GB1230620A - - Google Patents

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Publication number
GB1230620A
GB1230620A GB3587168A GB1230620DA GB1230620A GB 1230620 A GB1230620 A GB 1230620A GB 3587168 A GB3587168 A GB 3587168A GB 1230620D A GB1230620D A GB 1230620DA GB 1230620 A GB1230620 A GB 1230620A
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United Kingdom
Prior art keywords
carrier
semi
conductor
electrically conductive
diode
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Expired
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GB3587168A
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Publication of GB1230620A publication Critical patent/GB1230620A/en
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H01L2924/15155—Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid
    • H01L2924/15157—Top view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Element Separation (AREA)

Abstract

1,230,620. Semi-conductor devices. ASSOCIATED SEMICONDUCTOR MFGS. Ltd. 26 July, 1968, No. 35871/68. Heading H1K. A semi-conductor element 24 is mounted on one surface of an insulating carrier 30 which has mutually insulated electrically conductive films 31, 32, at least on its opposite end faces, these faces being substantially perpendicular to the said one surface of the carrier. The carrier with the element may be sealed in a housing, Fig. 3, not shown, which comprises an insulating member secured between and mutually insulating two electrically conductive portions of the housing which form the terminals of the device, respective connections being made between the end wall films 31 and 32 and the two electrically conductive portions which may be at either end or both at one end of the envelope. Alternatively the carrier may be mounted to make contact with a hybrid integrated circuit by the upstanding parts 37 and 38 of the film. In all arrangements the groove 35 may be filled with a synthetic resin to encapsulate the element 24. The two sections 41, 42 of the conductive films are separated from one another by means of groove 36 or a step (60), Fig. 6, not shown, and in either case the semi-conductor element 24 is mounted directly on one section 42 and contact with the other section 41 made by means of a wire 27. Both wire and conducting layer are of gold, and the carrier is of aluminium oxide. The semi-conductor device may be a PN junction diode, a Schottky diode, a Gunn effect device, a tunnel diode or a varactor diode.
GB3587168A 1968-07-26 1968-07-26 Expired GB1230620A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3587168 1968-07-26

Publications (1)

Publication Number Publication Date
GB1230620A true GB1230620A (en) 1971-05-05

Family

ID=10382481

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3587168A Expired GB1230620A (en) 1968-07-26 1968-07-26

Country Status (6)

Country Link
BE (1) BE736688A (en)
CH (1) CH496321A (en)
DE (1) DE1937638A1 (en)
FR (1) FR2014747A1 (en)
GB (1) GB1230620A (en)
NL (1) NL6911177A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2195825A (en) * 1986-09-22 1988-04-13 Motorola Inc Integrated circuit package

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2967661D1 (en) * 1979-12-18 1987-07-16 Cts Corp Recessed circuit module and method of making
US4649415A (en) * 1985-01-15 1987-03-10 National Semiconductor Corporation Semiconductor package with tape mounted die
FR2758417B1 (en) * 1997-01-16 1999-04-09 Thomson Csf MICROWAVE COMPONENT ENCAPSULATION BOX, AND PROCESS FOR OBTAINING SAME

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2195825A (en) * 1986-09-22 1988-04-13 Motorola Inc Integrated circuit package
GB2195825B (en) * 1986-09-22 1990-01-10 Motorola Inc Integrated circuit package

Also Published As

Publication number Publication date
FR2014747A1 (en) 1970-04-17
NL6911177A (en) 1970-01-29
BE736688A (en) 1970-01-28
CH496321A (en) 1970-09-15
DE1937638A1 (en) 1970-02-05

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