SG42780A1 - Epoxy resin molding material for sealing electronic parts and sealed semiconductor device usin the same - Google Patents

Epoxy resin molding material for sealing electronic parts and sealed semiconductor device usin the same

Info

Publication number
SG42780A1
SG42780A1 SG1995001501A SG1995001501A SG42780A1 SG 42780 A1 SG42780 A1 SG 42780A1 SG 1995001501 A SG1995001501 A SG 1995001501A SG 1995001501 A SG1995001501 A SG 1995001501A SG 42780 A1 SG42780 A1 SG 42780A1
Authority
SG
Singapore
Prior art keywords
usin
semiconductor device
epoxy resin
same
molding material
Prior art date
Application number
SG1995001501A
Other languages
English (en)
Inventor
Bernard Deubzer
Hiroki Sashima
Hiroyuki Saitoh
Michael Geck
Peter Huber
Shinsuke Hagiwara
Original Assignee
Hitachi Chemical Co Ltd
Wacker Chemie Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Wacker Chemie Gmbh filed Critical Hitachi Chemical Co Ltd
Publication of SG42780A1 publication Critical patent/SG42780A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S525/902—Core-shell
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
SG1995001501A 1994-10-07 1995-10-06 Epoxy resin molding material for sealing electronic parts and sealed semiconductor device usin the same SG42780A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24406994A JP3288185B2 (ja) 1994-10-07 1994-10-07 電子部品封止用エポキシ樹脂成形材料及びそれを用いた半導体装置

Publications (1)

Publication Number Publication Date
SG42780A1 true SG42780A1 (en) 1997-10-17

Family

ID=17113278

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1995001501A SG42780A1 (en) 1994-10-07 1995-10-06 Epoxy resin molding material for sealing electronic parts and sealed semiconductor device usin the same

Country Status (9)

