SG55368A1 - Abrasive composition and use of the same - Google Patents
Abrasive composition and use of the sameInfo
- Publication number
- SG55368A1 SG55368A1 SG1997003156A SG1997003156A SG55368A1 SG 55368 A1 SG55368 A1 SG 55368A1 SG 1997003156 A SG1997003156 A SG 1997003156A SG 1997003156 A SG1997003156 A SG 1997003156A SG 55368 A1 SG55368 A1 SG 55368A1
- Authority
- SG
- Singapore
- Prior art keywords
- same
- abrasive composition
- abrasive
- composition
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
- C04B35/111—Fine ceramics
- C04B35/1115—Minute sintered entities, e.g. sintered abrasive grains or shaped particles such as platelets
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
- C23F3/02—Light metals
- C23F3/03—Light metals with acidic solutions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/12—Surface area
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22818696 | 1996-08-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG55368A1 true SG55368A1 (en) | 1998-12-21 |
Family
ID=16872562
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1997003156A SG55368A1 (en) | 1996-08-29 | 1997-08-28 | Abrasive composition and use of the same |
Country Status (5)
Country | Link |
---|---|
US (1) | US5804513A (fr) |
EP (1) | EP0826757A1 (fr) |
KR (1) | KR19980019046A (fr) |
CN (1) | CN1176283A (fr) |
SG (1) | SG55368A1 (fr) |
Families Citing this family (72)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5958288A (en) * | 1996-11-26 | 1999-09-28 | Cabot Corporation | Composition and slurry useful for metal CMP |
US6068787A (en) * | 1996-11-26 | 2000-05-30 | Cabot Corporation | Composition and slurry useful for metal CMP |
JPH10166258A (ja) * | 1996-12-06 | 1998-06-23 | Tadahiro Omi | 研磨剤組成物 |
US5759917A (en) * | 1996-12-30 | 1998-06-02 | Cabot Corporation | Composition for oxide CMP |
US5993685A (en) * | 1997-04-02 | 1999-11-30 | Advanced Technology Materials | Planarization composition for removing metal films |
US20090255189A1 (en) * | 1998-08-19 | 2009-10-15 | Nanogram Corporation | Aluminum oxide particles |
US6083419A (en) * | 1997-07-28 | 2000-07-04 | Cabot Corporation | Polishing composition including an inhibitor of tungsten etching |
JPH1187286A (ja) * | 1997-09-05 | 1999-03-30 | Lsi Logic Corp | 半導体ウエハの二段階式化学的機械的研磨方法及び装置 |
US6149696A (en) * | 1997-11-06 | 2000-11-21 | Komag, Inc. | Colloidal silica slurry for NiP plated disk polishing |
JPH11181403A (ja) * | 1997-12-18 | 1999-07-06 | Hitachi Chem Co Ltd | 酸化セリウム研磨剤及び基板の研磨法 |
US5989301A (en) | 1998-02-18 | 1999-11-23 | Saint-Gobain Industrial Ceramics, Inc. | Optical polishing formulation |
US6475407B2 (en) * | 1998-05-19 | 2002-11-05 | Showa Denko K.K. | Composition for polishing metal on semiconductor wafer and method of using same |
US6435947B2 (en) | 1998-05-26 | 2002-08-20 | Cabot Microelectronics Corporation | CMP polishing pad including a solid catalyst |
US6177026B1 (en) * | 1998-05-26 | 2001-01-23 | Cabot Microelectronics Corporation | CMP slurry containing a solid catalyst |
US6159076A (en) * | 1998-05-28 | 2000-12-12 | Komag, Inc. | Slurry comprising a ligand or chelating agent for polishing a surface |
TW430946B (en) * | 1998-07-22 | 2001-04-21 | United Microelectronics Corp | Dual damascene process |
