SG49646A1 - Semiconductor epitaxial substrate - Google Patents

Semiconductor epitaxial substrate

Info

Publication number
SG49646A1
SG49646A1 SG1996002769A SG1996002769A SG49646A1 SG 49646 A1 SG49646 A1 SG 49646A1 SG 1996002769 A SG1996002769 A SG 1996002769A SG 1996002769 A SG1996002769 A SG 1996002769A SG 49646 A1 SG49646 A1 SG 49646A1
Authority
SG
Singapore
Prior art keywords
crystals
epitaxial
substrate
inxga
orientation
Prior art date
Application number
SG1996002769A
Other languages
English (en)
Inventor
Hiroaki Takata
Katsumi Inui
Masahiko Hata
Noboru Fukuhara
Original Assignee
Sumitomo Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co filed Critical Sumitomo Chemical Co
Publication of SG49646A1 publication Critical patent/SG49646A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66446—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET]
    • H01L29/66462—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02387—Group 13/15 materials
    • H01L21/02395—Arsenides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02436—Intermediate layers between substrates and deposited layers
    • H01L21/02439—Materials
    • H01L21/02455—Group 13/15 materials
    • H01L21/02463—Arsenides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02538—Group 13/15 materials
    • H01L21/02546—Arsenides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/0257—Doping during depositing
    • H01L21/02573—Conductivity type
    • H01L21/02576—N-type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/30—Structure or shape of the active region; Materials used for the active region
    • H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
    • H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S2304/00—Special growth methods for semiconductor lasers
    • H01S2304/04—MOCVD or MOVPE
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/30—Structure or shape of the active region; Materials used for the active region
    • H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
    • H01S5/3201—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures incorporating bulkstrain effects, e.g. strain compensation, strain related to polarisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/30—Structure or shape of the active region; Materials used for the active region
    • H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
    • H01S5/3202—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures grown on specifically orientated substrates, or using orientation dependent growth
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/30—Structure or shape of the active region; Materials used for the active region
    • H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
    • H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
    • H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Semiconductor Lasers (AREA)
  • Recrystallisation Techniques (AREA)
SG1996002769A 1993-01-13 1994-09-12 Semiconductor epitaxial substrate SG49646A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP394893 1993-01-13
PCT/JP1994/000032 WO1994016459A1 (fr) 1993-01-13 1994-01-12 Substrat epitaxial semiconducteur

Publications (1)

Publication Number Publication Date
SG49646A1 true SG49646A1 (en) 1998-06-15

Family

ID=11571342

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996002769A SG49646A1 (en) 1993-01-13 1994-09-12 Semiconductor epitaxial substrate

Country Status (7)

Country Link
US (1) US5569954A (fr)
EP (1) EP0631299A4 (fr)
KR (1) KR100281939B1 (fr)
CA (1) CA2131696C (fr)
SG (1) SG49646A1 (fr)
TW (1) TW250574B (fr)
WO (1) WO1994016459A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6229153B1 (en) * 1996-06-21 2001-05-08 Wisconsin Alumni Research Corporation High peak current density resonant tunneling diode
SE514183C2 (sv) * 1999-01-27 2001-01-15 Ericsson Telefon Ab L M Inställningsarrangemang
JP2002270516A (ja) 2001-03-07 2002-09-20 Nec Corp Ｉｉｉ族窒化物半導体の成長方法、ｉｉｉ族窒化物半導体膜およびそれを用いた半導体素子
US8134223B2 (en) * 2003-05-08 2012-03-13 Sumitomo Electric Industries, Ltd. III-V compound crystal and semiconductor electronic circuit element
TWI402896B (zh) * 2006-02-02 2013-07-21 Nippon Mining Co Substrate semiconductor growth substrate and epitaxial growth method
TWI298209B (en) * 2006-03-27 2008-06-21 Epistar Corp Semiconductor light-emitting device and method for fabricating the same

