AU1352201A - Closed-loop ultrasonic conditioning control for polishing pads - Google Patents

Closed-loop ultrasonic conditioning control for polishing pads

Info

Publication number
AU1352201A
AU1352201A AU13522/01A AU1352201A AU1352201A AU 1352201 A AU1352201 A AU 1352201A AU 13522/01 A AU13522/01 A AU 13522/01A AU 1352201 A AU1352201 A AU 1352201A AU 1352201 A AU1352201 A AU 1352201A
Authority
AU
Australia
Prior art keywords
closed
conditioning control
polishing pads
ultrasonic conditioning
loop ultrasonic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU13522/01A
Inventor
Timothy S. Dyer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Speedfam IPEC Corp
Original Assignee
Speedfam IPEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedfam IPEC Corp filed Critical Speedfam IPEC Corp
Publication of AU1352201A publication Critical patent/AU1352201A/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
AU13522/01A 1999-11-01 2000-10-30 Closed-loop ultrasonic conditioning control for polishing pads Abandoned AU1352201A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US43151399A 1999-11-01 1999-11-01
US09431513 1999-11-01
PCT/US2000/029831 WO2001032360A1 (en) 1999-11-01 2000-10-30 Closed-loop ultrasonic conditioning control for polishing pads

Publications (1)

Publication Number Publication Date
AU1352201A true AU1352201A (en) 2001-05-14

Family

ID=23712269

Family Applications (1)

Application Number Title Priority Date Filing Date
AU13522/01A Abandoned AU1352201A (en) 1999-11-01 2000-10-30 Closed-loop ultrasonic conditioning control for polishing pads

Country Status (3)

Country Link
AU (1) AU1352201A (en)
TW (1) TW487615B (en)
WO (1) WO2001032360A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6752698B1 (en) 2001-03-19 2004-06-22 Lam Research Corporation Method and apparatus for conditioning fixed-abrasive polishing pads
US6645052B2 (en) * 2001-10-26 2003-11-11 Lam Research Corporation Method and apparatus for controlling CMP pad surface finish
DE102004005741A1 (en) * 2004-02-05 2005-09-01 Infineon Technologies Ag Polishing cloth refining method, involves rubbing off surface of cloth with tool, compiling refining conditions of cloth using parameters, monitoring conditions and terminating refining of cloth when specified condition is achieved
US7163435B2 (en) 2005-01-31 2007-01-16 Tech Semiconductor Singapore Pte. Ltd. Real time monitoring of CMP pad conditioning process
WO2006124637A1 (en) * 2005-05-16 2006-11-23 The Ultran Group, Inc. Ultraschallanalysator fur chemisch-mechanisches polierkissen
JP5504901B2 (en) * 2010-01-13 2014-05-28 株式会社Ｓｕｍｃｏ Polishing pad shape correction method
CN106808359B (en) * 2016-12-23 2019-04-23 上海集成电路研发中心有限公司 A kind of device and detection method of on-line checking grinding pad service life
JP6970601B2 (en) * 2017-12-06 2021-11-24 株式会社荏原製作所 How to design semiconductor manufacturing equipment
KR102113067B1 (en) * 2018-11-29 2020-05-21 한국생산기술연구원 Apparatus for determining pad replacement time of cmp apparatus for wafer and control method therefor
KR102154583B1 (en) 2020-07-28 2020-09-10 (주)티씨에스 Method for measuring a cmp pad and bute of fabricating device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3560826A (en) * 1967-12-04 1971-02-02 Gray Tech Ind Inc Grinding wheel control system and apparatus
US5456627A (en) * 1993-12-20 1995-10-10 Westech Systems, Inc. Conditioner for a polishing pad and method therefor
US5486131A (en) * 1994-01-04 1996-01-23 Speedfam Corporation Device for conditioning polishing pads
US5609718A (en) * 1995-09-29 1997-03-11 Micron Technology, Inc. Method and apparatus for measuring a change in the thickness of polishing pads used in chemical-mechanical planarization of semiconductor wafers
US5823854A (en) * 1996-05-28 1998-10-20 Industrial Technology Research Institute Chemical-mechanical polish (CMP) pad conditioner
US5787595A (en) * 1996-08-09 1998-08-04 Memc Electric Materials, Inc. Method and apparatus for controlling flatness of polished semiconductor wafer
TW434095B (en) * 1997-08-11 2001-05-16 Tokyo Seimitsu Co Ltd Wafer polishing apparatus

Also Published As

Publication number Publication date
WO2001032360A1 (en) 2001-05-10
TW487615B (en) 2002-05-21

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase