DE69634185D1 - Testeinrichtung - Google Patents

Testeinrichtung

Info

Publication number
DE69634185D1
DE69634185D1 DE69634185T DE69634185T DE69634185D1 DE 69634185 D1 DE69634185 D1 DE 69634185D1 DE 69634185 T DE69634185 T DE 69634185T DE 69634185 T DE69634185 T DE 69634185T DE 69634185 D1 DE69634185 D1 DE 69634185D1
Authority
DE
Germany
Prior art keywords
test equipment
test
equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69634185T
Other languages
English (en)
Other versions
DE69634185T2 (de
Inventor
Tadashi Obikane
Eiji Hayashi
Ryoichiro Koshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP16971195A external-priority patent/JPH0922927A/ja
Priority claimed from JP8168269A external-priority patent/JPH09330960A/ja
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of DE69634185D1 publication Critical patent/DE69634185D1/de
Application granted granted Critical
Publication of DE69634185T2 publication Critical patent/DE69634185T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06705—Apparatus for holding or moving single probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
DE69634185T 1995-07-05 1996-07-05 Testeinrichtung Expired - Lifetime DE69634185T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP16971195 1995-07-05
JP16971195A JPH0922927A (ja) 1995-07-05 1995-07-05 位置決め装置および検査装置
JP16826996 1996-06-08
JP8168269A JPH09330960A (ja) 1996-06-08 1996-06-08 検査装置

Publications (2)

Publication Number Publication Date
DE69634185D1 true DE69634185D1 (de) 2005-02-24
DE69634185T2 DE69634185T2 (de) 2006-01-05

Family

ID=26492033

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69634185T Expired - Lifetime DE69634185T2 (de) 1995-07-05 1996-07-05 Testeinrichtung

Country Status (6)

Country Link
US (1) US5828225A (de)
EP (1) EP0752588B1 (de)
KR (1) KR100297359B1 (de)
DE (1) DE69634185T2 (de)
SG (1) SG55211A1 (de)
TW (1) TW300953B (de)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5923180A (en) * 1997-02-04 1999-07-13 Hewlett-Packard Company Compliant wafer prober docking adapter
FR2762682B1 (fr) * 1997-04-24 1999-07-16 Sgs Thomson Microelectronics Anneaux de serrage pour tetes de testeur de circuit integre
US6445202B1 (en) 1999-06-30 2002-09-03 Cascade Microtech, Inc. Probe station thermal chuck with shielding for capacitive current
US6340895B1 (en) * 1999-07-14 2002-01-22 Aehr Test Systems, Inc. Wafer-level burn-in and test cartridge
US6262582B1 (en) 1999-10-15 2001-07-17 International Business Machines Corporation Mechanical fixture for holding electronic devices under test showing adjustments in multiple degrees of freedom
JP2001358204A (ja) * 2000-06-15 2001-12-26 Tokyo Electron Ltd 検査ステージ
US6774621B2 (en) * 2000-06-15 2004-08-10 Tokyo Electron Limited Inspection stage having a plurality of Z axes
US6914423B2 (en) 2000-09-05 2005-07-05 Cascade Microtech, Inc. Probe station
US6965226B2 (en) 2000-09-05 2005-11-15 Cascade Microtech, Inc. Chuck for holding a device under test
US7053646B2 (en) * 2000-09-15 2006-05-30 Orsillo James F Apparatus and method for use in testing a semiconductor wafer
JP4476467B2 (ja) * 2000-11-06 2010-06-09 東京エレクトロン株式会社 コンタクタの組立装置及び組立方法
JP4721247B2 (ja) * 2001-03-16 2011-07-13 東京エレクトロン株式会社 プローブ方法及びプローブ装置
JP4123408B2 (ja) * 2001-12-13 2008-07-23 東京エレクトロン株式会社 プローブカード交換装置
US6777964B2 (en) * 2002-01-25 2004-08-17 Cascade Microtech, Inc. Probe station
DE10216003B4 (de) * 2002-04-11 2005-03-10 Multitest Elektronische Syst Dockingvorrichtung
JP2004152916A (ja) * 2002-10-29 2004-05-27 Nec Corp 半導体デバイス検査装置及び検査方法
US6861856B2 (en) * 2002-12-13 2005-03-01 Cascade Microtech, Inc. Guarded tub enclosure
JP2004309441A (ja) * 2003-02-18 2004-11-04 Yamaha Corp プローブヘッド及びその組立方法並びにプローブカード
US6833696B2 (en) * 2003-03-04 2004-12-21 Xandex, Inc. Methods and apparatus for creating a high speed connection between a device under test and automatic test equipment
US6984996B2 (en) * 2003-05-01 2006-01-10 Celerity Research, Inc. Wafer probing that conditions devices for flip-chip bonding
US7492172B2 (en) 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
US7250626B2 (en) 2003-10-22 2007-07-31 Cascade Microtech, Inc. Probe testing structure
US7187188B2 (en) 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US20060177160A1 (en) * 2005-02-07 2006-08-10 Wagner James C Disposable bag for particularized waste
US7671614B2 (en) * 2005-12-02 2010-03-02 Formfactor, Inc. Apparatus and method for adjusting an orientation of probes
US7368930B2 (en) * 2006-08-04 2008-05-06 Formfactor, Inc. Adjustment mechanism
US7750657B2 (en) * 2007-03-15 2010-07-06 Applied Materials Inc. Polishing head testing with movable pedestal
JP4950779B2 (ja) * 2007-06-22 2012-06-13 東京エレクトロン株式会社 プローブカードの登録方法及びこのプログラムを記録したプログラム記録媒体
US8319503B2 (en) 2008-11-24 2012-11-27 Cascade Microtech, Inc. Test apparatus for measuring a characteristic of a device under test
JP5296117B2 (ja) 2010-03-12 2013-09-25 東京エレクトロン株式会社 プローブ装置
JP5529605B2 (ja) * 2010-03-26 2014-06-25 東京エレクトロン株式会社 ウエハチャックの傾き補正方法及びプローブ装置
TWI416144B (zh) * 2011-05-06 2013-11-21 Fu Lai Yao The method and device for detecting the touch point of the substrate line with the probe
CN103782182B (zh) 2011-07-12 2016-08-24 英泰斯特股份有限公司 驳接测试头与外围设备的方法与装置
JP6001326B2 (ja) * 2012-05-23 2016-10-05 東京エレクトロン株式会社 プローブ装置及びプローブ装置用ウエハ載置台
JP2014048266A (ja) * 2012-09-04 2014-03-17 Toshiba Corp プローブカード、これを用いた撮像素子の試験方法および試験装置
KR101987895B1 (ko) * 2017-02-02 2019-06-12 주식회사 투윈테크 반도체 또는 디스플레이 시스템 분야에서 사용되는 이송 위치 측정용 테스트 더미 및 상기 이송 위치 측정용 테스트 더미를 이용한 정밀 이송 측정 방법
TWI641836B (zh) * 2017-08-21 2018-11-21 漢民科技股份有限公司 平面校正裝置及包含其之半導體測試設備
DE102022106418A1 (de) * 2021-03-22 2022-09-22 Mpi Corporation Wafer-prüfsystem

