SG80597A1 - Wafer polishing apparatus - Google Patents

Wafer polishing apparatus

Info

Publication number
SG80597A1
SG80597A1 SG9802931A SG1998002931A SG80597A1 SG 80597 A1 SG80597 A1 SG 80597A1 SG 9802931 A SG9802931 A SG 9802931A SG 1998002931 A SG1998002931 A SG 1998002931A SG 80597 A1 SG80597 A1 SG 80597A1
Authority
SG
Singapore
Prior art keywords
polishing apparatus
wafer polishing
wafer
polishing
Prior art date
Application number
SG9802931A
Other languages
English (en)
Inventor
Numoto Minoru
Sakai Kenji
Satoh Manabu
Terashita Hisashi
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of SG80597A1 publication Critical patent/SG80597A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG9802931A 1997-08-11 1998-08-08 Wafer polishing apparatus SG80597A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21670097 1997-08-11

Publications (1)

Publication Number Publication Date
SG80597A1 true SG80597A1 (en) 2001-05-22

Family

ID=16692558

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9802931A SG80597A1 (en) 1997-08-11 1998-08-08 Wafer polishing apparatus

Country Status (7)

Country Link
US (1) US6027398A (de)
EP (1) EP0896858B1 (de)
KR (1) KR100306715B1 (de)
DE (1) DE69820355T2 (de)
MY (1) MY120338A (de)
SG (1) SG80597A1 (de)
TW (1) TW434095B (de)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2973403B2 (ja) * 1998-03-30 1999-11-08 株式会社東京精密 ウェーハ研磨装置
JP2917992B1 (ja) * 1998-04-10 1999-07-12 日本電気株式会社 研磨装置
WO2000045993A1 (fr) * 1999-02-02 2000-08-10 Ebara Corporation Dispositif de maintien et de polissage de plaquette
US6276998B1 (en) 1999-02-25 2001-08-21 Applied Materials, Inc. Padless substrate carrier
US6645050B1 (en) 1999-02-25 2003-11-11 Applied Materials, Inc. Multimode substrate carrier
US6225224B1 (en) * 1999-05-19 2001-05-01 Infineon Technologies Norht America Corp. System for dispensing polishing liquid during chemical mechanical polishing of a semiconductor wafer
AU1352201A (en) * 1999-11-01 2001-05-14 Speed-Fam-Ipec Corporation Closed-loop ultrasonic conditioning control for polishing pads
JP3873557B2 (ja) * 2000-01-07 2007-01-24 株式会社日立製作所 半導体装置の製造方法
US6517422B2 (en) 2000-03-07 2003-02-11 Toshiba Ceramics Co., Ltd. Polishing apparatus and method thereof
US7374477B2 (en) * 2002-02-06 2008-05-20 Applied Materials, Inc. Polishing pads useful for endpoint detection in chemical mechanical polishing
JP3916375B2 (ja) * 2000-06-02 2007-05-16 株式会社荏原製作所 ポリッシング方法および装置
JP2002018709A (ja) * 2000-07-05 2002-01-22 Tokyo Seimitsu Co Ltd ウェーハ研磨装置
US6647579B2 (en) 2000-12-18 2003-11-18 International Business Machines Corp. Brush pressure control system for chemical and mechanical treatment of semiconductor surfaces
US6648979B2 (en) 2001-01-24 2003-11-18 International Business Machines Corporation Apparatus and method for wafer cleaning
KR100772325B1 (ko) * 2001-06-22 2007-10-31 동부일렉트로닉스 주식회사 화학적 기계적 연마장비의 연마 패드 교체방법
JP2004148487A (ja) * 2002-10-11 2004-05-27 Murata Mfg Co Ltd 研磨方法及び該研磨方法に用いる研磨装置
CN101934491B (zh) * 2004-11-01 2012-07-25 株式会社荏原制作所 抛光设备
TWI275451B (en) * 2005-01-11 2007-03-11 Asia Ic Mic Process Inc Measurement of thickness profile and elastic modulus profile of polishing pad
JP4814677B2 (ja) * 2006-03-31 2011-11-16 株式会社荏原製作所 基板保持装置および研磨装置
US8700191B2 (en) * 2007-11-26 2014-04-15 The Boeing Company Controlled application of external forces to a structure for precision leveling and securing
US8774971B2 (en) * 2010-02-01 2014-07-08 The Boeing Company Systems and methods for structure contour control
CN102581762A (zh) * 2012-04-01 2012-07-18 北京华进创威电子有限公司 一种晶体加工平磨料台
US9011207B2 (en) 2012-10-29 2015-04-21 Wayne O. Duescher Flexible diaphragm combination floating and rigid abrading workholder
US9199354B2 (en) 2012-10-29 2015-12-01 Wayne O. Duescher Flexible diaphragm post-type floating and rigid abrading workholder
US9604339B2 (en) 2012-10-29 2017-03-28 Wayne O. Duescher Vacuum-grooved membrane wafer polishing workholder
US9039488B2 (en) 2012-10-29 2015-05-26 Wayne O. Duescher Pin driven flexible chamber abrading workholder
US9233452B2 (en) 2012-10-29 2016-01-12 Wayne O. Duescher Vacuum-grooved membrane abrasive polishing wafer workholder
US8845394B2 (en) 2012-10-29 2014-09-30 Wayne O. Duescher Bellows driven air floatation abrading workholder
US8998678B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Spider arm driven flexible chamber abrading workholder
US8998677B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Bellows driven floatation-type abrading workholder
KR102191916B1 (ko) * 2013-06-26 2020-12-16 주식회사 케이씨텍 화학 기계적 연마 장치의 캐리어 헤드
JP6403981B2 (ja) * 2013-11-13 2018-10-10 株式会社荏原製作所 基板保持装置、研磨装置、研磨方法、およびリテーナリング
JP2015220402A (ja) * 2014-05-20 2015-12-07 株式会社荏原製作所 基板洗浄装置および基板洗浄装置で実行される方法
US10926378B2 (en) 2017-07-08 2021-02-23 Wayne O. Duescher Abrasive coated disk islands using magnetic font sheet
CN114126792B (zh) * 2019-07-24 2024-09-17 西铁城时计株式会社 加工装置、其使用的控制装置以及加工装置的控制方法
US11691241B1 (en) * 2019-08-05 2023-07-04 Keltech Engineering, Inc. Abrasive lapping head with floating and rigid workpiece carrier
CN113696100B (zh) * 2021-07-02 2024-08-23 天津科技大学 一种磨抛机用定值施力固定装置及施力方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07201790A (ja) * 1993-12-29 1995-08-04 Nippon Steel Corp ウェーハの研磨方法と平行度制御装置
JPH106207A (ja) * 1996-06-18 1998-01-13 Tokyo Seimitsu Co Ltd 研磨装置用定盤
JPH10193259A (ja) * 1996-12-27 1998-07-28 Shin Etsu Handotai Co Ltd 半導体ウエーハの保持機構
EP0890416A2 (de) * 1997-07-11 1999-01-13 Tokyo Seimitsu Co.,Ltd. Halbleiterscheiben Poliervorrichtung
EP0896859A2 (de) * 1997-08-11 1999-02-17 Tokyo Seimitsu Co.,Ltd. Halbleiterscheibenpoliermaschine

