electrically insulating material 5 and emerging at one face to terminate in ends 6, 7, resiliently urged into engagement with contact areas 2, 3, respectively, of the device. The mass 5 is sufficiently flexible to accommodate any discrepancies in relative levels of the faces of the contact areas. The device and its connector are enclosed in an hermetically sealed encapsulating housing and parts 8 and 9 of the connections 4 receive electrical leads which pass through the housing.
GB109967A 1967-01-09 1967-01-09 Improvements relating to semiconductor devices Expired GB1138673A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB109967A GB1138673A (en) 1967-01-09 1967-01-09 Improvements relating to semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB109967A GB1138673A (en) 1967-01-09 1967-01-09 Improvements relating to semiconductor devices

Publications (1)

Publication Number Publication Date
GB1138673A true GB1138673A (en) 1969-01-01

Family

ID=9716145

Family Applications (1)

Application Number Title Priority Date Filing Date
GB109967A Expired GB1138673A (en) 1967-01-09 1967-01-09 Improvements relating to semiconductor devices

Country Status (1)

Country Link
GB (1) GB1138673A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0869553A3 (en) * 1997-04-01 1999-04-21 Applied Materials, Inc. Conductive feedthrough for a ceramic body and method of fabricating same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0869553A3 (en) * 1997-04-01 1999-04-21 Applied Materials, Inc. Conductive feedthrough for a ceramic body and method of fabricating same
US6255601B1 (en) 1997-04-01 2001-07-03 Applied Materials, Inc. Conductive feedthrough for a ceramic body and method of fabricating same

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