SG55211A1 - Testing apparatus - Google Patents

Testing apparatus

Info

Publication number
SG55211A1
SG55211A1 SG1996010200A SG1996010200A SG55211A1 SG 55211 A1 SG55211 A1 SG 55211A1 SG 1996010200 A SG1996010200 A SG 1996010200A SG 1996010200 A SG1996010200 A SG 1996010200A SG 55211 A1 SG55211 A1 SG 55211A1
Authority
SG
Singapore
Prior art keywords
testing apparatus
testing
Prior art date
Application number
SG1996010200A
Other languages
English (en)
Inventor
Tadashi Obikane
Eiji Hayashi
Ryoichiro Koshi
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP16971195A external-priority patent/JPH0922927A/ja
Priority claimed from JP8168269A external-priority patent/JPH09330960A/ja
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of SG55211A1 publication Critical patent/SG55211A1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06705—Apparatus for holding or moving single probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
SG1996010200A 1995-07-05 1996-07-03 Testing apparatus SG55211A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP16971195A JPH0922927A (ja) 1995-07-05 1995-07-05 位置決め装置および検査装置
JP8168269A JPH09330960A (ja) 1996-06-08 1996-06-08 検査装置

Publications (1)

Publication Number Publication Date
SG55211A1 true SG55211A1 (en) 1998-12-21

Family

ID=26492033

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996010200A SG55211A1 (en) 1995-07-05 1996-07-03 Testing apparatus

Country Status (6)

