SG79296A1 - Chemical mechanical abrasive composition for use in semiconductor processing - Google Patents
Chemical mechanical abrasive composition for use in semiconductor processingInfo
- Publication number
- SG79296A1 SG79296A1 SG9906337A SG1999006337A SG79296A1 SG 79296 A1 SG79296 A1 SG 79296A1 SG 9906337 A SG9906337 A SG 9906337A SG 1999006337 A SG1999006337 A SG 1999006337A SG 79296 A1 SG79296 A1 SG 79296A1
- Authority
- SG
- Singapore
- Prior art keywords
- chemical mechanical
- semiconductor processing
- abrasive composition
- mechanical abrasive
- composition
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN99109797A CN1125861C (zh) | 1999-07-16 | 1999-07-16 | 半导体加工用化学机械研磨组合物 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG79296A1 true SG79296A1 (en) | 2001-03-20 |
Family
ID=5274156
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG9906337A SG79296A1 (en) | 1999-07-16 | 1999-12-10 | Chemical mechanical abrasive composition for use in semiconductor processing |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1069168B1 (de) |
CN (1) | CN1125861C (de) |
DE (1) | DE60017642T2 (de) |
SG (1) | SG79296A1 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI282360B (en) * | 2002-06-03 | 2007-06-11 | Hitachi Chemical Co Ltd | Polishing composition and polishing method thereof |
GB2393186B (en) * | 2002-07-31 | 2006-02-22 | Kao Corp | Polishing composition |
GB2393447B (en) * | 2002-08-07 | 2006-04-19 | Kao Corp | Polishing composition |
JP3875156B2 (ja) * | 2002-08-07 | 2007-01-31 | 花王株式会社 | ロールオフ低減剤 |
US7186653B2 (en) | 2003-07-30 | 2007-03-06 | Climax Engineered Materials, Llc | Polishing slurries and methods for chemical mechanical polishing |
CN101153205A (zh) * | 2006-09-29 | 2008-04-02 | 安集微电子(上海)有限公司 | 用于抛光低介电材料的化学机械抛光液 |
KR101488444B1 (ko) * | 2007-09-28 | 2015-01-30 | 니타 하스 인코포레이티드 | 연마조성물 |
CN102101982A (zh) * | 2009-12-18 | 2011-06-22 | 安集微电子(上海)有限公司 | 一种化学机械抛光液 |
CN102477258B (zh) * | 2010-11-26 | 2015-05-27 | 安集微电子(上海)有限公司 | 一种化学机械抛光液 |
KR101907637B1 (ko) * | 2018-02-09 | 2018-12-05 | 엘티씨에이엠 주식회사 | 실리콘질화막의 고선택비 식각 조성물 |
CN113122147B (zh) * | 2019-12-31 | 2024-03-12 | 安集微电子科技(上海)股份有限公司 | 一种化学机械抛光液及其使用方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0846741A1 (de) * | 1996-12-05 | 1998-06-10 | Fujimi Incorporated | Politurzusammensetzung |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3850053B2 (ja) * | 1995-10-04 | 2006-11-29 | 花王株式会社 | 磁気記録媒体基板製造用研磨材組成物及び磁気記録媒体用基板の製造方法 |
US6007592A (en) * | 1996-11-14 | 1999-12-28 | Nissan Chemical Industries, Ltd. | Polishing composition for aluminum disk and polishing process therewith |
WO1998021289A1 (fr) * | 1996-11-14 | 1998-05-22 | Kao Corporation | Composition abrasive utilisee dans la fabrication de la base d'un support d'enregistrement magnetique, et procede de fabrication de cette base a l'aide de cette composition |
WO1998023697A1 (en) * | 1996-11-26 | 1998-06-04 | Cabot Corporation | Composition and method for polishing rigid disks |
US6068787A (en) * | 1996-11-26 | 2000-05-30 | Cabot Corporation | Composition and slurry useful for metal CMP |
US5916855A (en) * | 1997-03-26 | 1999-06-29 | Advanced Micro Devices, Inc. | Chemical-mechanical polishing slurry formulation and method for tungsten and titanium thin films |
JPH1121545A (ja) * | 1997-06-30 | 1999-01-26 | Fujimi Inkooporeetetsudo:Kk | 研磨用組成物 |
US6083419A (en) * | 1997-07-28 | 2000-07-04 | Cabot Corporation | Polishing composition including an inhibitor of tungsten etching |
JPH1180708A (ja) * | 1997-09-09 | 1999-03-26 | Fujimi Inkooporeetetsudo:Kk | 研磨用組成物 |
-
1999
- 1999-07-16 CN CN99109797A patent/CN1125861C/zh not_active Expired - Lifetime
- 1999-12-10 SG SG9906337A patent/SG79296A1/en unknown
-
2000
- 2000-05-19 DE DE2000617642 patent/DE60017642T2/de not_active Expired - Lifetime
- 2000-05-19 EP EP20000304246 patent/EP1069168B1/de not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0846741A1 (de) * | 1996-12-05 | 1998-06-10 | Fujimi Incorporated | Politurzusammensetzung |
Also Published As
Publication number | Publication date |
---|---|
CN1281023A (zh) | 2001-01-24 |
DE60017642T2 (de) | 2006-03-30 |
CN1125861C (zh) | 2003-10-29 |
EP1069168B1 (de) | 2005-01-26 |
DE60017642D1 (de) | 2005-03-03 |
EP1069168A1 (de) | 2001-01-17 |
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