SG78405A1 - Polishing composition and rinsing composition - Google Patents

Polishing composition and rinsing composition

Info

Publication number
SG78405A1
SG78405A1 SG1999005634A SG1999005634A SG78405A1 SG 78405 A1 SG78405 A1 SG 78405A1 SG 1999005634 A SG1999005634 A SG 1999005634A SG 1999005634 A SG1999005634 A SG 1999005634A SG 78405 A1 SG78405 A1 SG 78405A1
Authority
SG
Singapore
Prior art keywords
composition
rinsing
polishing
polishing composition
rinsing composition
Prior art date
Application number
SG1999005634A
Other languages
English (en)
Inventor
Tetsuya Tokuue Takashi Sayama
Toshiki Owaki
Katsumi Tani
Original Assignee
Fujimi Inc
Toho Chem Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP32645198A external-priority patent/JP4014741B2/ja
Application filed by Fujimi Inc, Toho Chem Ind Co Ltd filed Critical Fujimi Inc
Publication of SG78405A1 publication Critical patent/SG78405A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Detergent Compositions (AREA)
SG1999005634A 1998-11-17 1999-11-12 Polishing composition and rinsing composition SG78405A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP32645198A JP4014741B2 (ja) 1998-11-17 1998-11-17 リンス用組成物
JP32643398 1998-11-17

Publications (1)

Publication Number Publication Date
SG78405A1 true SG78405A1 (en) 2001-02-20

Family

ID=26572182

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1999005634A SG78405A1 (en) 1998-11-17 1999-11-12 Polishing composition and rinsing composition

Country Status (6)

Country Link
US (1) US6117220A (zh)
KR (1) KR20000035505A (zh)
CN (1) CN1146623C (zh)
GB (1) GB2350369B (zh)
SG (1) SG78405A1 (zh)
TW (1) TW562851B (zh)

