SG2014008718A - Wafer-level fabrication of optical devices. in particular of modules for computational cameras - Google Patents

Wafer-level fabrication of optical devices. in particular of modules for computational cameras

Info

Publication number
SG2014008718A
SG2014008718A SG2014008718A SG2014008718A SG2014008718A SG 2014008718 A SG2014008718 A SG 2014008718A SG 2014008718 A SG2014008718 A SG 2014008718A SG 2014008718 A SG2014008718 A SG 2014008718A SG 2014008718 A SG2014008718 A SG 2014008718A
Authority
SG
Singapore
Prior art keywords
wafer
modules
optical devices
level fabrication
computational cameras
Prior art date
Application number
SG2014008718A
Other languages
English (en)
Inventor
Hartmut Rudmann
Matthias Maluck
Alexander Bietsch
Peter Roentgen
Stephan Heimgartner
Original Assignee
Heptagon Micro Optics Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heptagon Micro Optics Pte Ltd filed Critical Heptagon Micro Optics Pte Ltd
Publication of SG2014008718A publication Critical patent/SG2014008718A/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49718—Repairing
    • Y10T29/49748—Repairing by shaping, e.g., bending, extruding, turning, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Lens Barrels (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Studio Devices (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
SG2014008718A 2011-08-25 2012-08-24 Wafer-level fabrication of optical devices. in particular of modules for computational cameras SG2014008718A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161527355P 2011-08-25 2011-08-25
PCT/CH2012/000200 WO2013026174A2 (en) 2011-08-25 2012-08-24 Wafer-level fabrication of optical devices. in particular of modules for computational cameras

Publications (1)

Publication Number Publication Date
SG2014008718A true SG2014008718A (en) 2014-04-28

Family

ID=46969906

Family Applications (4)

Application Number Title Priority Date Filing Date
SG2014008718A SG2014008718A (en) 2011-08-25 2012-08-24 Wafer-level fabrication of optical devices. in particular of modules for computational cameras
SG10201606884TA SG10201606884TA (en) 2011-08-25 2012-08-24 Wafer-level fabrication of optical devices with front focal length correction
SG10201606882XA SG10201606882XA (en) 2011-08-25 2012-08-24 Wafer-level fabrication of optical devices, in particular of modules for computational cameras
SG2014008726A SG2014008726A (en) 2011-08-25 2012-08-24 Wafer-level fabrication of optical devices with front focal length correction

Family Applications After (3)

Application Number Title Priority Date Filing Date
SG10201606884TA SG10201606884TA (en) 2011-08-25 2012-08-24 Wafer-level fabrication of optical devices with front focal length correction
SG10201606882XA SG10201606882XA (en) 2011-08-25 2012-08-24 Wafer-level fabrication of optical devices, in particular of modules for computational cameras
SG2014008726A SG2014008726A (en) 2011-08-25 2012-08-24 Wafer-level fabrication of optical devices with front focal length correction

Country Status (8)

Country Link
US (2) US20140307081A1 (enExample)
EP (2) EP2748854B1 (enExample)
JP (2) JP6223975B2 (enExample)
KR (2) KR101966480B1 (enExample)
CN (2) CN103890949B (enExample)
SG (4) SG2014008718A (enExample)
TW (3) TWI620310B (enExample)
WO (2) WO2013026175A1 (enExample)

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WO2016182152A1 (ko) * 2015-05-12 2016-11-17 삼성전자 주식회사 샘플값 보상을 위한 영상 부호화 방법과 그 장치, 및 샘플값 보상을 위한 영상 복호화 방법과 그 장치
WO2016191142A2 (en) 2015-05-27 2016-12-01 Verily Life Sciences Llc Nanophotonic hyperspectral/lightfield superpixel imager
JP6619174B2 (ja) * 2015-07-31 2019-12-11 ソニーセミコンダクタソリューションズ株式会社 製造装置および方法
US10475830B2 (en) 2015-08-06 2019-11-12 Ams Sensors Singapore Pte. Ltd. Optical modules including customizable spacers for focal length adjustment and/or reduction of tilt, and fabrication of the optical modules
DE102015215833A1 (de) 2015-08-19 2017-02-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Multiaperturabbildungsvorrichtung mit Optiksubstrat
CN108700721B (zh) 2015-11-12 2021-12-31 赫普塔冈微光有限公司 光学元件堆叠组件
KR20170073910A (ko) 2015-12-21 2017-06-29 에스케이하이닉스 주식회사 라이트 필드 이미징 장치 및 그 제조방법
DE102016200285A1 (de) * 2016-01-13 2017-07-13 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Multiaperturabbildungsvorrichtung, Abbildungssystem und Verfahren zum Erfassen eines Objektbereichs
CN108941932A (zh) * 2017-05-23 2018-12-07 东莞东阳光科研发有限公司 人工晶体制备方法
US10677964B2 (en) * 2017-10-23 2020-06-09 Omnivision Technologies, Inc. Lens wafer assembly and associated method for manufacturing a stepped spacer wafer
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WO2021153629A1 (ja) 2020-01-30 2021-08-05 古河電気工業株式会社 光モジュールおよび光学装置
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Also Published As

Publication number Publication date
JP6282225B2 (ja) 2018-02-21
TW201724487A (zh) 2017-07-01
US10444477B2 (en) 2019-10-15
SG2014008726A (en) 2014-04-28
EP2748853A2 (en) 2014-07-02
EP2748854B1 (en) 2021-06-02
TW201316497A (zh) 2013-04-16
TWI620310B (zh) 2018-04-01
CN103890949B (zh) 2017-10-03
TW201327790A (zh) 2013-07-01
US20140299587A1 (en) 2014-10-09
SG10201606882XA (en) 2016-10-28
KR101966480B1 (ko) 2019-04-05
CN103890948B (zh) 2017-12-01
CN103890948A (zh) 2014-06-25
JP2014524597A (ja) 2014-09-22
EP2748854A1 (en) 2014-07-02
WO2013026175A1 (en) 2013-02-28
US20140307081A1 (en) 2014-10-16
KR102056501B1 (ko) 2019-12-16
CN103890949A (zh) 2014-06-25
EP2748853B1 (en) 2023-10-11
TWI582969B (zh) 2017-05-11
JP2014526067A (ja) 2014-10-02
WO2013026174A2 (en) 2013-02-28
KR20140068984A (ko) 2014-06-09
TWI567956B (zh) 2017-01-21
SG10201606884TA (en) 2016-10-28
WO2013026174A3 (en) 2013-04-11
KR20140054280A (ko) 2014-05-08
JP6223975B2 (ja) 2017-11-01

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