SG72747A1 - Ic mounting / demounting system and mouting / demounting head therefor - Google Patents

Ic mounting / demounting system and mouting / demounting head therefor

Info

Publication number
SG72747A1
SG72747A1 SG1997002523A SG1997002523A SG72747A1 SG 72747 A1 SG72747 A1 SG 72747A1 SG 1997002523 A SG1997002523 A SG 1997002523A SG 1997002523 A SG1997002523 A SG 1997002523A SG 72747 A1 SG72747 A1 SG 72747A1
Authority
SG
Singapore
Prior art keywords
demounting
mouting
mounting
head therefor
therefor
Prior art date
Application number
SG1997002523A
Other languages
English (en)
Inventor
Arakawa Isao
Hirata Yoshinori
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of SG72747A1 publication Critical patent/SG72747A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0486—Replacement and removal of components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y10T29/49137—Different components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)
  • Automatic Tool Replacement In Machine Tools (AREA)
SG1997002523A 1996-12-02 1997-07-22 Ic mounting / demounting system and mouting / demounting head therefor SG72747A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8321749A JPH10160794A (ja) 1996-12-02 1996-12-02 Ｉｃ着脱装置及びその着脱ヘッド

Publications (1)

Publication Number Publication Date
SG72747A1 true SG72747A1 (en) 2000-05-23

Family

ID=18136025

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1997002523A SG72747A1 (en) 1996-12-02 1997-07-22 Ic mounting / demounting system and mouting / demounting head therefor

Country Status (7)

Country Link
US (1) US5951720A (de)
JP (1) JPH10160794A (de)
KR (1) KR100253935B1 (de)
CN (1) CN1057403C (de)
DE (1) DE19743211C2 (de)
MY (1) MY116127A (de)
SG (1) SG72747A1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3407192B2 (ja) * 1998-12-31 2003-05-19 株式会社ダイトー テストハンドの制御方法及び計測制御システム
US6690284B2 (en) * 1998-12-31 2004-02-10 Daito Corporation Method of controlling IC handler and control system using the same
JP3428488B2 (ja) * 1999-04-12 2003-07-22 株式会社村田製作所 電子部品の製造方法
US6305076B1 (en) * 2000-01-21 2001-10-23 Cypress Semiconductor Corp. Apparatus for transferring a plurality of integrated circuit devices into and/or out of a plurality of sockets
DE10208757B4 (de) 2002-02-28 2006-06-29 Infineon Technologies Ag Verfahren und Magazinvorrichtung zur Prüfung von Halbleitereinrichtungen
US7047631B1 (en) * 2002-03-13 2006-05-23 Cisco Technology, Inc. Method for automatable insertion or removal of integrated circuit board
KR20040003937A (ko) * 2002-07-05 2004-01-13 (주)티에스이 반도체 테스트 장치용 캐리어 모듈
DE10358691B4 (de) * 2003-12-15 2012-06-21 Qimonda Ag Verfahren zum Beladen einer Sockel-Einrichtung mit einem entsprechenden Halbleiter-Bauelement
DE10359648B4 (de) 2003-12-18 2013-05-16 Qimonda Ag Sockel-Einrichtung zur Verwendung beim Test von Halbleiter-Bauelementen, sowie Vorrichtung und Verfahren zum Beladen einer Sockel-Einrichtung mit einem entsprechenden Halbleiter-Bauelement
US20050276031A1 (en) * 2004-06-14 2005-12-15 Tam Kin S Printed circuit assembly system and method
US7214072B1 (en) * 2005-10-31 2007-05-08 Daytona Control Co., Ltd. Pusher of IC chip handler
KR100639401B1 (ko) * 2005-11-22 2006-10-27 한미반도체 주식회사 기준마크가 구비된 흡착패드 및 이를 이용한 흡착패드얼라인 방법
KR100910224B1 (ko) 2006-11-16 2009-08-06 주식회사 하이닉스반도체 반도체 소자 테스트 핸들링 장치용 인서트, 트레이 및반도체 소자 테스트 핸들링 장치
CN101972909A (zh) * 2010-10-22 2011-02-16 襄樊东昇机械有限公司 焊接机器人快速段取平台
DE102015113529A1 (de) * 2015-08-17 2017-02-23 Von Ardenne Gmbh Verfahren, Substrathaltevorrichtung und Prozessieranordnung
WO2016083508A1 (de) 2014-11-26 2016-06-02 Von Ardenne Gmbh Substrathaltevorrichtung, substrattransportvorrichtung, prozessieranordnung und verfahren zum prozessieren eines substrats
JP6704136B2 (ja) * 2015-09-07 2020-06-03 パナソニックＩｐマネジメント株式会社 部品実装装置および部品実装方法
US11961220B2 (en) * 2018-01-23 2024-04-16 Texas Instruments Incorporated Handling integrated circuits in automated testing

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08327959A (ja) * 1994-06-30 1996-12-13 Seiko Epson Corp ウエハ及び基板の処理装置及び処理方法、ウエハ及び基板の移載装置
WO1985003405A1 (en) * 1984-01-23 1985-08-01 Dyna/Pert - Precima Limited Pick-up head for handling electrical components
GB8406129D0 (en) * 1984-03-08 1984-04-11 Dyna Pert Precima Ltd Orienting electrical components
CN85202316U (zh) * 1985-06-14 1986-05-07 煤炭工业部煤炭科学研究院南京研究所 综合老化台
DE3616953A1 (de) * 1986-04-07 1987-10-08 Mhs Muenchner Hybridsysteme Gm Verfahren und vorrichtung zum anordnen von bauteilen auf einem traeger
US4817273A (en) * 1987-04-30 1989-04-04 Reliability Incorporated Burn-in board loader and unloader
EP0500246B1 (de) * 1991-02-20 1996-05-08 Matsumoto Giken Co., Ltd. Vorrichtung zur Halterung und Positionierung von elektronischen Chips
US5348316A (en) * 1992-07-16 1994-09-20 National Semiconductor Corporation Die collet with cavity wall recess
US5273441A (en) * 1992-11-12 1993-12-28 The Whitaker Corporation SMA burn-in socket
JP3183591B2 (ja) * 1993-07-02 2001-07-09 三菱電機株式会社 半導体デバイスのテストシステム、半導体デバイスのテスト方法、半導体デバイス挿抜ステーション及びテスト用チャンバ
DE4338852A1 (de) * 1993-11-13 1995-05-18 Kvh Verbautechnik Gmbh Transportgreifer mit Blockiervorrichtung
DE4406771C2 (de) * 1994-03-02 1997-02-06 Fraunhofer Ges Forschung Greifer für einen Industrieroboter
JP2789167B2 (ja) * 1994-06-01 1998-08-20 エスエムシー株式会社 揺動開閉チャック
US6019564A (en) * 1995-10-27 2000-02-01 Advantest Corporation Semiconductor device transporting and handling apparatus
DE19626505A1 (de) * 1996-07-02 1998-01-08 Mci Computer Gmbh Verfahren zur Handhabung von elektronischen Bauelementen in der Endmontage

Also Published As

Publication number Publication date
MY116127A (en) 2003-11-28
CN1057403C (zh) 2000-10-11
US5951720A (en) 1999-09-14
CN1184021A (zh) 1998-06-10
KR19980063356A (ko) 1998-10-07
JPH10160794A (ja) 1998-06-19
DE19743211A1 (de) 1998-06-04
DE19743211C2 (de) 2002-09-05
KR100253935B1 (ko) 2000-04-15

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