JPS6487146A - Dispersant for polishing agent - Google Patents
Dispersant for polishing agentInfo
- Publication number
- JPS6487146A JPS6487146A JP62238543A JP23854387A JPS6487146A JP S6487146 A JPS6487146 A JP S6487146A JP 62238543 A JP62238543 A JP 62238543A JP 23854387 A JP23854387 A JP 23854387A JP S6487146 A JPS6487146 A JP S6487146A
- Authority
- JP
- Japan
- Prior art keywords
- salt
- polishing
- polishing agent
- improvement
- sulfonic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
PURPOSE:To provide stationary stability and excellent redispersibility for a long time, by a method wherein, in a polishing agent for industrial use used especially for a high speed and precision polishing, a dispersant consisting of polystyrene sulfonic acid or salt thereof is blended. CONSTITUTION:Approximate 0.01-5wt.% preferably approximate 0.05-3wt.% polystyrene sulfonic acid or salt thereof, serving as a dispersant, is added in a suspension of a polishing agent, e.g., cerium oxide, zirconium oxide, diamond powder, alumina, and water. A molecular amount of 3,000-1,000,000, preferably 5,000-500,000, is used as polystyrene sulfonic acid or salt thereof, and sodium, calium, etc., are used as a counter ion in salt. This constitution enables provision of stationary stability in high concentration of a polishing agent suspension for a long time, and provision of excellent redispersability, improvement of polishing characteristics, e.g., improvement of a polishing speed, reduction of surface damage, and improvement of working efficiency.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62238543A JPS6487146A (en) | 1987-09-22 | 1987-09-22 | Dispersant for polishing agent |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62238543A JPS6487146A (en) | 1987-09-22 | 1987-09-22 | Dispersant for polishing agent |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6487146A true JPS6487146A (en) | 1989-03-31 |
Family
ID=17031815
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62238543A Pending JPS6487146A (en) | 1987-09-22 | 1987-09-22 | Dispersant for polishing agent |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6487146A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2350369A (en) * | 1998-11-17 | 2000-11-29 | Fujimi Inc | Polishing and rinsing compositions |
US6776810B1 (en) | 2002-02-11 | 2004-08-17 | Cabot Microelectronics Corporation | Anionic abrasive particles treated with positively charged polyelectrolytes for CMP |
US6821897B2 (en) | 2001-12-05 | 2004-11-23 | Cabot Microelectronics Corporation | Method for copper CMP using polymeric complexing agents |
US6936543B2 (en) * | 2002-06-07 | 2005-08-30 | Cabot Microelectronics Corporation | CMP method utilizing amphiphilic nonionic surfactants |
US7427361B2 (en) | 2003-10-10 | 2008-09-23 | Dupont Air Products Nanomaterials Llc | Particulate or particle-bound chelating agents |
US7677956B2 (en) | 2002-05-10 | 2010-03-16 | Cabot Microelectronics Corporation | Compositions and methods for dielectric CMP |
-
1987
- 1987-09-22 JP JP62238543A patent/JPS6487146A/en active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2350369A (en) * | 1998-11-17 | 2000-11-29 | Fujimi Inc | Polishing and rinsing compositions |
GB2350369B (en) * | 1998-11-17 | 2003-08-20 | Fujimi Inc | Polishing composition and rinsing composition |
US6821897B2 (en) | 2001-12-05 | 2004-11-23 | Cabot Microelectronics Corporation | Method for copper CMP using polymeric complexing agents |
US6776810B1 (en) | 2002-02-11 | 2004-08-17 | Cabot Microelectronics Corporation | Anionic abrasive particles treated with positively charged polyelectrolytes for CMP |
US7306637B2 (en) | 2002-02-11 | 2007-12-11 | Cabot Microelectronics Corporation | Anionic abrasive particles treated with positively charged polyelectrolytes for CMP |
US7677956B2 (en) | 2002-05-10 | 2010-03-16 | Cabot Microelectronics Corporation | Compositions and methods for dielectric CMP |
US6936543B2 (en) * | 2002-06-07 | 2005-08-30 | Cabot Microelectronics Corporation | CMP method utilizing amphiphilic nonionic surfactants |
US7427361B2 (en) | 2003-10-10 | 2008-09-23 | Dupont Air Products Nanomaterials Llc | Particulate or particle-bound chelating agents |
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