SG44408A1 - Bit stack compatible input/output circuits - Google Patents

Bit stack compatible input/output circuits

Info

Publication number
SG44408A1
SG44408A1 SG1996000215A SG1996000215A SG44408A1 SG 44408 A1 SG44408 A1 SG 44408A1 SG 1996000215 A SG1996000215 A SG 1996000215A SG 1996000215 A SG1996000215 A SG 1996000215A SG 44408 A1 SG44408 A1 SG 44408A1
Authority
SG
Singapore
Prior art keywords
output circuits
compatible input
bit stack
stack compatible
bit
Prior art date
Application number
SG1996000215A
Other languages
English (en)
Inventor
Robert Paul Masleid
Parsotam Trikam Patel
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of SG44408A1 publication Critical patent/SG44408A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/118—Masterslice integrated circuits
    • H01L27/11898—Input and output buffer/driver structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
SG1996000215A 1990-01-29 1991-01-04 Bit stack compatible input/output circuits SG44408A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/471,892 US4988636A (en) 1990-01-29 1990-01-29 Method of making bit stack compatible input/output circuits

Publications (1)

Publication Number Publication Date
SG44408A1 true SG44408A1 (en) 1997-12-19

Family

ID=23873400

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996000215A SG44408A1 (en) 1990-01-29 1991-01-04 Bit stack compatible input/output circuits

Country Status (9)

Country Link
US (1) US4988636A (zh)
EP (1) EP0440332B1 (zh)
JP (1) JPH073668B2 (zh)
KR (1) KR930006723B1 (zh)
CN (1) CN1020245C (zh)
AU (1) AU631709B2 (zh)
DE (1) DE69128434D1 (zh)
MY (1) MY106061A (zh)
SG (1) SG44408A1 (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69322855T2 (de) * 1993-04-28 1999-05-20 Stmicroelectronics S.R.L., Agrate Brianza, Mailand/Milano Modulare integrierte Schaltungsstruktur
US5691218A (en) * 1993-07-01 1997-11-25 Lsi Logic Corporation Method of fabricating a programmable polysilicon gate array base cell structure
US5552333A (en) * 1994-09-16 1996-09-03 Lsi Logic Corporation Method for designing low profile variable width input/output cells
US5548747A (en) * 1995-02-10 1996-08-20 International Business Machines Corporation Bit stack wiring channel optimization with fixed macro placement and variable pin placement
US5760428A (en) * 1996-01-25 1998-06-02 Lsi Logic Corporation Variable width low profile gate array input/output architecture
US5698873A (en) * 1996-03-08 1997-12-16 Lsi Logic Corporation High density gate array base cell architecture
US6725439B1 (en) * 1998-01-29 2004-04-20 International Business Machines Corporation Method of automated design and checking for ESD robustness
US6086627A (en) * 1998-01-29 2000-07-11 International Business Machines Corporation Method of automated ESD protection level verification
US6073343A (en) * 1998-12-22 2000-06-13 General Electric Company Method of providing a variable guard ring width between detectors on a substrate
JP4629826B2 (ja) * 2000-02-22 2011-02-09 パナソニック株式会社 半導体集積回路装置
US6879023B1 (en) * 2000-03-22 2005-04-12 Broadcom Corporation Seal ring for integrated circuits
US6550047B1 (en) * 2000-10-02 2003-04-15 Artisan Components, Inc. Semiconductor chip input/output cell design and automated generation methods
FR2817657B1 (fr) * 2000-12-06 2003-09-26 St Microelectronics Sa Circuit integre a couplage par le substrat reduit
US7350160B2 (en) * 2003-06-24 2008-03-25 International Business Machines Corporation Method of displaying a guard ring within an integrated circuit
US7253012B2 (en) * 2004-09-14 2007-08-07 Agere Systems, Inc. Guard ring for improved matching
US7496877B2 (en) * 2005-08-11 2009-02-24 International Business Machines Corporation Electrostatic discharge failure avoidance through interaction between floorplanning and power routing

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3798606A (en) * 1971-12-17 1974-03-19 Ibm Bit partitioned monolithic circuit computer system
US3999214A (en) * 1974-06-26 1976-12-21 Ibm Corporation Wireable planar integrated circuit chip structure
US3968478A (en) * 1974-10-30 1976-07-06 Motorola, Inc. Chip topography for MOS interface circuit
US4006492A (en) * 1975-06-23 1977-02-01 International Business Machines Corporation High density semiconductor chip organization
EP0232797B1 (en) * 1980-11-24 1991-12-11 Texas Instruments Incorporated Pseudo-microprogramming in microprocessor with compressed control rom and with strip layout of busses, alu and registers
JPS57211248A (en) * 1981-06-22 1982-12-25 Hitachi Ltd Semiconductor integrated circuit device
JPS58137229A (ja) * 1982-02-09 1983-08-15 Nippon Telegr & Teleph Corp <Ntt> 半導体装置
US4613940A (en) * 1982-11-09 1986-09-23 International Microelectronic Products Method and structure for use in designing and building electronic systems in integrated circuits
WO1985002062A1 (en) * 1983-10-31 1985-05-09 Storage Technology Partners Cmos integrated circuit configuration for eliminating latchup
JPH063826B2 (ja) * 1985-04-22 1994-01-12 日本電気株式会社 スタンダ−ドセルの周辺ブロツク配置方法
US4731643A (en) * 1985-10-21 1988-03-15 International Business Machines Corporation Logic-circuit layout for large-scale integrated circuits
US4746966A (en) * 1985-10-21 1988-05-24 International Business Machines Corporation Logic-circuit layout for large-scale integrated circuits
JPS63108733A (ja) * 1986-10-24 1988-05-13 Nec Corp 半導体集積回路

Also Published As

Publication number Publication date
JPH073668B2 (ja) 1995-01-18
KR910015043A (ko) 1991-08-31
CN1020245C (zh) 1993-04-07
AU6855790A (en) 1991-08-01
MY106061A (en) 1995-03-31
EP0440332A3 (zh) 1994-01-19
AU631709B2 (en) 1992-12-03
CN1053863A (zh) 1991-08-14
EP0440332B1 (en) 1997-12-17
DE69128434D1 (de) 1998-01-29
US4988636A (en) 1991-01-29
KR930006723B1 (ko) 1993-07-23
EP0440332A2 (en) 1991-08-07
JPH03252871A (ja) 1991-11-12

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