CN103890949B - 光学器件、特别是用于计算式摄像机的模块的晶片级制造 - Google Patents

光学器件、特别是用于计算式摄像机的模块的晶片级制造 Download PDF

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Publication number
CN103890949B
CN103890949B CN201280052516.XA CN201280052516A CN103890949B CN 103890949 B CN103890949 B CN 103890949B CN 201280052516 A CN201280052516 A CN 201280052516A CN 103890949 B CN103890949 B CN 103890949B
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China
Prior art keywords
optical
wafer
insulating element
different
optical component
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Chinese (zh)
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CN103890949A (zh
Inventor
H.鲁德曼恩
M.马鲁克
A.比伊特施
P.罗恩特根
S.海姆加特纳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ames Osram Asia Pacific Pte Ltd
Sensors Singapore Private Ltd
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Heptagon Micro Optics Pte Ltd
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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49718—Repairing
    • Y10T29/49748—Repairing by shaping, e.g., bending, extruding, turning, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Lens Barrels (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Studio Devices (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
CN201280052516.XA 2011-08-25 2012-08-24 光学器件、特别是用于计算式摄像机的模块的晶片级制造 Active CN103890949B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201161527355P 2011-08-25 2011-08-25
US61/527355 2011-08-25
US61/527,355 2011-08-25
PCT/CH2012/000200 WO2013026174A2 (en) 2011-08-25 2012-08-24 Wafer-level fabrication of optical devices. in particular of modules for computational cameras

Publications (2)

Publication Number Publication Date
CN103890949A CN103890949A (zh) 2014-06-25
CN103890949B true CN103890949B (zh) 2017-10-03

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CN201280052516.XA Active CN103890949B (zh) 2011-08-25 2012-08-24 光学器件、特别是用于计算式摄像机的模块的晶片级制造
CN201280052514.0A Active CN103890948B (zh) 2011-08-25 2012-08-24 具有前焦距校正的光学器件的晶片级制造

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Country Status (8)

Country Link
US (2) US20140307081A1 (enExample)
EP (2) EP2748854B1 (enExample)
JP (2) JP6223975B2 (enExample)
KR (2) KR101966480B1 (enExample)
CN (2) CN103890949B (enExample)
SG (4) SG2014008718A (enExample)
TW (3) TWI620310B (enExample)
WO (2) WO2013026175A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130122247A1 (en) * 2011-11-10 2013-05-16 Omnivision Technologies, Inc. Spacer Wafer For Wafer-Level Camera And Method For Manufacturing Same
US9595553B2 (en) 2012-11-02 2017-03-14 Heptagon Micro Optics Pte. Ltd. Optical modules including focal length adjustment and fabrication of the optical modules
WO2015076750A1 (en) * 2013-11-22 2015-05-28 Heptagon Micro Optics Pte. Ltd. Compact optoelectronic modules
WO2015119571A1 (en) * 2014-02-07 2015-08-13 Heptagon Micro Optics Pte. Ltd. Stacks of arrays of beam shaping elements including stacking, self-alignment and/or self-centering features
US9887221B2 (en) 2014-02-18 2018-02-06 Heptagon Micro Optics Pte. Ltd. Optical modules including customizable spacers for focal length adjustment and/or reduction of tilt, and fabrication of the optical modules
WO2015191001A1 (en) 2014-06-10 2015-12-17 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules including hybrid arrangements of beam shaping elements, and imaging devices incorporating the same
US9711552B2 (en) * 2014-08-19 2017-07-18 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules having a silicon substrate, and fabrication methods for such modules
US9507143B2 (en) 2014-09-19 2016-11-29 Intel Corporation Compact illumination system
CN106817910B (zh) 2014-10-14 2019-12-13 赫普塔冈微光有限公司 光学元件堆叠组件
US20160307881A1 (en) * 2015-04-20 2016-10-20 Advanced Semiconductor Engineering, Inc. Optical sensor module and method for manufacturing the same
WO2016182152A1 (ko) * 2015-05-12 2016-11-17 삼성전자 주식회사 샘플값 보상을 위한 영상 부호화 방법과 그 장치, 및 샘플값 보상을 위한 영상 복호화 방법과 그 장치
WO2016191142A2 (en) 2015-05-27 2016-12-01 Verily Life Sciences Llc Nanophotonic hyperspectral/lightfield superpixel imager
JP6619174B2 (ja) * 2015-07-31 2019-12-11 ソニーセミコンダクタソリューションズ株式会社 製造装置および方法
US10475830B2 (en) 2015-08-06 2019-11-12 Ams Sensors Singapore Pte. Ltd. Optical modules including customizable spacers for focal length adjustment and/or reduction of tilt, and fabrication of the optical modules
DE102015215833A1 (de) 2015-08-19 2017-02-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Multiaperturabbildungsvorrichtung mit Optiksubstrat
CN108700721B (zh) 2015-11-12 2021-12-31 赫普塔冈微光有限公司 光学元件堆叠组件
KR20170073910A (ko) 2015-12-21 2017-06-29 에스케이하이닉스 주식회사 라이트 필드 이미징 장치 및 그 제조방법
DE102016200285A1 (de) * 2016-01-13 2017-07-13 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Multiaperturabbildungsvorrichtung, Abbildungssystem und Verfahren zum Erfassen eines Objektbereichs
CN108941932A (zh) * 2017-05-23 2018-12-07 东莞东阳光科研发有限公司 人工晶体制备方法
US10677964B2 (en) * 2017-10-23 2020-06-09 Omnivision Technologies, Inc. Lens wafer assembly and associated method for manufacturing a stepped spacer wafer
CN113366359B (zh) 2019-03-12 2022-11-15 奥林巴斯株式会社 内窥镜用摄像装置及内窥镜
WO2021153629A1 (ja) 2020-01-30 2021-08-05 古河電気工業株式会社 光モジュールおよび光学装置
US11664399B2 (en) * 2021-02-01 2023-05-30 Visera Technologies Company Limited Solid-state image sensor