Families Citing this family (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6475407B2 (en) * 1998-05-19 2002-11-05 Showa Denko K.K. Composition for polishing metal on semiconductor wafer and method of using same
US6553788B1 (en) * 1999-02-23 2003-04-29 Nippon Sheet Glass Co., Ltd. Glass substrate for magnetic disk and method for manufacturing
US6428392B1 (en) * 1999-03-23 2002-08-06 Seimi Chemical Co., Ltd. Abrasive
US6673757B1 (en) * 2000-03-22 2004-01-06 Ashland Inc. Process for removing contaminant from a surface and composition useful therefor
US6258140B1 (en) * 1999-09-27 2001-07-10 Fujimi America Inc. Polishing composition
US6488729B1 (en) * 1999-09-30 2002-12-03 Showa Denko K.K. Polishing composition and method
US6454821B1 (en) * 2000-06-21 2002-09-24 Praxair S. T. Technology, Inc. Polishing composition and method
DE60124473T2 (de) * 2000-09-08 2007-09-06 Kanto Kagaku K.K. Ätzflüssigkeitszusammensetzung
JP4009986B2 (ja) 2000-11-29 2007-11-21 株式会社フジミインコーポレーテッド 研磨用組成物、およびそれを用いてメモリーハードディスクを研磨する研磨方法
CN100378145C (zh) * 2001-06-21 2008-04-02 花王株式会社 研磨液组合物
JP4003116B2 (ja) 2001-11-28 2007-11-07 株式会社フジミインコーポレーテッド 磁気ディスク用基板の研磨用組成物及びそれを用いた研磨方法
US6821897B2 (en) * 2001-12-05 2004-11-23 Cabot Microelectronics Corporation Method for copper CMP using polymeric complexing agents
CN1240816C (zh) * 2001-12-12 2006-02-08 海力士半导体有限公司 除去光致抗蚀剂的洗涤液
US6776810B1 (en) * 2002-02-11 2004-08-17 Cabot Microelectronics Corporation Anionic abrasive particles treated with positively charged polyelectrolytes for CMP
US7677956B2 (en) 2002-05-10 2010-03-16 Cabot Microelectronics Corporation Compositions and methods for dielectric CMP
JP4095833B2 (ja) * 2002-05-30 2008-06-04 株式会社フジミインコーポレーテッド 研磨用組成物
US6974777B2 (en) * 2002-06-07 2005-12-13 Cabot Microelectronics Corporation CMP compositions for low-k dielectric materials
US6936543B2 (en) * 2002-06-07 2005-08-30 Cabot Microelectronics Corporation CMP method utilizing amphiphilic nonionic surfactants
GB2393186B (en) * 2002-07-31 2006-02-22 Kao Corp Polishing composition
GB2395486B (en) * 2002-10-30 2006-08-16 Kao Corp Polishing composition
US7071105B2 (en) 2003-02-03 2006-07-04 Cabot Microelectronics Corporation Method of polishing a silicon-containing dielectric
US20050022456A1 (en) * 2003-07-30 2005-02-03 Babu S. V. Polishing slurry and method for chemical-mechanical polishing of copper
US7186653B2 (en) * 2003-07-30 2007-03-06 Climax Engineered Materials, Llc Polishing slurries and methods for chemical mechanical polishing
US7427361B2 (en) * 2003-10-10 2008-09-23 Dupont Air Products Nanomaterials Llc Particulate or particle-bound chelating agents
JP4249008B2 (ja) * 2003-12-25 2009-04-02 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた研磨方法
DE602005000732T2 (de) * 2004-06-25 2007-12-06 Jsr Corp. Reinigungszusammensetzung für Halbleiterkomponente und Verfahren zur Herstellung eines Halbleitergeräts
JP2006077127A (ja) * 2004-09-09 2006-03-23 Fujimi Inc 研磨用組成物及びそれを用いた研磨方法
JP4667848B2 (ja) * 2004-12-13 2011-04-13 花王株式会社 ガラス基板用研磨液組成物
WO2006105020A1 (en) 2005-03-25 2006-10-05 Dupont Air Products Nanomaterials Llc Dihydroxy enol compounds used in chemical mechanical polishing compositions having metal ion oxidizers
KR101100861B1 (ko) * 2005-04-21 2012-01-02 삼성코닝정밀소재 주식회사 금속 산화물 서스펜션 제조 방법
US20060280860A1 (en) * 2005-06-09 2006-12-14 Enthone Inc. Cobalt electroless plating in microelectronic devices
US7410899B2 (en) * 2005-09-20 2008-08-12 Enthone, Inc. Defectivity and process control of electroless deposition in microelectronics applications
US7691287B2 (en) * 2007-01-31 2010-04-06 Dupont Air Products Nanomaterials Llc Method for immobilizing ligands and organometallic compounds on silica surface, and their application in chemical mechanical planarization
US8901053B2 (en) * 2007-09-14 2014-12-02 Kao Corporation Aqueous cleaning composition for substrate for perpendicular magnetic recording hard disk
JP2010080022A (ja) 2008-09-29 2010-04-08 Showa Denko Kk 垂直磁気記録媒体の製造方法
US8324143B2 (en) 2008-12-19 2012-12-04 Sanyo Chemical Industries, Ltd. Cleaning agent for electronic materials
KR101126530B1 (ko) * 2010-06-09 2012-03-22 주식회사 엔유씨전자 마그네슘 합금의 화학연마 방법
WO2013088928A1 (ja) * 2011-12-14 2013-06-20 旭硝子株式会社 洗浄剤、および炭化ケイ素単結晶基板の製造方法
US8859428B2 (en) 2012-10-19 2014-10-14 Air Products And Chemicals, Inc. Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereof
US9058976B2 (en) * 2012-11-06 2015-06-16 International Business Machines Corporation Cleaning composition and process for cleaning semiconductor devices and/or tooling during manufacturing thereof
CN102977790B (zh) * 2012-12-21 2015-01-07 青岛文创科技有限公司 一种抛光剂
KR101405333B1 (ko) * 2013-09-12 2014-06-11 유비머트리얼즈주식회사 연마 입자, 연마 슬러리 및 이를 이용한 반도체 소자의 제조 방법
CN105234835A (zh) * 2015-08-27 2016-01-13 安徽威铭耐磨材料有限公司 一种含纳米碳化铌弥散增强的高抗蚀超细粒度cbn砂轮及其制备方法
CN105234837A (zh) * 2015-08-27 2016-01-13 安徽威铭耐磨材料有限公司 一种高速磨削用自修复型超细粒度cbn砂轮及其制备方法
CN105081990A (zh) * 2015-08-27 2015-11-25 安徽威铭耐磨材料有限公司 一种含纳米纤维素晶须的高分散性超硬超细粒度cbn砂轮及其制备方法
CN105127914A (zh) * 2015-08-27 2015-12-09 安徽威铭耐磨材料有限公司 一种含纳米碳球的高表面光滑度超细粒度cbn砂轮及其制备方法
CN105196192A (zh) * 2015-08-27 2015-12-30 安徽威铭耐磨材料有限公司 一种含电气石的高活性高孔径率超细粒度cbn砂轮及其制备方法
CN105127915A (zh) * 2015-08-27 2015-12-09 安徽威铭耐磨材料有限公司 一种含纳米碳纤维的高磨削精度高强度超细粒度cbn砂轮及其制备方法
CN105196193A (zh) * 2015-08-27 2015-12-30 安徽威铭耐磨材料有限公司 一种含纳米氮化钛的高韧性超细粒度cbn砂轮及其制备方法
CN105127912A (zh) * 2015-08-27 2015-12-09 安徽威铭耐磨材料有限公司 一种含纳米二硅化钼的高耐磨损超细粒度cbn砂轮及其制备方法
CN105127913A (zh) * 2015-08-27 2015-12-09 安徽威铭耐磨材料有限公司 一种高硬度抗蠕变的超细粒度cbn砂轮及其制备方法
CN105127916A (zh) * 2015-08-27 2015-12-09 安徽威铭耐磨材料有限公司 一种低热膨胀高抗腐蚀的超细粒度cbn砂轮及其制备方法
CN105234836A (zh) * 2015-08-27 2016-01-13 安徽威铭耐磨材料有限公司 一种含六钛酸钾晶须的低摩擦损耗超细粒度cbn砂轮及其制备方法
CN105252426A (zh) * 2015-08-27 2016-01-20 安徽威铭耐磨材料有限公司 一种高耐磨高致密度的超细粒度cbn砂轮及其制备方法
CN105234838A (zh) * 2015-08-27 2016-01-13 安徽威铭耐磨材料有限公司 一种含有纳米硼化锆的耐磨高光滑度超细粒度cbn砂轮及其制备方法
CN105234834A (zh) * 2015-08-27 2016-01-13 安徽威铭耐磨材料有限公司 一种高耐磨高导热性的超细粒度cbn砂轮及其制备方法
CN105108664A (zh) * 2015-08-28 2015-12-02 安徽威铭耐磨材料有限公司 一种具有减振降噪功效的高磨削精度超细粒度cbn砂轮及其制备方法
US10294399B2 (en) * 2017-01-05 2019-05-21 Cabot Microelectronics Corporation Composition and method for polishing silicon carbide
CN111020591B (zh) * 2019-12-09 2021-05-04 怀化学院 一种疏水性表面抛光的铝合金的制备方法
CN115247026A (zh) * 2021-04-26 2022-10-28 福建晶安光电有限公司 一种蓝宝石抛光液及其制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6487146A (en) * 1987-09-22 1989-03-31 Lion Corp Dispersant for polishing agent
JPH0284485A (ja) * 1988-09-20 1990-03-26 Showa Denko Kk アルミニウム磁気ディスク研磨用組成物
CA2021126C (en) * 1989-07-13 1994-12-27 David Elliott Machine dishwashing compositions
JP3106339B2 (ja) * 1994-02-04 2000-11-06 株式会社フジミインコーポレーテッド 研磨用組成物
AU5884696A (en) * 1995-06-23 1997-01-22 Bausch & Lomb Incorporated Method for cleaning contact lenses utilizing polysulfonates
CA2234407C (en) * 1995-10-09 2005-08-02 The Procter & Gamble Company Hard surface cleaning compositions
EP0786504A3 (en) * 1996-01-29 1998-05-20 Fujimi Incorporated Polishing composition
JPH1036818A (ja) * 1996-07-24 1998-02-10 Mitsubishi Chem Corp ハードディスク基板の研磨用組成物及びこれを用いた研磨方法
JP4141514B2 (ja) * 1996-11-26 2008-08-27 株式会社フジミインコーポレーテッド リンス用組成物
SG54606A1 (en) * 1996-12-05 1998-11-16 Fujimi Inc Polishing composition
JPH10204416A (ja) * 1997-01-21 1998-08-04 Fujimi Inkooporeetetsudo:Kk 研磨用組成物
EP0875554B1 (en) * 1997-04-30 2003-06-11 The Procter & Gamble Company Acidic limescale removal compositions