TW512170B (en) * | 1998-07-24 | 2002-12-01 | Ibm | Aqueous slurry composition and method for polishing a surface using the same |
FR2781922B1 (fr) * | 1998-07-31 | 2001-11-23 | Clariant France Sa | Procede de polissage mecano-chimique d'une couche en un materiau a base de cuivre |
US6124207A (en) * | 1998-08-31 | 2000-09-26 | Micron Technology, Inc. | Slurries for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods and apparatuses for making and using such slurries |
US6270395B1 (en) * | 1998-09-24 | 2001-08-07 | Alliedsignal, Inc. | Oxidizing polishing slurries for low dielectric constant materials |
US6171963B1 (en) * | 1998-11-30 | 2001-01-09 | Worldwide Semiconductor Manufacturing Corporation | Method for forming a planar intermetal dielectric using a barrier layer |
KR100305212B1 (ko) * | 1998-12-28 | 2001-09-24 | 박종섭 | 화학적기계적연마용슬러리의제조방법 |
US6375693B1 (en) | 1999-05-07 | 2002-04-23 | International Business Machines Corporation | Chemical-mechanical planarization of barriers or liners for copper metallurgy |
US6238450B1 (en) | 1999-06-16 | 2001-05-29 | Saint-Gobain Industrial Ceramics, Inc. | Ceria powder |
US6322425B1 (en) | 1999-07-30 | 2001-11-27 | Corning Incorporated | Colloidal polishing of fused silica |
US6159077A (en) * | 1999-07-30 | 2000-12-12 | Corning Incorporated | Colloidal silica polishing abrasive |
US6368969B1 (en) * | 2000-06-30 | 2002-04-09 | International Business Machines Corporation | Chemical-mechanical polishing methods |
JP3993369B2 (ja) * | 2000-07-14 | 2007-10-17 | 株式会社東芝 | 半導体装置の製造方法 |
US6551935B1 (en) * | 2000-08-31 | 2003-04-22 | Micron Technology, Inc. | Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods |
DE10054345A1 (de) | 2000-11-02 | 2002-05-08 | Degussa | Wäßrige Dispersion, Verfahren zu deren Herstellung und Verwendung |
US6326305B1 (en) * | 2000-12-05 | 2001-12-04 | Advanced Micro Devices, Inc. | Ceria removal in chemical-mechanical polishing of integrated circuits |
US7887714B2 (en) * | 2000-12-25 | 2011-02-15 | Nissan Chemical Industries, Ltd. | Cerium oxide sol and abrasive |
US6383065B1 (en) | 2001-01-22 | 2002-05-07 | Cabot Microelectronics Corporation | Catalytic reactive pad for metal CMP |
EP2418258A1 (fr) * | 2001-02-20 | 2012-02-15 | Hitachi Chemical Company, Ltd. | Suspension de polissage et procédé pour polir un substrat |
EP1234800A1 (fr) * | 2001-02-22 | 2002-08-28 | Degussa Aktiengesellschaft | Wässrige Dispersion, Verfahren zu ihrer Herstellung und Verwendung |
US20030003747A1 (en) * | 2001-06-29 | 2003-01-02 | Jae Hong Kim | Chemical mechanical polishing slurry for ruthenium titanium nitride and polishing process using the same |
US7507268B2 (en) * | 2001-08-02 | 2009-03-24 | 3M Innovative Properties Company | Al2O3-Y2O3-ZrO2/HfO2 materials, and methods of making and using the same |
BR0211576A (pt) | 2001-08-02 | 2004-06-29 | 3M Innovative Properties Co | Método para fabricar um artigo a partir de vidro |
BR0211580A (pt) * | 2001-08-02 | 2004-07-13 | 3M Innovative Properties Co | Métodos para a fabricação de material amorfo, de cerâmica compreendendo vidro, de um artigo compreendendo vidro, de vidro-cerâmica, de um artigo de vidro-cerâmica e de partìculas abrasivas |
US7563293B2 (en) | 2001-08-02 | 2009-07-21 | 3M Innovative Properties Company | Al2O3-rare earth oxide-ZrO2/HfO2 materials, and methods of making and using the same |