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4751457A (en) * 1986-09-08 1988-06-14 Tektronix, Inc. Integrated circuit probe parallelism establishing method and apparatus
JPH06124982A (ja) * 1992-01-14 1994-05-06 Mitsubishi Electric Corp 半導体試験装置
JP3219844B2 (ja) * 1992-06-01 2001-10-15 東京エレクトロン株式会社 プローブ装置
JP3095318B2 (ja) * 1993-11-25 2000-10-03 東京エレクトロン株式会社 被検査体のテスト装置

Also Published As

Publication number Publication date
US5828225A (en) 1998-10-27
KR970008455A (ko) 1997-02-24
EP0752588B1 (de) 2005-01-19
EP0752588A3 (de) 1997-07-23
TW300953B (de) 1997-03-21
EP0752588A2 (de) 1997-01-08
KR100297359B1 (ko) 2001-10-24
SG55211A1 (en) 1998-12-21
DE69634185T2 (de) 2006-01-05

Similar Documents

Publication Publication Date Title
DE69634185D1 (de) Testeinrichtung
FI974065A (fi) Mittalaite
DE69529223T2 (de) Testverfahren
DE69617730T2 (de) Amrc-test
ID15816A (id) Peralatan pengering
DE69629407D1 (de) Entfernungsmessgerät
DE59710881D1 (de) Sehtestgerät
DE69629434D1 (de) Entfernungsmessgerät
FI973880A (fi) Koestuslaite
DE29509067U1 (de) Prüfvorrichtung
NO942034D0 (no) Testapparat
DE59407860D1 (de) Prüfgerät
DE29607030U1 (de) Prüfanlage
DE9416307U1 (de) Prüfvorrichtung
NO942485D0 (no) Testutstyr
KR970045070U (ko) 낙하시험기
DE29509296U1 (de) Testsystem
KR960018440U (ko) 마식 시험용 장치
FI952665A0 (fi) Anordning
KR970010720U (ko) 하니스 시험장치
KR970020922U (ko) 운동기구
KR960038421U (ko) 학습겸용 놀이기구
DE29519660U1 (de) Laufsportgerätesatz
KR970027161U (ko) 전신운동기구
KR970012194U (ko) 손으로 치는 유희운동구

Legal Events

Date Code Title Description
8364 No opposition during term of opposition