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL171309C (nl) * 1970-03-02 1983-03-01 Hitachi Ltd Werkwijze voor de vervaardiging van een halfgeleiderlichaam, waarbij een laag van siliciumdioxyde wordt gevormd op een oppervlak van een monokristallijn lichaam van silicium.
US4688068A (en) * 1983-07-08 1987-08-18 The United States Of America As Represented By The Department Of Energy Quantum well multijunction photovoltaic cell
JPH0670971B2 (ja) * 1984-10-22 1994-09-07 日本電気株式会社 結晶成長方法
JPH0697654B2 (ja) * 1985-12-19 1994-11-30 松下電器産業株式会社 化合物半導体装置の製造方法
US4872046A (en) * 1986-01-24 1989-10-03 University Of Illinois Heterojunction semiconductor device with <001> tilt
JP2750856B2 (ja) * 1987-11-12 1998-05-13 シャープ株式会社 半導体装置
US5221367A (en) * 1988-08-03 1993-06-22 International Business Machines, Corp. Strained defect-free epitaxial mismatched heterostructures and method of fabrication
US5016252A (en) * 1988-09-29 1991-05-14 Sanyo Electric Co., Ltd. Semiconductor laser device
JPH03225928A (ja) * 1990-01-31 1991-10-04 Hitachi Ltd エピタキシャル成長法及び半導体装置
JPH03283427A (ja) * 1990-03-29 1991-12-13 Sumitomo Chem Co Ltd 高電子移動度トランジスター用エピタキシャル基板の製造方法
JPH03290975A (ja) * 1990-04-09 1991-12-20 Fujitsu Ltd 縦型半導体装置
JP2870989B2 (ja) * 1990-06-04 1999-03-17 住友電気工業株式会社 化合物半導体の結晶成長方法
CA2041991A1 (fr) * 1990-06-12 1991-12-13 Gary E. Bulman Laser inyga1-y as dope au silicium
JPH0465037A (ja) * 1990-07-04 1992-03-02 Nakajima All Precision Kk キーボード
JPH05160515A (ja) * 1991-12-04 1993-06-25 Eastman Kodak Japan Kk 量子井戸型レーザダイオード

Also Published As

Publication number Publication date
KR100281939B1 (ko) 2001-03-02
TW250574B (fr) 1995-07-01
EP0631299A1 (fr) 1994-12-28
CA2131696C (fr) 2003-08-19
CA2131696A1 (fr) 1994-07-14
EP0631299A4 (fr) 1997-05-14
WO1994016459A1 (fr) 1994-07-21
KR950700606A (ko) 1995-01-16
US5569954A (en) 1996-10-29

Similar Documents

Publication Publication Date Title
US4444620A (en) Growth of oriented single crystal semiconductor on insulator
EP0962963A4 (fr) Substrat en carbure de silicium, procede de fabrication de ce substrat et element semi-conducteur renfermant ce substrat
KR930020727A (ko) 박막트랜지스터 및 그 제조방법
EP1179842A3 (fr) Substrat semi-conducteur et procédé de sa fabrication
EP0528229A3 (fr)
ATE194884T1 (de) Verfahren zur herstellung eines halbleiter- bauelements
EP0600276A3 (fr) Procédé de production d&#39;une zone monocristalline limitée latéralement par épitaxie sélective et son utilisation pour produire un transistor bipolaire ainsi qu&#39;un transistor MOS.
EP0863542A3 (fr) Plaquette epitaxiée III-V
SG49646A1 (en) Semiconductor epitaxial substrate
JPS5694731A (en) Method of forming epitaxial layer and semiconductor device formed of semiconductor substrate for imparting same layer
KR930009805B1 (ko) 반도체 층 성장으로 부터 결함을 제거하기 위한 버퍼구조를 갖는 반도체장치.
EP0177903A2 (fr) Dispositif semi-conducteur comportant une couche de Ga-As monocristallin formée sur un substrat en silicium et procédé pour la fabrication de ce dispositif
TW429553B (en) Nitride semiconductor device and a method of growing nitride semiconductor crystal
ATE165197T1 (de) Piezoelektrisches kristallelement
EP0291951A3 (fr) Transistor à effet de champ à semi-conducteur ayant une couche d&#39;isolation de grille en carbure de silicium monocristallin
US5142350A (en) Transistor having cubic boron nitride layer
Lam et al. Device fabrication in {100} silicon-on-oxide produced by a scanning CW-laser-induced lateral seeding technique
GB2202371B (en) Semiconductor device
WO2001080294A3 (fr) Tampon higfet a mode ameliore, etire par depot en phase gazeuse de melanges organo-metalliques
JPS56126914A (en) Manufacture of semiconductor device
EP0088004A3 (fr) Méthode pour produire des íles orientées de couches monocristallines
JPS54134554A (en) Wafer for semiconductor device
JPS5612750A (en) Sos substrate
DE3683521D1 (de) Thermisches aetzen eines verbindungshalbleiters.
JPS5462777A (en) Production of compound semiconductor thin films