SG64438A1 - Coating method and apparatus for semiconductor process - Google Patents
Coating method and apparatus for semiconductor processInfo
- Publication number
- SG64438A1 SG64438A1 SG1997003066A SG1997003066A SG64438A1 SG 64438 A1 SG64438 A1 SG 64438A1 SG 1997003066 A SG1997003066 A SG 1997003066A SG 1997003066 A SG1997003066 A SG 1997003066A SG 64438 A1 SG64438 A1 SG 64438A1
- Authority
- SG
- Singapore
- Prior art keywords
- coating method
- semiconductor process
- semiconductor
- coating
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
- B05D1/005—Spin coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/10—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by other chemical means
- B05D3/104—Pretreatment of other substrates
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24922696A JP3254574B2 (ja) | 1996-08-30 | 1996-08-30 | 塗布膜形成方法及びその装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG64438A1 true SG64438A1 (en) | 1999-04-27 |
Family
ID=17189804
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1997003066A SG64438A1 (en) | 1996-08-30 | 1997-08-27 | Coating method and apparatus for semiconductor process |
Country Status (5)
Country | Link |
---|---|
US (2) | US5919520A (ja) |
JP (1) | JP3254574B2 (ja) |
KR (1) | KR100366602B1 (ja) |
SG (1) | SG64438A1 (ja) |
TW (1) | TW336329B (ja) |
Families Citing this family (71)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5849084A (en) * | 1996-06-21 | 1998-12-15 | Micron Technology, Inc. | Spin coating dispense arm assembly |
US6207231B1 (en) * | 1997-05-07 | 2001-03-27 | Tokyo Electron Limited | Coating film forming method and coating apparatus |
TW396382B (en) * | 1997-07-03 | 2000-07-01 | Tokyo Electron Ltd | Solution treatment apparatus |
TW442336B (en) * | 1997-08-19 | 2001-06-23 | Tokyo Electron Ltd | Film forming method |
US6495205B1 (en) | 1998-02-17 | 2002-12-17 | Fastar, Ltd. | Linear extrusion coating system and method |
US6248171B1 (en) * | 1998-09-17 | 2001-06-19 | Silicon Valley Group, Inc. | Yield and line width performance for liquid polymers and other materials |
US6689215B2 (en) | 1998-09-17 | 2004-02-10 | Asml Holdings, N.V. | Method and apparatus for mitigating cross-contamination between liquid dispensing jets in close proximity to a surface |
US6548115B1 (en) * | 1998-11-30 | 2003-04-15 | Fastar, Ltd. | System and method for providing coating of substrates |
US6382849B1 (en) * | 1999-06-09 | 2002-05-07 | Tokyo Electron Limited | Developing method and developing apparatus |
US6539963B1 (en) | 1999-07-14 | 2003-04-01 | Micron Technology, Inc. | Pressurized liquid diffuser |
US6616760B2 (en) * | 1999-12-17 | 2003-09-09 | Tokyo Electron Limited | Film forming unit |
US6384894B2 (en) | 2000-01-21 | 2002-05-07 | Tokyo Electron Limited | Developing method and developing unit |
US6796517B1 (en) | 2000-03-09 | 2004-09-28 | Advanced Micro Devices, Inc. | Apparatus for the application of developing solution to a semiconductor wafer |
TW520469B (en) * | 2000-04-10 | 2003-02-11 | Asml Netherlands Bv | Lithographic apparatus, device manufacturing method, and device manufactured thereby |
US6326319B1 (en) | 2000-07-03 | 2001-12-04 | Advanced Micro Devices, Inc. | Method for coating ultra-thin resist films |
US6746826B1 (en) | 2000-07-25 | 2004-06-08 | Asml Holding N.V. | Method for an improved developing process in wafer photolithography |