Also Published As

Publication number Publication date
GB9927203D0 (en) 2000-01-12
KR20000035505A (ko) 2000-06-26
GB2350369A (en) 2000-11-29
CN1146623C (zh) 2004-04-21
TW562851B (en) 2003-11-21
CN1253963A (zh) 2000-05-24
GB2350369B (en) 2003-08-20
US6117220A (en) 2000-09-12

Similar Documents

Publication Publication Date Title
GB2350369B (en) Polishing composition and rinsing composition
SG79294A1 (en) Polishing composition and polishing method employing it
SG88775A1 (en) Polishing composition and polishing method employing it
SG85153A1 (en) Polishing composition and polishing process
HUP0104340A3 (en) Laundry and cleaning composition and its use
HUP0200238A3 (en) Laundry and cleaning composition and its use
HUP9902489A3 (en) Detergent cosmetical composition and its use
GB2354525B (en) Polishing composition
GB2354524B (en) Polishing composition
GB2341190B (en) Polishing composition
SG52903A1 (en) Polishing composition
SG54606A1 (en) Polishing composition
EP1086196A4 (en) DETERGENT FOR SHOWER CABINS
HU9902129D0 (en) Conditioning and detergent composition and its use
GB2338490B (en) Polishing composition
GB9813271D0 (en) Composition and use
PL347357A1 (en) Novel composition and use
GB2334721B (en) Cleansing composition
SG68005A1 (en) Polishing composition
PL336419A1 (en) Abrasive cleaning composition
PL332616A1 (en) Hydoxymethylhexanones as odorising and savourising agents
GB9725012D0 (en) Rinsing composition
EP0889946A4 (en) RIN AGE COMPOSITIONS
PL337460A1 (en) Abrasive cleaning composition
GB2384003B (en) Polishing composition