SG68622A1 - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- SG68622A1 SG68622A1 SG1997002359A SG1997002359A SG68622A1 SG 68622 A1 SG68622 A1 SG 68622A1 SG 1997002359 A SG1997002359 A SG 1997002359A SG 1997002359 A SG1997002359 A SG 1997002359A SG 68622 A1 SG68622 A1 SG 68622A1
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/80—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41741—Source or drain electrodes for field effect devices for vertical or pseudo-vertical devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41758—Source or drain electrodes for field effect devices for lateral devices with structured layout for source or drain region, i.e. the source or drain region having cellular, interdigitated or ring structure or being curved or angular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Junction Field-Effect Transistors (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8177863A JPH1022299A (ja) | 1996-07-08 | 1996-07-08 | 半導体集積回路 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG68622A1 true SG68622A1 (en) | 1999-11-16 |
Family
ID=16038399
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1997002359A SG68622A1 (en) | 1996-07-08 | 1997-07-03 | Semiconductor device |
Country Status (8)
Country | Link |
---|---|
US (1) | US5949106A (ko) |
EP (1) | EP0818828A1 (ko) |
JP (1) | JPH1022299A (ko) |
KR (1) | KR100349048B1 (ko) |
CN (1) | CN1174410A (ko) |
CA (1) | CA2209620A1 (ko) |
SG (1) | SG68622A1 (ko) |
TW (1) | TW365070B (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6297700B1 (en) * | 2000-02-18 | 2001-10-02 | Ultrarf, Inc. | RF power transistor having cascaded cells with phase matching between cells |
JP4313544B2 (ja) * | 2002-05-15 | 2009-08-12 | 富士通マイクロエレクトロニクス株式会社 | 半導体集積回路 |
US9005549B2 (en) | 2003-01-17 | 2015-04-14 | Greiner Bio-One Gmbh | High throughput polymer-based microarray slide |
CN104363700B (zh) * | 2014-11-13 | 2018-02-13 | 深圳市华星光电技术有限公司 | 印刷电路板 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60200547A (ja) * | 1984-03-23 | 1985-10-11 | Fujitsu Ltd | 半導体装置 |
US4875138A (en) * | 1986-10-20 | 1989-10-17 | United Technologies Corporation | Variable pitch IC bond pad arrangement |
US4753820A (en) * | 1986-10-20 | 1988-06-28 | United Technologies Corporation | Variable pitch IC bond pad arrangement |
JP2560805B2 (ja) * | 1988-10-06 | 1996-12-04 | 三菱電機株式会社 | 半導体装置 |
JPH03201447A (ja) * | 1989-12-28 | 1991-09-03 | Nippon Mining Co Ltd | 電界効果トランジスタの製造方法 |
JPH0411743A (ja) * | 1990-04-28 | 1992-01-16 | Nec Corp | 半導体装置 |
JP2976634B2 (ja) * | 1991-10-25 | 1999-11-10 | 日本電気株式会社 | 半導体集積回路 |
JPH05183161A (ja) * | 1991-12-25 | 1993-07-23 | Fujitsu Ltd | 半導体装置 |
JP3105654B2 (ja) * | 1992-08-18 | 2000-11-06 | 日本電気株式会社 | 多給電型複合トランジスタ |
JPH08111618A (ja) * | 1994-08-19 | 1996-04-30 | Toshiba Corp | マイクロ波半導体装置 |
US6150722A (en) * | 1994-11-02 | 2000-11-21 | Texas Instruments Incorporated | Ldmos transistor with thick copper interconnect |
JPH0945723A (ja) * | 1995-07-31 | 1997-02-14 | Rohm Co Ltd | 半導体チップおよびこの半導体チップを組み込んだ半導体装置ならびにその製造方法 |
EP0766309A3 (en) * | 1995-08-28 | 1998-04-29 | Texas Instruments Incorporated | Field effect transistor which multi-level metallisation related to integrated circuits |
US5796171A (en) * | 1996-06-07 | 1998-08-18 | Lsi Logic Corporation | Progressive staggered bonding pads |
-
1996
- 1996-07-08 JP JP8177863A patent/JPH1022299A/ja active Pending
-
1997
- 1997-06-28 TW TW086109103A patent/TW365070B/zh not_active IP Right Cessation
- 1997-07-01 EP EP97110821A patent/EP0818828A1/en not_active Withdrawn
- 1997-07-03 SG SG1997002359A patent/SG68622A1/en unknown
- 1997-07-07 CA CA002209620A patent/CA2209620A1/en not_active Abandoned
- 1997-07-08 KR KR1019970031486A patent/KR100349048B1/ko not_active IP Right Cessation
- 1997-07-08 CN CN97117875A patent/CN1174410A/zh active Pending
- 1997-07-08 US US08/887,905 patent/US5949106A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH1022299A (ja) | 1998-01-23 |
KR980012640A (ko) | 1998-04-30 |
EP0818828A1 (en) | 1998-01-14 |
KR100349048B1 (ko) | 2002-12-18 |
CN1174410A (zh) | 1998-02-25 |
CA2209620A1 (en) | 1998-01-08 |
TW365070B (en) | 1999-07-21 |
US5949106A (en) | 1999-09-07 |
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