SG11201403103PA - Optical devices and opto-electronic modules and methods for manufacturing the same - Google Patents

Optical devices and opto-electronic modules and methods for manufacturing the same

Info

Publication number
SG11201403103PA
SG11201403103PA SG11201403103PA SG11201403103PA SG11201403103PA SG 11201403103P A SG11201403103P A SG 11201403103PA SG 11201403103P A SG11201403103P A SG 11201403103PA SG 11201403103P A SG11201403103P A SG 11201403103PA SG 11201403103P A SG11201403103P A SG 11201403103PA
Authority
SG
Singapore
Prior art keywords
opto
manufacturing
methods
same
optical devices
Prior art date
Application number
SG11201403103PA
Inventor
Markus Rossi
Hartmut Rudmann
Stephan Heimgartner
Alexander Bietsch
Robert Lenart
Original Assignee
Heptagon Micro Optics Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heptagon Micro Optics Pte Ltd filed Critical Heptagon Micro Optics Pte Ltd
Publication of SG11201403103PA publication Critical patent/SG11201403103PA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00278—Lenticular sheets
    • B29D11/00307—Producing lens wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14623—Optical shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685—Process for coatings or optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14687—Wafer level processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/1469—Assemblies, i.e. hybrid integration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/148—Charge coupled imagers
    • H01L27/14806—Structural or functional details thereof
    • H01L27/14812—Special geometry or disposition of pixel-elements, address lines or gate-electrodes
    • H01L27/14818—Optical shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
SG11201403103PA 2011-12-21 2012-12-18 Optical devices and opto-electronic modules and methods for manufacturing the same SG11201403103PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161578538P 2011-12-21 2011-12-21
PCT/EP2012/005224 WO2013091830A1 (en) 2011-12-21 2012-12-18 Optical devices and opto-electronic modules and methods for manufacturing the same

Publications (1)

Publication Number Publication Date
SG11201403103PA true SG11201403103PA (en) 2014-07-30

Family

ID=47557009

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201605020WA SG10201605020WA (en) 2011-12-21 2012-12-18 Optical devices and opto-electronic modules and methods for manufacturing the same
SG11201403103PA SG11201403103PA (en) 2011-12-21 2012-12-18 Optical devices and opto-electronic modules and methods for manufacturing the same

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG10201605020WA SG10201605020WA (en) 2011-12-21 2012-12-18 Optical devices and opto-electronic modules and methods for manufacturing the same

Country Status (5)

Country Link
US (2) US9490287B2 (en)
CN (3) CN107403815B (en)
SG (2) SG10201605020WA (en)
TW (1) TW201340302A (en)
WO (1) WO2013091830A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10317667B2 (en) * 2015-07-04 2019-06-11 The Regents Of The University Of California Compressive plenoptic microscopy for functional brain imaging
TWI718260B (en) * 2016-02-22 2021-02-11 新加坡商新加坡恒立私人有限公司 Thin optoelectronic modules with apertures and their manufacture
US10217789B2 (en) * 2016-04-06 2019-02-26 Omnivision Technologies, Inc. Interposer and chip-scale packaging for wafer-level camera
CN112714692B (en) * 2018-09-17 2023-08-11 ams传感器新加坡私人有限公司 Optical light guide and method of making an optical light guide
CN110534538A (en) * 2019-09-03 2019-12-03 豪威光电子科技（上海）有限公司 Lens module and forming method thereof

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4425501A (en) * 1981-03-30 1984-01-10 Honeywell Inc. Light aperture for a lenslet-photodetector array
EP0285796B1 (en) * 1987-03-02 1993-06-16 Honeywell Inc. Optical range finding system
US4882262A (en) * 1987-09-28 1989-11-21 Honeywell Inc. Self-aligning aperture
US4952026A (en) 1988-10-14 1990-08-28 Corning Incorporated Integral optical element and method
US6635941B2 (en) * 2001-03-21 2003-10-21 Canon Kabushiki Kaisha Structure of semiconductor device with improved reliability
EP1357514B1 (en) 2002-04-23 2008-07-16 STMicroelectronics S.r.l. Method for obtaining a high-resolution digital image
US8049806B2 (en) * 2004-09-27 2011-11-01 Digitaloptics Corporation East Thin camera and associated methods
WO2006109638A1 (en) * 2005-04-08 2006-10-19 Konica Minolta Opto, Inc. Solid-state image pickup element and method for manufacturing same
JP2007287818A (en) * 2006-04-14 2007-11-01 Matsushita Electric Ind Co Ltd Solid imaging device and its manufacturing method
EP2087518A2 (en) * 2006-11-17 2009-08-12 Tessera North America Internal noise reducing structures in camera systems employing an optics stack and associated methods
WO2009076787A1 (en) 2007-12-19 2009-06-25 Heptagon Oy Optical module for a camera device, baffle substrate, wafer scale package, and manufacturing methods therefor
TWI505703B (en) * 2007-12-19 2015-10-21 Heptagon Micro Optics Pte Ltd Optical module, wafer scale package, and method for manufacturing those
CN102037717B (en) 2008-05-20 2013-11-06 派力肯成像公司 Capturing and processing of images using monolithic camera array with hetergeneous imagers
KR101672737B1 (en) * 2010-01-21 2016-11-04 삼성전자 주식회사 Image sensor and imaging device comprising the sensor

Also Published As

Publication number Publication date
CN107403815B (en) 2020-11-20
CN107634073A (en) 2018-01-26
CN104106138B (en) 2017-08-15
US20140339664A1 (en) 2014-11-20
WO2013091830A1 (en) 2013-06-27
US10236314B2 (en) 2019-03-19
US20170077162A1 (en) 2017-03-16
CN107403815A (en) 2017-11-28
SG10201605020WA (en) 2016-08-30
TW201340302A (en) 2013-10-01
CN104106138A (en) 2014-10-15
US9490287B2 (en) 2016-11-08

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