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040165823A1 (en) * 2001-02-09 2004-08-26 Morris James E. Compensation and/or variation of wafer level produced lenses and resultant structures

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5232549A (en) * 1992-04-14 1993-08-03 Micron Technology, Inc. Spacers for field emission display fabricated via self-aligned high energy ablation
DE10058305A1 (de) * 2000-11-24 2002-06-06 Wacker Siltronic Halbleitermat Verfahren zur Oberflächenpolitur von Siliciumscheiben
CN100440544C (zh) * 2002-09-17 2008-12-03 安特约恩股份有限公司 照相装置、制造照相装置的方法以及晶片尺度的封装
DE102005002545A1 (de) 2005-01-19 2006-07-20 Airbus Deutschland Gmbh Energiepuffereinrichtung für ein Flugzeug
US8053705B2 (en) * 2005-09-07 2011-11-08 Purdue Research Foundation Laser assisted machining process with distributed lasers
JP2007110588A (ja) * 2005-10-17 2007-04-26 Funai Electric Co Ltd 複眼撮像装置
CN101009779B (zh) 2006-01-24 2010-06-16 采钰科技股份有限公司 高精密度成像控制的影像感应模块
US7721564B2 (en) 2006-11-21 2010-05-25 B/E Aerospace, Inc. Wild frequency avionic refrigeration system and controller therefor
US7692256B2 (en) * 2007-03-23 2010-04-06 Heptagon Oy Method of producing a wafer scale package
US7812869B2 (en) * 2007-05-11 2010-10-12 Aptina Imaging Corporation Configurable pixel array system and method
US20110031510A1 (en) * 2007-11-27 2011-02-10 Heptagon Oy Encapsulated lens stack
US20090159200A1 (en) * 2007-12-19 2009-06-25 Heptagon Oy Spacer element and method for manufacturing a spacer element
WO2009076787A1 (en) 2007-12-19 2009-06-25 Heptagon Oy Optical module for a camera device, baffle substrate, wafer scale package, and manufacturing methods therefor
TWI478808B (zh) * 2007-12-19 2015-04-01 Heptagon Micro Optics Pte Ltd 製造光學元件的方法
US8319301B2 (en) * 2008-02-11 2012-11-27 Omnivision Technologies, Inc. Self-aligned filter for an image sensor
WO2009120346A1 (en) * 2008-03-27 2009-10-01 Tessera North America, Inc. Optical device including at least one replicated surface and associated methods
WO2010074743A1 (en) * 2008-12-22 2010-07-01 Tessera North America, Inc. Focus compensation for thin cameras
WO2010108041A1 (en) 2009-03-18 2010-09-23 Artificial Muscle, Inc. Wafer level optical system
JP2011018974A (ja) * 2009-07-07 2011-01-27 Renesas Electronics Corp Ｄ／ａコンバータ
US8193599B2 (en) * 2009-09-02 2012-06-05 Himax Semiconductor, Inc. Fabricating method and structure of a wafer level module
US8059341B2 (en) * 2009-09-23 2011-11-15 Visera Technologies Company Limited Lens assembly and method for forming the same
US8848301B2 (en) 2009-10-20 2014-09-30 Flir Systems Trading Belgium Bvba Focus compensation for optical elements and applications thereof
US8885257B2 (en) * 2009-10-20 2014-11-11 Flir Systems Trading Belgium Bvba Focus compensation for optical elements and applications thereof
WO2011063347A2 (en) 2009-11-20 2011-05-26 Pelican Imaging Corporation Capturing and processing of images using monolithic camera array with heterogeneous imagers
US9485397B2 (en) 2010-06-14 2016-11-01 Heptagon Micro Optics Pte. Ltd. Camera, and method of manufacturing a plurality of cameras

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040165823A1 (en) * 2001-02-09 2004-08-26 Morris James E. Compensation and/or variation of wafer level produced lenses and resultant structures

Also Published As

Publication number Publication date
JP6282225B2 (ja) 2018-02-21
TW201724487A (zh) 2017-07-01
US10444477B2 (en) 2019-10-15
SG2014008726A (en) 2014-04-28
EP2748853A2 (en) 2014-07-02
EP2748854B1 (en) 2021-06-02
TW201316497A (zh) 2013-04-16
TWI620310B (zh) 2018-04-01
TW201327790A (zh) 2013-07-01
US20140299587A1 (en) 2014-10-09
SG10201606882XA (en) 2016-10-28
KR101966480B1 (ko) 2019-04-05
CN103890948B (zh) 2017-12-01
CN103890948A (zh) 2014-06-25
JP2014524597A (ja) 2014-09-22
SG2014008718A (en) 2014-04-28
EP2748854A1 (en) 2014-07-02
WO2013026175A1 (en) 2013-02-28
US20140307081A1 (en) 2014-10-16
KR102056501B1 (ko) 2019-12-16
CN103890949A (zh) 2014-06-25
EP2748853B1 (en) 2023-10-11
TWI582969B (zh) 2017-05-11
JP2014526067A (ja) 2014-10-02
WO2013026174A2 (en) 2013-02-28
KR20140068984A (ko) 2014-06-09
TWI567956B (zh) 2017-01-21
SG10201606884TA (en) 2016-10-28
WO2013026174A3 (en) 2013-04-11
KR20140054280A (ko) 2014-05-08
JP6223975B2 (ja) 2017-11-01

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