Country Link
US (2) US5739217A (ko)
EP (1) EP0707042B1 (ko)
JP (1) JP3288185B2 (ko)
KR (1) KR0169828B1 (ko)
CN (1) CN1065259C (ko)
DE (1) DE69501771T2 (ko)
MY (2) MY113317A (ko)
SG (1) SG42780A1 (ko)
TW (1) TW376402B (ko)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0780435A1 (en) * 1995-12-21 1997-06-25 National Starch and Chemical Investment Holding Corporation Flexible epoxy adhesives with low bleeding tendency
TW452584B (en) * 1997-10-03 2001-09-01 Hitachi Chemical Co Ltd Epoxy resin composition and semiconductor devices using it as encapsulant
KR100307509B1 (ko) * 1998-07-21 2001-11-30 김충섭 세라믹 함유 탄소/탄소 복합재료 및 그의 제조 방법
TW415952B (en) * 1998-12-14 2000-12-21 Chung Shan Inst Of Science A modifier and a method for improving the flexibility of a cured epoxy resin
JP2000248182A (ja) * 1999-03-02 2000-09-12 Dow Corning Toray Silicone Co Ltd 樹脂用添加剤、硬化性樹脂組成物、および硬化樹脂
WO2001046290A1 (en) 1999-12-20 2001-06-28 3M Innovative Properties Company Ambient-temperature-stable, one-part curable epoxy adhesive
DE10051051A1 (de) * 2000-10-14 2002-04-18 Bosch Gmbh Robert Silikonmodifizierte Einkomponentenvergußmasse
US20020167804A1 (en) * 2001-05-14 2002-11-14 Intel Corporation Polymeric encapsulation material with fibrous filler for use in microelectronic circuit packaging
US6565976B1 (en) 2001-08-06 2003-05-20 Georgia-Pacific Resins, Inc. High strength pultrusion resin
DE10204890A1 (de) * 2002-02-06 2003-08-14 Roehm Gmbh Schlagzähe Formmasse und Formkörper
US7438958B2 (en) * 2002-11-01 2008-10-21 Mitsui Chemicals, Inc. Sealant composition for liquid crystal and process for producing liquid-crystal display panel with the same
EP1661174A1 (en) 2003-08-08 2006-05-31 Dow Corning Corporation Process for fabricating electronic components using liquid injection molding
US7846998B2 (en) * 2004-03-03 2010-12-07 Hitachi Chemical Co., Ltd. Sealant epoxy-resin molding material, and electronic component device
JP4682796B2 (ja) * 2005-04-19 2011-05-11 日立化成工業株式会社 封止用シート
KR100708993B1 (ko) * 2005-06-07 2007-04-18 주식회사 엘지화학 다층구조의 고분자 활제 및 그의 제조방법
JP2007146148A (ja) * 2005-10-27 2007-06-14 Hitachi Chem Co Ltd 封止用エポキシ樹脂組成物及びそれを用いた電子部品装置
JP2007146150A (ja) * 2005-11-02 2007-06-14 Hitachi Chem Co Ltd 封止用エポキシ樹脂組成物及びそれを用いた電子部品装置
JP5504550B2 (ja) * 2006-01-23 2014-05-28 日立化成株式会社 封止用エポキシ樹脂成形材料及び電子部品装置
JP5207591B2 (ja) * 2006-02-23 2013-06-12 東レ・ダウコーニング株式会社 半導体装置の製造方法および半導体装置
JP5374818B2 (ja) * 2006-12-20 2013-12-25 日立化成株式会社 封止用液状エポキシ樹脂組成物、電子部品装置及びウエハーレベルチップサイズパッケージ
US20100096173A1 (en) * 2007-02-23 2010-04-22 Kentaro Fujino Epoxy resin composition, prepreg, and laminate and printed wiring board
WO2008151986A1 (en) * 2007-06-14 2008-12-18 Basf Se Flame retardant compositions
KR20100048996A (ko) * 2007-06-15 2010-05-11 세키스이가가쿠 고교가부시키가이샤 광 반도체 소자용 밀봉제 및 광 반도체 소자
JP2009073933A (ja) * 2007-09-20 2009-04-09 Toto Kasei Co Ltd 耐熱劣化性を有するエポキシ樹脂組成物
EP2352065A1 (en) * 2008-11-07 2011-08-03 Sumitomo Bakelite Co., Ltd. Photosensitive resin composition, photosensitive adhesive film, and light-receiving device
WO2011005925A1 (en) * 2009-07-10 2011-01-13 Dow Global Technologies Inc. Core/shell rubbers for use in electrical laminate compositions
US8768628B2 (en) * 2010-10-20 2014-07-01 Shawket Ghedan Rise in core wettability characterization method
US9067484B2 (en) * 2013-10-23 2015-06-30 Dezhou David Zhao Electric vehicle control systems
CN105874014B (zh) * 2013-12-20 2018-05-25 巴斯夫涂料有限公司 制备颜料糊的方法、水性电泳涂料、其用途、阳离子电泳涂覆方法和经涂覆的制品
JP6264250B2 (ja) * 2014-09-30 2018-01-24 信越化学工業株式会社 合成樹脂組成物に配合するシリコーンゴム粒子の製造方法
JP6571585B2 (ja) * 2015-06-08 2019-09-04 信越化学工業株式会社 半導体装置、積層型半導体装置、封止後積層型半導体装置、及びこれらの製造方法
JP6733740B2 (ja) * 2016-10-31 2020-08-05 日立化成株式会社 中間膜用樹脂組成物、中間膜用フィルム材及び合わせガラスの製造方法
US11753562B2 (en) 2018-01-03 2023-09-12 Sika Technology Ag Epoxy resin composition for coating purposes
CN117089005B (zh) * 2023-08-21 2024-06-21 天津大学 一种超低介电共聚物及其制备方法和应用