TW591089B (en) * | 2001-08-09 | 2004-06-11 | Cheil Ind Inc | Slurry composition for use in chemical mechanical polishing of metal wiring |
US6953389B2 (en) * | 2001-08-09 | 2005-10-11 | Cheil Industries, Inc. | Metal CMP slurry compositions that favor mechanical removal of oxides with reduced susceptibility to micro-scratching |
US6589100B2 (en) | 2001-09-24 | 2003-07-08 | Cabot Microelectronics Corporation | Rare earth salt/oxidizer-based CMP method |
KR100444308B1 (ko) * | 2001-12-29 | 2004-08-16 | 주식회사 하이닉스반도체 | 반도체 소자의 형성 방법 |
KR100474537B1 (ko) * | 2002-07-16 | 2005-03-10 | 주식회사 하이닉스반도체 | 산화막용 cmp 슬러리 조성물 및 이를 이용한 반도체소자의 제조 방법 |
US6645265B1 (en) * | 2002-07-19 | 2003-11-11 | Saint-Gobain Ceramics And Plastics, Inc. | Polishing formulations for SiO2-based substrates |
SG155045A1 (en) * | 2002-07-22 | 2009-09-30 | Seimi Chem Kk | Semiconductor polishing compound, process for its production and polishing method |
US8056370B2 (en) | 2002-08-02 | 2011-11-15 | 3M Innovative Properties Company | Method of making amorphous and ceramics via melt spinning |
US6984261B2 (en) | 2003-02-05 | 2006-01-10 | 3M Innovative Properties Company | Use of ceramics in dental and orthodontic applications |
US7811496B2 (en) | 2003-02-05 | 2010-10-12 | 3M Innovative Properties Company | Methods of making ceramic particles |
JP4339034B2 (ja) * | 2003-07-01 | 2009-10-07 | 花王株式会社 | 研磨液組成物 |
JP3920263B2 (ja) * | 2003-12-22 | 2007-05-30 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 情報処理装置、制御方法、プログラム、及び記録媒体 |
US7332453B2 (en) * | 2004-07-29 | 2008-02-19 | 3M Innovative Properties Company | Ceramics, and methods of making and using the same |
JP4472747B2 (ja) * | 2005-01-26 | 2010-06-02 | エルジー・ケム・リミテッド | 酸化セリウム研磨材及び研磨用スラリー |
KR100641348B1 (ko) * | 2005-06-03 | 2006-11-03 | 주식회사 케이씨텍 | Cmp용 슬러리와 이의 제조 방법 및 기판의 연마 방법 |
US20070068901A1 (en) * | 2005-09-29 | 2007-03-29 | Wang Yuchun | Composition and method for enhancing pot life of hydrogen peroxide-containing CMP slurries |
US8685123B2 (en) * | 2005-10-14 | 2014-04-01 | Saint-Gobain Ceramics & Plastics, Inc. | Abrasive particulate material, and method of planarizing a workpiece using the abrasive particulate material |
US8491682B2 (en) * | 2007-12-31 | 2013-07-23 | K.C. Tech Co., Ltd. | Abrasive particles, method of manufacturing the abrasive particles, and method of manufacturing chemical mechanical polishing slurry |
US8486792B2 (en) * | 2008-05-13 | 2013-07-16 | Tokyo Electron Limited | Film forming method of silicon oxide film, silicon oxide film, semiconductor device, and manufacturing method of semiconductor device |
US8727833B2 (en) | 2009-04-15 | 2014-05-20 | Rhodia (China) Co., Ltd. | Cerium-based particle composition and the preparation thereof |
TWI605112B (zh) * | 2011-02-21 | 2017-11-11 | Fujimi Inc | 研磨用組成物 |
CN102504705B (zh) * | 2011-10-17 | 2014-07-09 | 河南省化工研究所有限责任公司 | 光通讯Zr02陶瓷插芯精密加工用抛光液及其制备方法 |
CN102516880A (zh) * | 2011-12-14 | 2012-06-27 | 德米特(苏州)电子环保材料有限公司 | 一种氧化铈基质的玻璃镜片抛光粉制备方法 |
TWI614093B (zh) * | 2013-01-04 | 2018-02-11 | 福吉米股份有限公司 | 研磨用組成物、合金材料、合金材料之硏磨方法及合金材料之製造方法 |
CN103555206B (zh) * | 2013-10-22 | 2015-07-08 | 上海华明高纳稀土新材料有限公司 | 稀土抛光粉及其制备方法 |
CN104673101A (zh) * | 2015-02-12 | 2015-06-03 | 柳州豪祥特科技有限公司 | 一种稀土抛光粉的制备工艺 |