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5530783A (en) * 1994-08-31 1996-06-25 Berg Technology, Inc. Backplane optical fiber connector for engaging boards of different thicknesses and method of use
JP3158934B2 (ja) * 1995-02-28 2001-04-23 三菱マテリアル株式会社 ウェーハ研磨装置
JP2758152B2 (ja) * 1995-04-10 1998-05-28 松下電器産業株式会社 被研磨基板の保持装置及び基板の研磨方法
TW348279B (en) * 1995-04-10 1998-12-21 Matsushita Electric Ind Co Ltd Substrate grinding method
US5908530A (en) * 1995-05-18 1999-06-01 Obsidian, Inc. Apparatus for chemical mechanical polishing
US5795215A (en) * 1995-06-09 1998-08-18 Applied Materials, Inc. Method and apparatus for using a retaining ring to control the edge effect
US5738574A (en) * 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
JP3129172B2 (ja) * 1995-11-14 2001-01-29 日本電気株式会社 研磨装置及び研磨方法
DE69717510T2 (de) * 1996-01-24 2003-10-02 Lam Research Corp., Fremont Halbleiterscheiben-Polierkopf
US5762539A (en) * 1996-02-27 1998-06-09 Ebara Corporation Apparatus for and method for polishing workpiece
JP3663767B2 (ja) * 1996-09-04 2005-06-22 信越半導体株式会社 薄板の鏡面研磨装置
JPH10113862A (ja) * 1996-10-11 1998-05-06 Sony Corp 薄板状基板の研磨方法及びそのための研磨装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07201790A (ja) * 1993-12-29 1995-08-04 Nippon Steel Corp ウェーハの研磨方法と平行度制御装置
JPH106207A (ja) * 1996-06-18 1998-01-13 Tokyo Seimitsu Co Ltd 研磨装置用定盤
JPH10193259A (ja) * 1996-12-27 1998-07-28 Shin Etsu Handotai Co Ltd 半導体ウエーハの保持機構
EP0890416A2 (de) * 1997-07-11 1999-01-13 Tokyo Seimitsu Co.,Ltd. Halbleiterscheiben Poliervorrichtung
EP0896859A2 (de) * 1997-08-11 1999-02-17 Tokyo Seimitsu Co.,Ltd. Halbleiterscheibenpoliermaschine

Also Published As

Publication number Publication date
US6027398A (en) 2000-02-22
DE69820355D1 (de) 2004-01-22
EP0896858A1 (de) 1999-02-17
EP0896858B1 (de) 2003-12-10
KR100306715B1 (ko) 2001-11-30
TW434095B (en) 2001-05-16
KR19990023510A (ko) 1999-03-25
MY120338A (en) 2005-10-31
DE69820355T2 (de) 2004-05-27

Similar Documents

Publication Publication Date Title
SG66487A1 (en) Wafer polishing apparatus
SG80597A1 (en) Wafer polishing apparatus
IL123235A0 (en) Semiconductor wafer polishing apparatus
GB2336121B (en) Polishing apparatus
GB2315694B (en) Wafer polishing machine
SG79249A1 (en) Polishing apparatus
TW504041U (en) Wafer processing apparatus
GB2307342B (en) Polishing apparatus
SG95588A1 (en) Polishing method
AU3575697A (en) Wafer cleaning apparatus
IL140682A0 (en) Wafer cleaning apparatus
EP0987084A4 (de) Schleifmaschine
TW474456U (en) Semiconductor apparatus
SG72940A1 (en) Carrier and polishing apparatus
SG77175A1 (en) Polishing apparatus
GB2345256B (en) Polishing apparatus
GB2349839B (en) Apparatus for polishing wafers
SG97860A1 (en) Polishing apparatus
GB9912578D0 (en) Polishing apparatus
TW392921U (en) Wafer contact apparatus
GB2336555B (en) Polishing apparatus
GB9910105D0 (en) Polishing apparatus
GB2351462B (en) Apparatus for polishing wafers
GB2345873B (en) Wafer polishing machine
GB2335874B (en) Wafer polishing