JP3898906B2 (ja) * | 2001-05-22 | 2007-03-28 | 東京エレクトロン株式会社 | 基板の塗布装置 |
US6592939B1 (en) * | 2001-06-06 | 2003-07-15 | Advanced Micro Devices, Inc. | System for and method of using developer as a solvent to spread photoresist faster and reduce photoresist consumption |
US6875276B2 (en) * | 2001-06-15 | 2005-04-05 | Chiral Photonics, Inc. | Apparatus and method for fabricating layered periodic media |
JP3869306B2 (ja) | 2001-08-28 | 2007-01-17 | 東京エレクトロン株式会社 | 現像処理方法および現像液塗布装置 |
JP3992480B2 (ja) * | 2001-11-12 | 2007-10-17 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法ならびに基板処理システム |
US6811613B2 (en) * | 2001-11-26 | 2004-11-02 | Tokyo Electron Limited | Coating film forming apparatus |
JP3957640B2 (ja) * | 2002-02-21 | 2007-08-15 | アイシン化工株式会社 | 幅広スリットノズル及び幅広スリットノズルによる塗装方法 |
WO2003105201A1 (ja) * | 2002-06-07 | 2003-12-18 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び現像装置 |
US20030230323A1 (en) * | 2002-06-14 | 2003-12-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus and method for improving scrubber cleaning |
JP4179834B2 (ja) * | 2002-09-19 | 2008-11-12 | 株式会社リコー | 半導体装置の製造装置及び製造方法 |
KR100935281B1 (ko) * | 2003-03-06 | 2010-01-06 | 도쿄엘렉트론가부시키가이샤 | 처리액 공급노즐 및 처리액 공급장치 |
JP4357189B2 (ja) * | 2003-03-07 | 2009-11-04 | 株式会社リコー | 半導体装置の製造装置及び半導体装置の製造方法 |
KR100984349B1 (ko) * | 2003-05-28 | 2010-09-30 | 삼성전자주식회사 | 도포 장치 |
KR100540633B1 (ko) * | 2003-06-20 | 2006-01-11 | 주식회사 탑 엔지니어링 | 페이스트 도포기 및 그 제어 방법 |
JP4398786B2 (ja) * | 2003-07-23 | 2010-01-13 | 東京エレクトロン株式会社 | 塗布方法及び塗布装置 |
JP2005046694A (ja) * | 2003-07-31 | 2005-02-24 | Toshiba Corp | 塗布膜形成方法及び塗布装置 |
US7713841B2 (en) * | 2003-09-19 | 2010-05-11 | Micron Technology, Inc. | Methods for thinning semiconductor substrates that employ support structures formed on the substrates |
US20050064683A1 (en) * | 2003-09-19 | 2005-03-24 | Farnworth Warren M. | Method and apparatus for supporting wafers for die singulation and subsequent handling |
US20050064679A1 (en) * | 2003-09-19 | 2005-03-24 | Farnworth Warren M. | Consolidatable composite materials, articles of manufacture formed therefrom, and fabrication methods |
JP4414753B2 (ja) * | 2003-12-26 | 2010-02-10 | 東京エレクトロン株式会社 | 現像装置及び現像処理方法 |
US20050175775A1 (en) * | 2004-02-06 | 2005-08-11 | Shirley Paul D. | Device and method for forming improved resist layer |
KR100557222B1 (ko) * | 2004-04-28 | 2006-03-07 | 동부아남반도체 주식회사 | 이머전 리소그라피 공정의 액체 제거 장치 및 방법 |
US7244665B2 (en) | 2004-04-29 | 2007-07-17 | Micron Technology, Inc. | Wafer edge ring structures and methods of formation |
US7384878B2 (en) * | 2004-05-20 | 2008-06-10 | International Business Machines Corporation | Method for applying a layer to a hydrophobic surface |
KR100611060B1 (ko) * | 2004-12-07 | 2006-08-09 | 삼성전자주식회사 | 기판 상으로 용액을 공급하기 위한 장치 |
US7699021B2 (en) | 2004-12-22 | 2010-04-20 | Sokudo Co., Ltd. | Cluster tool substrate throughput optimization |
US7819079B2 (en) | 2004-12-22 | 2010-10-26 | Applied Materials, Inc. | Cartesian cluster tool configuration for lithography type processes |
US7255747B2 (en) | 2004-12-22 | 2007-08-14 | Sokudo Co., Ltd. | Coat/develop module with independent stations |
US7798764B2 (en) | 2005-12-22 | 2010-09-21 | Applied Materials, Inc. | Substrate processing sequence in a cartesian robot cluster tool |
US7651306B2 (en) | 2004-12-22 | 2010-01-26 | Applied Materials, Inc. | Cartesian robot cluster tool architecture |