CN104990946A (zh) * | 2015-07-03 | 2015-10-21 | 中国计量科学研究院 | K荧光x射线辐射装置 |
JP2018129481A (ja) * | 2017-02-10 | 2018-08-16 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
CN106978091A (zh) * | 2017-04-20 | 2017-07-25 | 宁波日晟新材料有限公司 | 高效硬质氧化锆陶瓷抛光液及其制备方法 |
KR102632104B1 (ko) | 2017-11-30 | 2024-02-02 | 솔브레인 주식회사 | 연마용 슬러리 조성물, 이의 제조방법 및 이를 이용한 반도체 박막의 연마방법 |
CN109023633A (zh) * | 2018-08-31 | 2018-12-18 | 宁波东方席业有限公司 | 一种耐磨复合纤维席子 |
CN109439282A (zh) * | 2018-10-23 | 2019-03-08 | 蓝思科技(长沙)有限公司 | 复合纳米磨料、抛光液及其制备方法、玻璃晶片和电子设备 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3429080A (en) * | 1966-05-02 | 1969-02-25 | Tizon Chem Corp | Composition for polishing crystalline silicon and germanium and process |
JPS5626547A (en) * | 1979-08-11 | 1981-03-14 | Toyota Motor Corp | Manufacture of catalyst support |
US4331565A (en) * | 1980-11-28 | 1982-05-25 | General Motors Corporation | Method for forming high surface area catalyst carrier and catalyst using same |
US4475981A (en) * | 1983-10-28 | 1984-10-09 | Ampex Corporation | Metal polishing composition and process |
JPS6283315A (ja) * | 1985-10-04 | 1987-04-16 | Nippon Engeruharudo Kk | 熱安定性にすぐれたγアルミナの製造方法 |
US4881951A (en) * | 1987-05-27 | 1989-11-21 | Minnesota Mining And Manufacturing Co. | Abrasive grits formed of ceramic containing oxides of aluminum and rare earth metal, method of making and products made therewith |
US4956313A (en) * | 1987-08-17 | 1990-09-11 | International Business Machines Corporation | Via-filling and planarization technique |
US4959113C1 (en) * | 1989-07-31 | 2001-03-13 | Rodel Inc | Method and composition for polishing metal surfaces |
US5244534A (en) * | 1992-01-24 | 1993-09-14 | Micron Technology, Inc. | Two-step chemical mechanical polishing process for producing flush and protruding tungsten plugs |
JPH05220394A (ja) * | 1992-02-07 | 1993-08-31 | Sumitomo Metal Mining Co Ltd | 酸化セリウムとアルミナからなる触媒担体の製造方法 |
US5264010A (en) * | 1992-04-27 | 1993-11-23 | Rodel, Inc. | Compositions and methods for polishing and planarizing surfaces |
US5209816A (en) * | 1992-06-04 | 1993-05-11 | Micron Technology, Inc. | Method of chemical mechanical polishing aluminum containing metal layers and slurry for chemical mechanical polishing |
US5232875A (en) * | 1992-10-15 | 1993-08-03 | Micron Technology, Inc. | Method and apparatus for improving planarity of chemical-mechanical planarization operations |
US5340370A (en) * | 1993-11-03 | 1994-08-23 | Intel Corporation | Slurries for chemical mechanical polishing |
US5527423A (en) * | 1994-10-06 | 1996-06-18 | Cabot Corporation | Chemical mechanical polishing slurry for metal layers |
KR960041316A (ko) * | 1995-05-22 | 1996-12-19 | 고사이 아키오 | 연마용 입상체, 이의 제조방법 및 이의 용도 |
-
1997
- 1997-08-27 KR KR1019970041329A patent/KR19980019046A/ko not_active Application Discontinuation
- 1997-08-28 SG SG1997003156A patent/SG55368A1/en unknown
- 1997-08-29 US US08/919,813 patent/US5804513A/en not_active Expired - Fee Related
- 1997-08-29 EP EP97306685A patent/EP0826757A1/fr not_active Withdrawn
- 1997-08-29 CN CN97117916A patent/CN1176283A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
KR19980019046A (ko) | 1998-06-05 |
CN1176283A (zh) | 1998-03-18 |
EP0826757A1 (fr) | 1998-03-04 |
US5804513A (en) | 1998-09-08 |
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