JP6223975B2 - 光学装置の、特にコンピュテーショナルカメラ用モジュールのウェハレベルの製作 - Google Patents

光学装置の、特にコンピュテーショナルカメラ用モジュールのウェハレベルの製作 Download PDF

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Publication number
JP6223975B2
JP6223975B2 JP2014526351A JP2014526351A JP6223975B2 JP 6223975 B2 JP6223975 B2 JP 6223975B2 JP 2014526351 A JP2014526351 A JP 2014526351A JP 2014526351 A JP2014526351 A JP 2014526351A JP 6223975 B2 JP6223975 B2 JP 6223975B2
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optical
spacer
wafer
members
processing step
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JP2014526351A
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Japanese (ja)
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JP2014526067A (ja
JP2014526067A5 (enExample
Inventor
ラドマン，ハルトムート
マルック，マティアス
ビーチ，アレクサンダー
レントゲン，ペーター
ハイムガルトナー，シュテファン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Sensors Singapore Pte Ltd
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Heptagon Micro Optics Pte Ltd
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49718—Repairing
    • Y10T29/49748—Repairing by shaping, e.g., bending, extruding, turning, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Lens Barrels (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Studio Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Optical Couplings Of Light Guides (AREA)
JP2014526351A 2011-08-25 2012-08-24 光学装置の、特にコンピュテーショナルカメラ用モジュールのウェハレベルの製作 Active JP6223975B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161527355P 2011-08-25 2011-08-25
US61/527,355 2011-08-25
PCT/CH2012/000200 WO2013026174A2 (en) 2011-08-25 2012-08-24 Wafer-level fabrication of optical devices. in particular of modules for computational cameras

Publications (3)

Publication Number Publication Date
JP2014526067A JP2014526067A (ja) 2014-10-02
JP2014526067A5 JP2014526067A5 (enExample) 2015-10-15
JP6223975B2 true JP6223975B2 (ja) 2017-11-01

Family

ID=46969906

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2014526351A Active JP6223975B2 (ja) 2011-08-25 2012-08-24 光学装置の、特にコンピュテーショナルカメラ用モジュールのウェハレベルの製作
JP2014526352A Active JP6282225B2 (ja) 2011-08-25 2012-08-24 前方焦点距離訂正を有する光学装置のウェハレベルの製作

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2014526352A Active JP6282225B2 (ja) 2011-08-25 2012-08-24 前方焦点距離訂正を有する光学装置のウェハレベルの製作

Country Status (8)

Country Link
US (2) US10444477B2 (enExample)
EP (2) EP2748853B1 (enExample)
JP (2) JP6223975B2 (enExample)
KR (2) KR101966480B1 (enExample)
CN (2) CN103890949B (enExample)
SG (4) SG10201606882XA (enExample)
TW (3) TWI620310B (enExample)
WO (2) WO2013026174A2 (enExample)

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WO2015126328A1 (en) * 2014-02-18 2015-08-27 Heptagon Micro Optics Pte. Ltd. Optical modules including customizable spacers for focal length adjustment and/or reduction of tilt, and fabrication of the optical modules
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US9711552B2 (en) * 2014-08-19 2017-07-18 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules having a silicon substrate, and fabrication methods for such modules
US9507143B2 (en) 2014-09-19 2016-11-29 Intel Corporation Compact illumination system
EP3207416B1 (en) 2014-10-14 2020-02-26 Heptagon Micro Optics Pte. Ltd. Optical element stack assemblies
US20160307881A1 (en) * 2015-04-20 2016-10-20 Advanced Semiconductor Engineering, Inc. Optical sensor module and method for manufacturing the same
WO2016182152A1 (ko) 2015-05-12 2016-11-17 삼성전자 주식회사 샘플값 보상을 위한 영상 부호화 방법과 그 장치, 및 샘플값 보상을 위한 영상 복호화 방법과 그 장치
WO2016191142A2 (en) * 2015-05-27 2016-12-01 Verily Life Sciences Llc Nanophotonic hyperspectral/lightfield superpixel imager
JP6619174B2 (ja) * 2015-07-31 2019-12-11 ソニーセミコンダクタソリューションズ株式会社 製造装置および方法
WO2017023211A1 (en) * 2015-08-06 2017-02-09 Heptagon Micro Optics Pte. Ltd. Optical modules including customizable spacers for focal length adjustment and/or reduction of tilt, and fabrication of the optical modules
DE102015215833A1 (de) * 2015-08-19 2017-02-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Multiaperturabbildungsvorrichtung mit Optiksubstrat
US10877239B2 (en) 2015-11-12 2020-12-29 Ams Sensors Singapore Pte. Ltd. Optical element stack assemblies
KR20170073910A (ko) 2015-12-21 2017-06-29 에스케이하이닉스 주식회사 라이트 필드 이미징 장치 및 그 제조방법
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Also Published As

Publication number Publication date
EP2748853B1 (en) 2023-10-11
SG10201606884TA (en) 2016-10-28
KR102056501B1 (ko) 2019-12-16
EP2748854B1 (en) 2021-06-02
JP2014526067A (ja) 2014-10-02
TW201316497A (zh) 2013-04-16
TWI567956B (zh) 2017-01-21
WO2013026175A1 (en) 2013-02-28
TWI620310B (zh) 2018-04-01
EP2748854A1 (en) 2014-07-02
KR101966480B1 (ko) 2019-04-05
KR20140054280A (ko) 2014-05-08
US20140299587A1 (en) 2014-10-09
KR20140068984A (ko) 2014-06-09
SG10201606882XA (en) 2016-10-28
WO2013026174A2 (en) 2013-02-28
WO2013026174A3 (en) 2013-04-11
US10444477B2 (en) 2019-10-15
JP2014524597A (ja) 2014-09-22
CN103890949B (zh) 2017-10-03
JP6282225B2 (ja) 2018-02-21
SG2014008718A (en) 2014-04-28
TW201327790A (zh) 2013-07-01
TWI582969B (zh) 2017-05-11
CN103890949A (zh) 2014-06-25
US20140307081A1 (en) 2014-10-16
SG2014008726A (en) 2014-04-28
TW201724487A (zh) 2017-07-01
CN103890948B (zh) 2017-12-01
EP2748853A2 (en) 2014-07-02
CN103890948A (zh) 2014-06-25

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