KR100780718B1 (ko) * | 2004-12-28 | 2007-12-26 | 엘지.필립스 엘시디 주식회사 | 도포액 공급장치를 구비한 슬릿코터 |
US7358199B2 (en) * | 2005-06-09 | 2008-04-15 | United Microelectronics Corp. | Method of fabricating semiconductor integrated circuits |
KR100934834B1 (ko) * | 2005-06-20 | 2009-12-31 | 엘지디스플레이 주식회사 | 도포액 도포장치 및 이를 이용한 액정표시장치의 제조방법 |
US7766566B2 (en) * | 2005-08-03 | 2010-08-03 | Tokyo Electron Limited | Developing treatment apparatus and developing treatment method |
JP4514224B2 (ja) * | 2005-09-28 | 2010-07-28 | 東京エレクトロン株式会社 | リンス処理方法、現像処理方法及び現像装置 |
US20070154210A1 (en) * | 2006-01-04 | 2007-07-05 | Applied Materials, Inc. | Method and apparatus for dispense pump calibration in a track lithography system |
KR100794332B1 (ko) * | 2006-05-26 | 2008-01-15 | (주)유스텍 | 대상물 고정감지장치 |
JP5337357B2 (ja) * | 2007-07-06 | 2013-11-06 | 東京応化工業株式会社 | 塗布装置 |
KR100872870B1 (ko) | 2007-11-07 | 2008-12-10 | 세메스 주식회사 | 순환 노즐 및 그를 포함하는 약액 공급 장치 |
KR101000944B1 (ko) * | 2008-10-09 | 2010-12-13 | 세메스 주식회사 | 처리액 공급 유닛과 이를 이용한 기판 처리 장치 및 방법 |
TW201127498A (en) * | 2010-02-08 | 2011-08-16 | Hon Hai Prec Ind Co Ltd | Nozzle apparatus and coater system |
CN102221784B (zh) * | 2010-04-19 | 2013-07-24 | 北京京东方光电科技有限公司 | 胶涂覆设备及胶涂覆方法 |
US8236705B2 (en) | 2010-07-26 | 2012-08-07 | International Business Machines Corporation | Deposition of viscous material |
KR101471540B1 (ko) * | 2011-05-11 | 2014-12-11 | 세메스 주식회사 | 기판처리방법 및 기판처리장치 |
US8906452B1 (en) | 2011-06-03 | 2014-12-09 | Gary Hillman | Rapid coating of wafers |
KR20130060925A (ko) * | 2011-11-30 | 2013-06-10 | 주식회사 탑 엔지니어링 | 도포장치 |
US20130305986A1 (en) * | 2012-05-18 | 2013-11-21 | Wenching Tsai | Liquid Crystal Suction Device and Liquid Crystal Coating Equipment |
US8944001B2 (en) * | 2013-02-18 | 2015-02-03 | Nordson Corporation | Automated position locator for a height sensor in a dispensing system |
JP6182347B2 (ja) * | 2013-04-19 | 2017-08-16 | 株式会社荏原製作所 | 基板処理装置 |
US9375743B2 (en) * | 2013-05-30 | 2016-06-28 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Spray nozzle, spraying device having the spray nozzle and method for spraying |
DE102014113927B4 (de) * | 2014-09-25 | 2023-10-05 | Suss Microtec Lithography Gmbh | Verfahren zum Beschichten eines Substrats sowie Beschichtungsanlage |
DE102014116830A1 (de) * | 2014-11-18 | 2016-05-19 | Intec Bielenberg Gmbh & Co Kg | Vorrichtung zum Dämmmattenauftrag |
CN111739823A (zh) * | 2020-06-29 | 2020-10-02 | 中国科学院微电子研究所 | 光刻胶涂布喷嘴及具有其的光刻胶涂布设备 |
CN112827721A (zh) * | 2020-12-30 | 2021-05-25 | 龙游盛邦包装材料有限公司 | 一种转移膜涂布系统及其涂布方法 |
US20230197463A1 (en) * | 2021-12-21 | 2023-06-22 | Canon Kabushiki Kaisha | Apparatus including a substrate chuck, a dispenser, and a planarization head and methods of using the same |
Family Cites Families (31)
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US3457094A (en) * | 1967-11-15 | 1969-07-22 | Armin Elmendorf | Method of upgrading low grade plywood |
US4564280A (en) * | 1982-10-28 | 1986-01-14 | Fujitsu Limited | Method and apparatus for developing resist film including a movable nozzle arm |
US4451507A (en) * | 1982-10-29 | 1984-05-29 | Rca Corporation | Automatic liquid dispensing apparatus for spinning surface of uniform thickness |
US4510176A (en) * | 1983-09-26 | 1985-04-09 | At&T Bell Laboratories | Removal of coating from periphery of a semiconductor wafer |
JPH0680531B2 (ja) * | 1984-12-11 | 1994-10-12 | 富士写真フイルム株式会社 | 磁気記録媒体塗布方法 |
US5183508A (en) * | 1987-11-23 | 1993-02-02 | Epicor Technology, Inc. | Apparatus for patch coating printed circuit boards |
US4849296A (en) | 1987-12-28 | 1989-07-18 | Dow Corning Corporation | Multilayer ceramic coatings from metal oxides and hydrogen silsesquioxane resin ceramified in ammonia |
US5002008A (en) * | 1988-05-27 | 1991-03-26 | Tokyo Electron Limited | Coating apparatus and method for applying a liquid to a semiconductor wafer, including selecting a nozzle in a stand-by state |
JPH0319110A (ja) | 1989-06-16 | 1991-01-28 | Canon Electron Inc | 磁気ヘッド |
US4964362A (en) * | 1988-12-13 | 1990-10-23 | Gilbert Dominguez | Applicator for motor vehicle glass adhesives and sealants |
SG63582A1 (en) * | 1989-06-14 | 1999-03-30 | Hewlett Packard Co | Method for improving deposit of photoresist on wafers |
US5183684A (en) | 1989-11-20 | 1993-02-02 | Dow Corning Corporation | Single and multilayer coatings containing aluminum nitride |
US5094884A (en) * | 1990-04-24 | 1992-03-10 | Machine Technology, Inc. | Method and apparatus for applying a layer of a fluid material on a semiconductor wafer |
JP2601365B2 (ja) * | 1990-04-13 | 1997-04-16 | 富士写真フイルム株式会社 | 塗布方法 |
US5408109A (en) | 1991-02-27 | 1995-04-18 | The Regents Of The University Of California | Visible light emitting diodes fabricated from soluble semiconducting polymers |
JP2633106B2 (ja) * | 1991-05-24 | 1997-07-23 | シャープ株式会社 | レジスト塗布装置 |
JPH04372113A (ja) * | 1991-06-21 | 1992-12-25 | Fujitsu Ltd | 回路パターンの形成方法 |
JP2740588B2 (ja) * | 1991-07-24 | 1998-04-15 | 日立テクノエンジニアリング株式会社 | 塗布描画装置 |
JP3097786B2 (ja) * | 1992-04-16 | 2000-10-10 | 富士写真フイルム株式会社 | 有機溶剤系塗布液の塗布方法 |
JP2916557B2 (ja) * | 1992-04-16 | 1999-07-05 | 富士写真フイルム株式会社 | 塗布装置 |
JP2942938B2 (ja) * | 1992-10-20 | 1999-08-30 | 富士写真フイルム株式会社 | 塗布方法 |
KR100284556B1 (ko) * | 1993-03-25 | 2001-04-02 | 다카시마 히로시 | 도포막 형성방법 및 그를 위한 장치 |
JPH078879A (ja) * | 1993-06-23 | 1995-01-13 | Hirata Corp | 流体塗布装置 |
JPH078880A (ja) * | 1993-06-24 | 1995-01-13 | Hirata Corp | 流体塗布装置 |
JPH0731168A (ja) * | 1993-07-09 | 1995-01-31 | Toyo Electric Mfg Co Ltd | 超音波モータ |
JPH0780386A (ja) * | 1993-09-10 | 1995-03-28 | Hirata Corp | 塗布ヘッドのクリーニング方法及び塗布ヘッドクリーニング装置 |
JPH0780384A (ja) * | 1993-09-10 | 1995-03-28 | Hirata Corp | 流体塗布装置 |
JPH0780385A (ja) * | 1993-09-10 | 1995-03-28 | Hirata Corp | 塗布ヘッド洗浄装置及び塗布ヘッドの洗浄方法 |
JP3224113B2 (ja) * | 1993-10-20 | 2001-10-29 | 富士写真フイルム株式会社 | 塗布方法 |
US5826129A (en) * | 1994-06-30 | 1998-10-20 | Tokyo Electron Limited | Substrate processing system |
US5705223A (en) * | 1994-07-26 | 1998-01-06 | International Business Machine Corp. | Method and apparatus for coating a semiconductor wafer |
-
1996
- 1996-08-30 JP JP24922696A patent/JP3254574B2/ja not_active Expired - Fee Related
-
1997
- 1997-08-27 SG SG1997003066A patent/SG64438A1/en unknown
- 1997-08-27 TW TW086112333A patent/TW336329B/zh active
- 1997-08-28 US US08/919,503 patent/US5919520A/en not_active Expired - Fee Related
- 1997-08-28 KR KR1019970041992A patent/KR100366602B1/ko not_active IP Right Cessation
-
1999
- 1999-03-17 US US09/270,781 patent/US6749688B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US6749688B2 (en) | 2004-06-15 |
US20020110640A1 (en) | 2002-08-15 |
TW336329B (en) | 1998-07-11 |
JP3254574B2 (ja) | 2002-02-12 |
US5919520A (en) | 1999-07-06 |
KR100366602B1 (ko) | 2003-05-01 |
KR19980019104A (ko) | 1998-06-05 |
JPH1074691A (ja) | 1998-03-17 |
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