SG50407A1 - Chip alignment/feed apparatus - Google Patents

Chip alignment/feed apparatus

Info

Publication number
SG50407A1
SG50407A1 SG1996000377A SG1996000377A SG50407A1 SG 50407 A1 SG50407 A1 SG 50407A1 SG 1996000377 A SG1996000377 A SG 1996000377A SG 1996000377 A SG1996000377 A SG 1996000377A SG 50407 A1 SG50407 A1 SG 50407A1
Authority
SG
Singapore
Prior art keywords
feed apparatus
chip alignment
alignment
chip
feed
Prior art date
Application number
SG1996000377A
Other languages
English (en)
Inventor
Keiichi Shimamaki
Kenji Ijichi
Mitsuro Hamuro
Original Assignee
Murata Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co filed Critical Murata Manufacturing Co
Publication of SG50407A1 publication Critical patent/SG50407A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/028—Simultaneously loading a plurality of loose objects, e.g. by means of vibrations, pressure differences, magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/043—Feeding one by one by other means than belts
    • H05K13/0434—Feeding one by one by other means than belts with containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Feeding Of Articles To Conveyors (AREA)
  • Filling Or Emptying Of Bunkers, Hoppers, And Tanks (AREA)
  • Automatic Assembly (AREA)
SG1996000377A 1995-01-23 1996-01-23 Chip alignment/feed apparatus SG50407A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7027429A JPH08204386A (ja) 1995-01-23 1995-01-23 チップ部品の整列供給装置

Publications (1)

Publication Number Publication Date
SG50407A1 true SG50407A1 (en) 1998-07-20

Family

ID=12220879

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996000377A SG50407A1 (en) 1995-01-23 1996-01-23 Chip alignment/feed apparatus

Country Status (6)

Country Link
US (1) US5806715A (de)
JP (1) JPH08204386A (de)
DE (1) DE19602308B4 (de)
GB (1) GB2297425B (de)
MY (1) MY120666A (de)
SG (1) SG50407A1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3209173B2 (ja) * 1998-01-27 2001-09-17 株式会社村田製作所 チップ状電子部品供給装置
DE19831588C2 (de) * 1998-03-13 2002-11-07 Z & F Zoller & Froehlich Gmbh Zuführeinrichtung
JP3446598B2 (ja) * 1998-03-23 2003-09-16 株式会社村田製作所 チップ部品の移載装置
JP4617244B2 (ja) * 2005-11-08 2011-01-19 富士通株式会社 部品供給装置及び部品供給方法
FR2926070B1 (fr) * 2008-01-07 2009-12-18 Eris Dispositif de stockage et de distribution de petites pieces telles des rivets.
CN104641735B (zh) * 2012-09-20 2017-09-19 富士机械制造株式会社 散装元件供给系统及散装元件补给方法
EP3197254B1 (de) * 2014-08-25 2020-07-29 FUJI Corporation Komponentenzuführungsvorrichtung
CN105523222A (zh) * 2014-10-22 2016-04-27 深圳富泰宏精密工业有限公司 整列机构
EP3325354B1 (de) * 2015-07-18 2019-05-15 Harro Höfliger Verpackungsmaschinen GmbH Verfahren und vorrichtung zur abgrenzung und übergabe von pellets
JP6218863B2 (ja) * 2016-01-12 2017-10-25 富士機械製造株式会社 電子回路部品装着機
JP2017152563A (ja) * 2016-02-25 2017-08-31 富士機械製造株式会社 部品供給装置
HK1224503A2 (zh) * 2016-08-31 2017-08-18 合益工業系統有限公司 種彈簧分離送料裝置及方法
DE102016125495B4 (de) 2016-12-22 2018-07-12 Asm Assembly Systems Gmbh & Co. Kg Magazin zum portionsweisen Aufnehmen von vereinzelten als Schüttgut vorliegenden elektronischen Bauelementen sowie Vorrichtung und Verfahren zum portionsweisen Transferieren der Bauelemente
JP6343062B2 (ja) * 2017-04-21 2018-06-13 株式会社Ｆｕｊｉ バルク部品補給方法
JP7443390B2 (ja) * 2019-11-07 2024-03-05 株式会社Fuji 部品補充装置
CN117580788A (zh) * 2021-07-07 2024-02-20 株式会社村田制作所 部件收容装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US594127A (en) * 1897-11-23 Milk-bucket
US1162133A (en) * 1914-07-11 1915-11-30 Joseph M Levine Fire-extinguisher.
US4953749A (en) * 1986-05-27 1990-09-04 Nitto Kogyo Kabushiki Kaisha Chip separation and alignment apparatus
IT1210763B (it) * 1986-05-27 1989-09-20 Nitto Kogyo Kk Apparecchiature per la separazione e l allineamento di chip
JPH03187298A (ja) * 1989-12-16 1991-08-15 Murata Mfg Co Ltd 電子部品チップ整列装置
JPH06112298A (ja) * 1992-09-30 1994-04-22 Taiyo Yuden Co Ltd 電子部品実装機の部品ホッパ
JPH0715169U (ja) * 1993-08-05 1995-03-14 中菱エンジニアリング株式会社 溶接作業用コンベアのアース電源
JP3663651B2 (ja) * 1994-06-15 2005-06-22 松下電器産業株式会社 チップ部品供給装置

Also Published As

Publication number Publication date
GB9601234D0 (en) 1996-03-20
MY120666A (en) 2005-11-30
GB2297425A (en) 1996-07-31
GB2297425B (en) 1998-12-02
DE19602308A1 (de) 1996-07-25
US5806715A (en) 1998-09-15
JPH08204386A (ja) 1996-08-09
DE19602308B4 (de) 2009-04-23

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