AU4044400A - Dual cmp pad conditioner - Google Patents

Dual cmp pad conditioner

Info

Publication number
AU4044400A
AU4044400A AU40444/00A AU4044400A AU4044400A AU 4044400 A AU4044400 A AU 4044400A AU 40444/00 A AU40444/00 A AU 40444/00A AU 4044400 A AU4044400 A AU 4044400A AU 4044400 A AU4044400 A AU 4044400A
Authority
AU
Australia
Prior art keywords
pad conditioner
cmp pad
dual
dual cmp
conditioner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU40444/00A
Inventor
Albert H. Liu
Landon Vines
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of AU4044400A publication Critical patent/AU4044400A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/013—Application of loose grinding agent as auxiliary tool during truing operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
AU40444/00A 1999-04-01 2000-03-29 Dual cmp pad conditioner Abandoned AU4044400A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US28371699A 1999-04-01 1999-04-01
US09283716 1999-04-01
PCT/US2000/008340 WO2000060645A2 (en) 1999-04-01 2000-03-29 Dual cmp pad conditioner

Publications (1)

Publication Number Publication Date
AU4044400A true AU4044400A (en) 2000-10-23

Family

ID=23087250

Family Applications (1)

Application Number Title Priority Date Filing Date
AU40444/00A Abandoned AU4044400A (en) 1999-04-01 2000-03-29 Dual cmp pad conditioner

Country Status (6)

Country Link
EP (1) EP1190455A2 (en)
JP (1) JP2002540972A (en)
KR (1) KR20010071353A (en)
CN (1) CN1362907A (en)
AU (1) AU4044400A (en)
WO (1) WO2000060645A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW495416B (en) * 2000-10-24 2002-07-21 Ebara Corp Polishing apparatus
DE10195157B4 (en) * 2000-11-29 2010-08-26 Qimonda Ag Cleaning device for cleaning polishing cloths used for polishing semiconductor wafers
DE10308064B4 (en) * 2003-02-26 2006-03-09 Infineon Technologies Ag Polishing agent supply in CMP processes
US7125324B2 (en) * 2004-03-09 2006-10-24 3M Innovative Properties Company Insulated pad conditioner and method of using same
US20100041316A1 (en) * 2008-08-14 2010-02-18 Yulin Wang Method for an improved chemical mechanical polishing system
WO2010019264A2 (en) * 2008-08-14 2010-02-18 Applied Materials, Inc. Chemical mechanical polisher having movable slurry dispensers and method
US20100291840A1 (en) * 2009-05-12 2010-11-18 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for conditioning chemical mechanical polishing apparatus using multiple conditioning disks
CN102554782A (en) * 2010-12-20 2012-07-11 中芯国际集成电路制造(上海)有限公司 Polishing pad cleaning device and polishing pad finisher
US8920214B2 (en) * 2011-07-12 2014-12-30 Chien-Min Sung Dual dressing system for CMP pads and associated methods
US9149906B2 (en) * 2011-09-07 2015-10-06 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus for CMP pad conditioning
CN103182681A (en) * 2011-12-28 2013-07-03 青岛嘉星晶电科技股份有限公司 Rectifying device for millstone of double-sided grinder, and rectifying method thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2622069B2 (en) * 1993-06-30 1997-06-18 三菱マテリアル株式会社 Dressing equipment for polishing cloth
US5683289A (en) * 1996-06-26 1997-11-04 Texas Instruments Incorporated CMP polishing pad conditioning apparatus
US6312319B1 (en) * 1997-04-04 2001-11-06 Timothy J. Donohue Polishing media magazine for improved polishing

Also Published As

Publication number Publication date
WO2000060645A3 (en) 2002-01-17
KR20010071353A (en) 2001-07-28
JP2002540972A (en) 2002-12-03
WO2000060645A2 (en) 2000-10-12
EP1190455A2 (en) 2002-03-27
CN1362907A (en) 2002-08-07

Similar Documents

Publication Publication Date Title
AU2002360661A1 (en) Polishing pad
GB2354525B (en) Polishing composition
AU5325400A (en) Multi-connection via
AU2001251318A1 (en) Integrated chemical-mechanical polishing
AU2001247107A1 (en) Sanding sponge
GB0022349D0 (en) Polishing composition
AU2002245273A1 (en) A cmp polishing pad including a solid catalyst
AU2350300A (en) Cooling pad
EP1106426A3 (en) Rotatable headrest
AU2001245854A1 (en) Batting pad
AU4041800A (en) Cmp pad conditioner arrangement and method therefor
AU7851000A (en) Optimal offset, pad size and pad shape for cmp buffing and polishing
AU1674500A (en) Abrasive body
AU4044400A (en) Dual cmp pad conditioner
AU2917799A (en) Multipurpose re-useable adhesive pad
AU2654600A (en) Caseinate-whey crosslinked covering agent
SG83794A1 (en) Polishing slurry
AU2002214582A1 (en) Breast pads
AU2001278101A1 (en) Abrasive pad
AU5294700A (en) Note pad
AU6305100A (en) Grinding machines
AUPR135000A0 (en) Sander
AU4639599A (en) Abrasive body
AU7267900A (en) Grinding disk
AU2194301A (en) Breast pad

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase