SG60109A1 - Epoxy resin composition and semiconductor device encapsulated therewith - Google Patents
Epoxy resin composition and semiconductor device encapsulated therewithInfo
- Publication number
- SG60109A1 SG60109A1 SG1997003173A SG1997003173A SG60109A1 SG 60109 A1 SG60109 A1 SG 60109A1 SG 1997003173 A SG1997003173 A SG 1997003173A SG 1997003173 A SG1997003173 A SG 1997003173A SG 60109 A1 SG60109 A1 SG 60109A1
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor device
- resin composition
- epoxy resin
- device encapsulated
- encapsulated therewith
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24702496 | 1996-08-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG60109A1 true SG60109A1 (en) | 1999-02-22 |
Family
ID=17157278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG1997003173A SG60109A1 (en) | 1996-08-29 | 1997-08-29 | Epoxy resin composition and semiconductor device encapsulated therewith |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US5940688A (ko) |
| EP (1) | EP0827159B1 (ko) |
| KR (1) | KR100251853B1 (ko) |
| CN (1) | CN1139626C (ko) |
| DE (1) | DE69722106T2 (ko) |
| MY (1) | MY113659A (ko) |
| SG (1) | SG60109A1 (ko) |
| TW (1) | TW474968B (ko) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3611066B2 (ja) * | 1996-08-29 | 2005-01-19 | 株式会社ルネサステクノロジ | 無機質充填剤及びエポキシ樹脂組成物の製造方法 |
| US6221689B1 (en) * | 1997-10-24 | 2001-04-24 | Apack Technologies Inc. | Method for improving the reliability of underfill process for a chip |
| JP3853979B2 (ja) * | 1998-06-16 | 2006-12-06 | 日東電工株式会社 | 半導体装置の製法 |
| US6376923B1 (en) * | 1999-06-08 | 2002-04-23 | Shin-Etsu Chemical Co., Ltd. | Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device |
| TWI257935B (en) * | 1999-10-06 | 2006-07-11 | Nitto Denko Corp | Resin composition for sealing semiconductor and semiconductor device using the same and method for producing semiconductor device |
| JP3836649B2 (ja) | 1999-11-22 | 2006-10-25 | 協和化学工業株式会社 | 半導体封止用樹脂組成物およびその成型品 |
| US6670430B1 (en) | 1999-12-17 | 2003-12-30 | Henkel Loctite Corporation | Thermosetting resin compositions comprising epoxy resins, adhesion promoters, and curatives based on the combination of nitrogen compounds and transition metal complexes |
| US6617399B2 (en) | 1999-12-17 | 2003-09-09 | Henkel Loctite Corporation | Thermosetting resin compositions comprising epoxy resins, adhesion promoters, curatives based on the combination of nitrogen compounds and transition metal complexes, and polysulfide tougheners |
| EP1818975A3 (en) * | 2000-02-25 | 2010-09-29 | Ibiden Co., Ltd. | Multilayer printed circuit board and multilayer printed circuit board manufacturing method |
| JP4438973B2 (ja) * | 2000-05-23 | 2010-03-24 | アムコア テクノロジー，インコーポレイテッド | シート状樹脂組成物及びそれを用いた半導体装置の製造方法 |
| KR101093471B1 (ko) | 2000-09-25 | 2011-12-13 | 이비덴 가부시키가이샤 | 반도체소자,반도체소자의 제조방법,다층프린트배선판 및 다층프린트배선판의 제조방법 |
| DE10144871A1 (de) * | 2001-09-12 | 2003-03-27 | Bosch Gmbh Robert | Vergußmasse mit hoher thermischer Stabilität |
| EP1300439A1 (de) * | 2001-09-26 | 2003-04-09 | Abb Research Ltd. | Füllstoff für die Verwendung in elektrischen Feststoff-Isolatoren |
| US6893736B2 (en) * | 2001-11-19 | 2005-05-17 | Henkel Corporation | Thermosetting resin compositions useful as underfill sealants |
| US6951907B1 (en) | 2001-11-19 | 2005-10-04 | Henkel Corporation | Composition of epoxy resin, secondary amine-functional adhesion promotor and curative of nitrogen-compound and transition metal complex |
| DE10208644A1 (de) * | 2002-02-28 | 2003-09-11 | Bakelite Ag | Verfahren zur Herstellung und Verarbeitung von Epoxidharz-Formmassen |
| JP4421972B2 (ja) * | 2004-04-30 | 2010-02-24 | 日東電工株式会社 | 半導体装置の製法 |
| CN101208386B (zh) * | 2005-08-02 | 2012-07-18 | 第一毛织株式会社 | 一种用于封装半导体设备的环氧树脂组合物 |
| JP2007169602A (ja) * | 2005-11-01 | 2007-07-05 | Shin Etsu Chem Co Ltd | 液状エポキシ樹脂組成物 |
| JP2014091744A (ja) * | 2012-10-31 | 2014-05-19 | 3M Innovative Properties Co | アンダーフィル組成物、半導体装置およびその製造方法 |
| KR101692668B1 (ko) * | 2016-03-10 | 2017-01-04 | (주)호전에이블 | 칙소성이 우수한 에폭시 플럭스 페이스트 조성물 |
| MY177304A (en) * | 2017-03-31 | 2020-09-11 | Hitachi Chemical Co Ltd | Protective material for electronic circuit, sealing material for protective material for electronic circuit, sealing method, and method for manufacturing semiconductor device |
| KR101965620B1 (ko) * | 2017-11-07 | 2019-04-03 | (주)호전에이블 | 방열성 에폭시 플럭스 필름 및 이를 이용한 솔더링 방법 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2864584B2 (ja) * | 1989-12-05 | 1999-03-03 | 日立化成工業株式会社 | 半導体用エポキシ樹脂組成物および半導体装置の製造法 |
| JP3080276B2 (ja) * | 1992-09-24 | 2000-08-21 | 住友ベークライト株式会社 | 半導体封止用樹脂組成物 |
-
1997
- 1997-08-25 DE DE69722106T patent/DE69722106T2/de not_active Expired - Lifetime
- 1997-08-25 EP EP97114666A patent/EP0827159B1/en not_active Expired - Lifetime
- 1997-08-27 MY MYPI97003952A patent/MY113659A/en unknown
- 1997-08-28 CN CNB971205191A patent/CN1139626C/zh not_active Expired - Fee Related
- 1997-08-28 US US08/919,242 patent/US5940688A/en not_active Expired - Lifetime
- 1997-08-28 TW TW086112407A patent/TW474968B/zh not_active IP Right Cessation
- 1997-08-29 SG SG1997003173A patent/SG60109A1/en unknown
- 1997-08-29 KR KR1019970042520A patent/KR100251853B1/ko not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR19980019140A (ko) | 1998-06-05 |
| DE69722106T2 (de) | 2004-04-01 |
| EP0827159A3 (en) | 1998-04-15 |
| EP0827159A2 (en) | 1998-03-04 |
| US5940688A (en) | 1999-08-17 |
| EP0827159B1 (en) | 2003-05-21 |
| TW474968B (en) | 2002-02-01 |
| KR100251853B1 (ko) | 2000-04-15 |
| DE69722106D1 (de) | 2003-06-26 |
| CN1139626C (zh) | 2004-02-25 |
| MY113659A (en) | 2002-04-30 |
| CN1179444A (zh) | 1998-04-22 |
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