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61185527A (ja) 1985-02-13 1986-08-19 Toray Silicone Co Ltd 硬化性エポキシ樹脂組成物
JPS6293962A (ja) * 1985-10-18 1987-04-30 Nitto Electric Ind Co Ltd 半導体装置
JPS62147749A (ja) 1985-12-20 1987-07-01 Nitto Electric Ind Co Ltd 半導体装置
JPS62214650A (ja) * 1986-03-14 1987-09-21 Nitto Electric Ind Co Ltd 半導体装置
JPH06841B2 (ja) 1988-04-25 1994-01-05 日立化成工業株式会社 電子部品封止用エポキシ樹脂成形材料
DE68917858T2 (de) * 1988-10-31 1995-02-02 Japan Synthetic Rubber Co Ltd Thermoplastisches Harz aus der Serie von Polyorganosiloxanen und die Zusammensetzungen davon.
US4962165A (en) * 1989-01-12 1990-10-09 Rohm And Haas Company Process for making silicone particles
CA2010331A1 (en) * 1989-03-02 1990-09-02 James O. Peterson Low stress epoxy encapsulant compositions
JPH0597970A (ja) * 1991-10-07 1993-04-20 Shin Etsu Chem Co Ltd 熱硬化性樹脂組成物及び半導体装置
JPH05175369A (ja) 1991-12-24 1993-07-13 Hitachi Chem Co Ltd 電子部品封止用エポキシ樹脂成形材料
US5319005A (en) * 1992-01-27 1994-06-07 Hitachi Chemical Co., Ltd. Epoxy resin molding material for sealing of electronic component
JP2669247B2 (ja) * 1992-02-13 1997-10-27 信越化学工業株式会社 熱硬化性樹脂組成物

Also Published As

Publication number Publication date
KR960014242A (ko) 1996-05-22
DE69501771D1 (de) 1998-04-16
EP0707042B1 (en) 1998-03-11
MY113317A (en) 2002-01-31
EP0707042A1 (en) 1996-04-17
CN1120051A (zh) 1996-04-10
MY115938A (en) 2003-09-30
US5962139A (en) 1999-10-05
CN1065259C (zh) 2001-05-02
TW376402B (en) 1999-12-11
JPH08134179A (ja) 1996-05-28
KR0169828B1 (ko) 1999-03-20
US5739217A (en) 1998-04-14
DE69501771T2 (de) 1998-07-02
JP3288185B2 (ja) 2002-06-04

Similar Documents

Publication Publication Date Title
SG42780A1 (en) Epoxy resin molding material for sealing electronic parts and sealed semiconductor device usin the same
SG87012A1 (en) Epoxy resin composition and semiconductor device using the same
EP0658935A3 (en) Semiconductor device of the resin encapsulation type and manufacturing method.
HK1013888A1 (en) Resin sealing type semiconductor device and method of making the same
KR950012657B1 (en) Resin sealed semiconductor integrated circuit
TW338559U (en) Resin package type semiconductor device
HK1027827A1 (en) Semiconductor sealing resin composition semiconductor device sealed with the same and process for preparing semiconductor device
SG45124A1 (en) Resin sealing type semiconductor device and method of making the same
HK106297A (en) Method of encapsulating a semiconductor element in resin or sealing it therewith and a mould therefor
DE69427995D1 (de) Im Harz versiegelte Halbleitervorrichtung
DE69323025D1 (de) In Harz versiegeltes Halbleiterbauelement
SG70032A1 (en) Polyphenylene sulfide resin composition and resin-encapsulated semiconductor device
EP0479127A3 (en) Semiconductor device sealed with mold resin
SG60109A1 (en) Epoxy resin composition and semiconductor device encapsulated therewith
SG96163A1 (en) Resin sealing/molding apparatus sealing electronic parts
SG41939A1 (en) Epoxy resin composition for semiconductor encapsulation
HK1013734A1 (en) Resin sealing type semiconductor device and method of making the same
SG38933A1 (en) Resin sealing type semiconductor device and method of making the same
SG47837A1 (en) Resin tablet for sealing semiconductor
SG73590A1 (en) Latent catalyst thermosetting resin composition comprising the catalyst epoxy resin molding material comprising the catalyst and semiconductor device
EP0428871A3 (en) Epoxy resin composition for semiconductor sealing
GB2291426B (en) Epoxy resin composition process for producing the same and resin-sealed semiconductor device
DE69417329D1 (de) In Harz versiegelte Halbleiteranordnung
EP0369652A3 (en) Electronic device sealing resin compositions and sealed electronic devices
EP0439171A3 (en) Epoxy resin composition and semiconductor device encapsulated therewith