Country Link
US (1) US5828225A (ko)
EP (1) EP0752588B1 (ko)
KR (1) KR100297359B1 (ko)
DE (1) DE69634185T2 (ko)
SG (1) SG55211A1 (ko)
TW (1) TW300953B (ko)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5923180A (en) * 1997-02-04 1999-07-13 Hewlett-Packard Company Compliant wafer prober docking adapter
FR2762682B1 (fr) * 1997-04-24 1999-07-16 Sgs Thomson Microelectronics Anneaux de serrage pour tetes de testeur de circuit integre
US6445202B1 (en) 1999-06-30 2002-09-03 Cascade Microtech, Inc. Probe station thermal chuck with shielding for capacitive current
US6340895B1 (en) * 1999-07-14 2002-01-22 Aehr Test Systems, Inc. Wafer-level burn-in and test cartridge
US6262582B1 (en) 1999-10-15 2001-07-17 International Business Machines Corporation Mechanical fixture for holding electronic devices under test showing adjustments in multiple degrees of freedom
JP2001358204A (ja) * 2000-06-15 2001-12-26 Tokyo Electron Ltd 検査ステージ
US6774621B2 (en) * 2000-06-15 2004-08-10 Tokyo Electron Limited Inspection stage having a plurality of Z axes
US6914423B2 (en) 2000-09-05 2005-07-05 Cascade Microtech, Inc. Probe station
US6965226B2 (en) 2000-09-05 2005-11-15 Cascade Microtech, Inc. Chuck for holding a device under test
US7053646B2 (en) * 2000-09-15 2006-05-30 Orsillo James F Apparatus and method for use in testing a semiconductor wafer
JP4476467B2 (ja) * 2000-11-06 2010-06-09 東京エレクトロン株式会社 コンタクタの組立装置及び組立方法
JP4721247B2 (ja) * 2001-03-16 2011-07-13 東京エレクトロン株式会社 プローブ方法及びプローブ装置
JP4123408B2 (ja) * 2001-12-13 2008-07-23 東京エレクトロン株式会社 プローブカード交換装置
US6777964B2 (en) * 2002-01-25 2004-08-17 Cascade Microtech, Inc. Probe station
DE10216003B4 (de) * 2002-04-11 2005-03-10 Multitest Elektronische Syst Dockingvorrichtung
JP2004152916A (ja) * 2002-10-29 2004-05-27 Nec Corp 半導体デバイス検査装置及び検査方法
US6861856B2 (en) * 2002-12-13 2005-03-01 Cascade Microtech, Inc. Guarded tub enclosure
JP2004309441A (ja) * 2003-02-18 2004-11-04 Yamaha Corp プローブヘッド及びその組立方法並びにプローブカード
US6833696B2 (en) * 2003-03-04 2004-12-21 Xandex, Inc. Methods and apparatus for creating a high speed connection between a device under test and automatic test equipment
US6984996B2 (en) * 2003-05-01 2006-01-10 Celerity Research, Inc. Wafer probing that conditions devices for flip-chip bonding
US7492172B2 (en) 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
US7250626B2 (en) 2003-10-22 2007-07-31 Cascade Microtech, Inc. Probe testing structure
US7187188B2 (en) 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US20060177160A1 (en) * 2005-02-07 2006-08-10 Wagner James C Disposable bag for particularized waste
US7671614B2 (en) * 2005-12-02 2010-03-02 Formfactor, Inc. Apparatus and method for adjusting an orientation of probes
US7368930B2 (en) * 2006-08-04 2008-05-06 Formfactor, Inc. Adjustment mechanism
US7750657B2 (en) * 2007-03-15 2010-07-06 Applied Materials Inc. Polishing head testing with movable pedestal
JP4950779B2 (ja) * 2007-06-22 2012-06-13 東京エレクトロン株式会社 プローブカードの登録方法及びこのプログラムを記録したプログラム記録媒体
US8319503B2 (en) 2008-11-24 2012-11-27 Cascade Microtech, Inc. Test apparatus for measuring a characteristic of a device under test
JP5296117B2 (ja) 2010-03-12 2013-09-25 東京エレクトロン株式会社 プローブ装置
JP5529605B2 (ja) * 2010-03-26 2014-06-25 東京エレクトロン株式会社 ウエハチャックの傾き補正方法及びプローブ装置
TWI416144B (zh) * 2011-05-06 2013-11-21 Fu Lai Yao The method and device for detecting the touch point of the substrate line with the probe
EP2732298A1 (en) 2011-07-12 2014-05-21 Intest Corporation Method and apparatus for docking a test head with a peripheral
JP6001326B2 (ja) * 2012-05-23 2016-10-05 東京エレクトロン株式会社 プローブ装置及びプローブ装置用ウエハ載置台
JP2014048266A (ja) * 2012-09-04 2014-03-17 Toshiba Corp プローブカード、これを用いた撮像素子の試験方法および試験装置
KR101987895B1 (ko) * 2017-02-02 2019-06-12 주식회사 투윈테크 반도체 또는 디스플레이 시스템 분야에서 사용되는 이송 위치 측정용 테스트 더미 및 상기 이송 위치 측정용 테스트 더미를 이용한 정밀 이송 측정 방법
TWI641836B (zh) * 2017-08-21 2018-11-21 漢民科技股份有限公司 平面校正裝置及包含其之半導體測試設備
DE102022106418A1 (de) * 2021-03-22 2022-09-22 Mpi Corporation Wafer-prüfsystem

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4751457A (en) * 1986-09-08 1988-06-14 Tektronix, Inc. Integrated circuit probe parallelism establishing method and apparatus
JPH06124982A (ja) * 1992-01-14 1994-05-06 Mitsubishi Electric Corp 半導体試験装置
JP3219844B2 (ja) * 1992-06-01 2001-10-15 東京エレクトロン株式会社 プローブ装置
JP3095318B2 (ja) * 1993-11-25 2000-10-03 東京エレクトロン株式会社 被検査体のテスト装置

Also Published As

Publication number Publication date
DE69634185D1 (de) 2005-02-24
US5828225A (en) 1998-10-27
KR970008455A (ko) 1997-02-24
EP0752588B1 (en) 2005-01-19
EP0752588A3 (en) 1997-07-23
TW300953B (ko) 1997-03-21
EP0752588A2 (en) 1997-01-08
KR100297359B1 (ko) 2001-10-24
DE69634185T2 (de) 2006-01-05

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